Defect source identifier
First Claim
1. A method of analyzing defects on semiconductor wafers comprising:
- identifying defects on the semiconductor wafer;
creating defect inspection information within a plurality of substantially similar defect source identifier clients, the defect inspection information containing information regarding the identified defects;
transmitting the defect inspection information through a network to a defect source identifier server;
deriving defect source information at the defect source identifier server in response to the defect inspection information from the plurality of substantially similar defect source information clients;
deriving a defect solution at the defect source identifier server in response to the derived defect source information;
transmitting the defect source information and the defect solution from the defect source identifier server to one or more of the substantially similar defect source identifier clients; and
utilizing the defect source information and the defect solution at the one or more of the plurality of substantially similiar defect source identifier clients.
1 Assignment
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Accused Products
Abstract
A method and associated apparatus of analyzing defects on semiconductor wafers. The method includes identifying defects on the semiconductor wafer. Defect inspection information is created within a defect source identifier client. The defect inspection information containing information regarding the identified defects. The defect inspection information is transmitted through a network to a defect source identifier server. Defect source information is derived at the defect source identifier server in response to the defect inspection information. The defect source information is transmitted from the defect source identifier server to the defect source identifier client. The defect source information is utilized at the defect source identifier client. In one aspect, the utilizing the defect solution information involves displaying defect solutions to the defect at the defect source identifier client in response to the defect solution information. In another aspect, utilizing the defect solution information involves altering the operation of the wafer processing system.
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Citations
23 Claims
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1. A method of analyzing defects on semiconductor wafers comprising:
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identifying defects on the semiconductor wafer;
creating defect inspection information within a plurality of substantially similar defect source identifier clients, the defect inspection information containing information regarding the identified defects;
transmitting the defect inspection information through a network to a defect source identifier server;
deriving defect source information at the defect source identifier server in response to the defect inspection information from the plurality of substantially similar defect source information clients;
deriving a defect solution at the defect source identifier server in response to the derived defect source information;
transmitting the defect source information and the defect solution from the defect source identifier server to one or more of the substantially similar defect source identifier clients; and
utilizing the defect source information and the defect solution at the one or more of the plurality of substantially similiar defect source identifier clients. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
providing customer knowledge database information at the defect source identifier client; and
displaying the customer knowledge database information at the defect source identifier client.
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3. The method of claim 2, wherein the defect source information and the customer knowledge database information are displayed simultaneously at the defect source identifier client.
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4. The method of claim 1, further comprising:
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providing defect knowledge information at the defect source identifier server;
transmitting the defect knowledge information from the defect source identifier server to the defect source identifier client; and
displaying the defect knowledge information at the defect source identifier client.
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5. The method of claim 4, wherein the transmission of the defect knowledge information from the defect source identifier server to the defect source identifier client is controlled by user input at the defect source identifier client.
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6. The method of claim 4, wherein the defect source information and the defect knowledge information are displayed simultaneously at the defect source identifier client.
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7. The method of claim 1, wherein the defects on the semiconductor wafer are identified with the wafers located in a metrology cell in a wafer processing system.
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8. The method of claim 1, wherein the utilizing the defect solution information involves displaying defect solutions to the defect at the defect source identifier client in response to the defect solution information.
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9. The method of claim 1, wherein the utilizing the defect solution information involves altering the operation of a wafer processing system.
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10. An apparatus providing defect sources for semiconductor wafers comprising:
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a plurality of wafer processing systems configured to process wafers and to identify defects on the semiconductor wafers;
a defect source identifier client coupled to each of the wafer processing systems in said plurality of wafer processing systems for generating defect inspection information in response to the identified defects;
a defect source identifier server in communication with each of the defect source identifier clients, each of the defect source identifier clients transmitting the defect inspection information to the defect source identifier server, the defect source identifier server deriving defect source information in response to the defect inspection information from the plurality of the defect source identifier clients, wherein the defect source information is transmitted from the defect source identifier server to the defect source identifier client; and
the defect source identifier clients utilize the defect source information to provide a solution to the wafer processing systems for the defect. - View Dependent Claims (11, 12)
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13. A method of analyzing defects on semiconductor wafers comprising:
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identifying defects on the semiconductor wafer;
creating defect inspection information within a plurality of substantially similar defect source identifier clients, the defect inspection information containing information regarding the identified defects;
transmitting the defect inspection information through a network to a defect source identifier server;
deriving defect cause information in response to the defect inspection information at the defect source identifier server;
transmitting a selected defect cause information to the defect source identifier server;
deriving a selected cause at the defect source identifier server in response to the selected defect cause information;
transmitting the selected cause from the plurality of substantially similar defect source identifier clients to the defect source identifier server;
deriving defect source information at the defect source identifier server in response to the selected cause;
transmitting the defect source information from the defect source identifier server to one or more of the plurality of substantially similar defect source identifier clients; and
utilizing the defect source information at one or more of the plurality of substantially similar defect source identifier clients. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
providing customer knowledge information at the defect source identifier client; and
displaying the customer knowledge information at the defect source identifier client.
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17. The method of claim 16, wherein the defect source information and the customer knowledge information are displayed simultaneously at the defect source identifier client.
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18. The method of claim 13, further comprising:
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providing defect knowledge information at the defect source identifier server;
transmitting the defect knowledge information from the defect source identifier server to the defect source identifier client; and
displaying the defect knowledge information at the defect source identifier client.
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19. The method of claim 18, wherein the transmission of the defect knowledge information from the defect source identifier server to the defect source identifier client is controlled by user input at the defect source identifier client.
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20. The method of claim 18, wherein the defect source information and the defect knowledge information are displayed simultaneously at the defect source identifier client.
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21. The method of claim 13, wherein the defects on the semiconductor wafer are identified in a metrology cell in a wafer processing system.
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22. The method of claim 13, wherein the utilizing the defect solution information involves displaying defect solutions to the defect at the defect source identifier client in response to the defect solution information.
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23. The method of claim 13, wherein the utilizing the defect solution information involves altering the operation of the wafer processing system.
Specification