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Semiconductor device

  • US 6,700,194 B2
  • Filed: 03/29/2002
  • Issued: 03/02/2004
  • Est. Priority Date: 06/19/2001
  • Status: Expired due to Term
First Claim
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1. A semiconductor device comprising:

  • a radiation substrate;

    semiconductor elements provided on said radiation substrate;

    a plurality of main electrode plates;

    a resin package configured to seal said radiation substrate, said semiconductor elements, and said plurality of main electrode plates in a resin;

    a first main electrode plate of said plurality of main electrode plates having one end electrically connected to a main electrode of the semiconductor elements and having another end exposed to an outside of an upper surface of said resin package; and

    a second main electrode plate of said plurality of main electrode plates having one end electrically connected to said radiation substrate and having another end exposed to said outside of the upper surface of said resin package, wherein said resin package is integrally formed by a molding technique.

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