Scalable, modular architecture for automotive power distribution and body control functions

• US 6,700,795 B1
• Filed: 01/23/2002
• Issued: 03/02/2004
• Est. Priority Date: 01/23/2002
• Status: Expired due to Fees

• Current Assignee: Yazaki North America Incorporated (Yazaki Corporation)
• Original Assignee: Yazaki North America Incorporated (Yazaki Corporation)
• Inventors: Jones, James L., Russel, Kenneth J., Sheng, Yongmin, Rajesh, Chidambarakrishnan L., Nyschick, Jarrett
• Primary Examiner(s): Cuneo, Kamand
• Assistant Examiner(s): DINH, TUAN T
• Application Number:
  US10/055,563
• Time in Patent Office: 769 Days
• Field of Search: 361/784-785, 361/803, 361/825-826, 307/9.1, 307/10.1, 307/10.8
• US Class Current: 361/784
• CPC Class Codes: B60R 16/03 for supply of electrical power to vehicle subsystems or for circuit arrangements for charging batteries H02J7/00
• CPC Class Codes: H05K 1/0295 adapted for choosing between different types or different locations of mounted components
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/09954 More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 2201/10303 Pin-in-hole mounted pins
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence

Abstract

The architecture of an automotive wiring, power distribution and accessory control system is described. The system comprises semi-custom two-tier nodes which are distributed in locations around the vehicle to service load devices associated with or found in different regions of the automobile topology. A multiplexed control network interconnects the nodes along with a two-wire bus. Each node consists of a first common board carrying a microcontroller and a basic number of FET driver switches associated with a basic level of accessorization for that region of the vehicle. Each node further comprises a second larger pass through board which supports the first common board in spaced parallel relationship therewith and which carries terminal connectors. The larger pass through board has vacant locations for the addition of FET drivers needed for higher levels of accessorization. These locations are preconnected to the microcontroller but are unused in vehicles with lower levels of accessorization. The pass through board is also used to optimize the wiring by incorporation of splices and pass through circuits to eliminate wire harness interconnections.

Claims

1. A wiring, power distribution, and control system for an automotive vehicle of the type having an electrical power source and a plurality of controllable load devices in different locations throughout the vehicle comprising:

a plurality of control nodes interconnected by a control signal network and power line, said control nodes being strategically placed in different regions in the vehicle to service selected groups of load devices associated with the individual node regions, each of said nodes comprises;

a first circuit board carrying a microcontroller having control signal inputs connected to said network, and power control signal outputs;

said first circuit board further carrying a plurality of power switches having input terminals being connected to the power control signal outputs of the microcontroller and output terminals being connected to specific load devices; and

a second circuit board having terminal connectors being connected to the control signal network, power lines and load devices; and

means interconnecting the terminal connectors to the microcontroller for control signal input purposes and the power switches to the terminal connectors for power output purposes.

2. A system as defined in claim 1 wherein said interconnecting means includes traces on each of the first and second boards and interconnects between the boards.

3. A system as defined in claim 1 wherein the power switches are arranged in a group which is spaced apart from the microcontroller.

4. A system as defined in claim 1 further including power switch mounting locations on said second board and means interconnecting said locations to the power control signal outputs of the microcontroller.

5. A system as defined in claim 1 wherein the switches are FETs.

6. A system as defined in claim 1 wherein said plurality of nodes include a front passenger side node and a front driver side node.

7. A system as defined in claim 1 wherein the second circuit board further comprises means for signal connection between wire harnesses interconnecting the control nodes.

8. A system as defined in claim 2 wherein the interconnects between the boards are rigid pins serving to mount the first circuit board to the second circuit board in spaced relationship.

9. A system as defined in claim 2 wherein said switches are FETSs.

10. A system as defined in claim 6 wherein said plurality of nodes further includes a rear vehicle node.

11. A system as defined in claim 8 wherein the first circuit board is mounted on the second circuit board by way of said rigid interconnects in parallel spaced relationship to permit air flow therebetween.

12. A system as defined in claim 11 wherein the spacing between the first and second circuit boards is at least about 4 mm.

13. A power distribution and control node an apparatus for an automotive vehicle of the type having a control signal network comprising:

a first circuit board carrying a microcontroller having data signal inputs for connection to said network and power control signal outputs;

said first circuit board further carrying a plurality of power switches having power terminals for connection to load devices and control signal terminals connected to the power control outputs of the microcontroller; and

a second circuit board electrically interconnected with the first circuit board and carrying terminal connectors for connecting the network to the microcontroller and the switches to load devices, wherein said first circuit board is mounted on said second circuit board.

14. An apparatus as defined in claim 13 wherein the first and second circuit boards include electrically conductive traces thereon and rigid conductive circuit board interconnects therebetween such that the first circuit board is physically mounted on the second circuit board in spaced apart relationship.

15. An apparatus as defined in claim 13 wherein the second circuit board further includes additional vacant power switch mounting locations, and means interconnecting said locations to the control signal outputs of the microcontroller.

16. An apparatus as defined in claim 14 wherein the switches are arranged on the first circuit board in a group wherein each of the switches are proximate at least one other switch, the microcontroller being placed on the board so as to be remote from the switches.

17. An apparatus as defined in claim 16, wherein the switches are FETs.