Printed circuit techniques for polyethylene surfaces

• US 6,702,968 B2
• Filed: 09/17/2001
• Issued: 03/09/2004
• Est. Priority Date: 09/17/2001
• Status: Expired due to Term

• Current Assignee: Stevenson Living Trust
• Original Assignee: Michael J. Stevenson
• Inventors: Stevenson, Michael J., Reeves, Robert Alan
• Primary Examiner(s): Eashoo, Mark
• Application Number:
  US09/953,629
• Publication Number:
  US 20030051799A1
• Time in Patent Office: 904 Days
• Field of Search: 264/104, 264/129, 264/131, 264/132, 264/310, 264/311, 156/230, 156/240, 156/247, 156/277, 156/289, 427/146, 427/147, 427/148
• US Class Current: 264/104
• CPC Class Codes: B29C 37/0032 the coating being applied upon the mould surface before introducing the moulding compound, e.g. applying a gelcoat B29C44/14 and B29C44/32 take precedence
• CPC Class Codes: B29C 41/06 about two or more axes
• CPC Class Codes: B29C 41/20 incorporating preformed parts or layers, e.g. moulding inserts or for coating articles
• CPC Class Codes: B29K 2023/06 PE, i.e. polyethylene
• CPC Class Codes: B29K 2995/0005 Conductive
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 2201/0158 Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2203/0156 Temporary polymeric carrier or foil, e.g. for processing or transferring
• CPC Class Codes: H05K 3/207 using a prefabricated paste pattern, ink pattern or powder pattern

Abstract

Electrical circuit elements such as electrically conductive strips are permanently applied to the surface of polyolefin parts, such as polyethylene parts which are manufactured by rotational molding, by use of a transfer which can be applied to the interior surface of a rotational mold at the start of the molding cycle or can be applied to the molded part after its formation. The transfer comprises a carrier sheet on which the conductive circuit elements are printed with a mixture of wax or polyethylene powders containing from 30 to about 60 weight percent of conductive particles, preferably metal flakes. After application, the carrier sheet is removed and the conductive circuit elements are permanently incorporated into the surface of the polyethylene part by heating, either during the rotational molding cycle or by post-cycle heating of the formed part.

Claims

1. The method to apply an electrically conductive circuit into a polyethylene surface which comprises:

a. forming a transfer by printing onto a flexible sheet carrier a coating with the electrically conductive circuit defined by a mixture consisting essentially of from 30 to 55 weight percent electrically conductive metal flakes and from 45 to 70 weight percent of a member selected from the group consisting of hydrocarbon waxes and high density polyethylene powder;

b. transferring the coating from the sheet carrier to the polyethylene surface and heating the surface to the melting temperature of the polyethylene surface to fuse and permanently incorporate the coating into the polyethylene surface.

2. The method of claim 1 wherein the conductive metal flakes have a thickness of about 1 micron.

3. The method of claim 2 including the steps of forming said mixture with high density polyethylene powder having a size range less than 40 microns and transferring the printed coating from the carrier sheet of said transfer onto a polyethylene surface by pressing the transfer against the surface and separating the carrier sheet from the printed coating and heating said polyethylene to the melt temperature of the polyethylene powder to fuse the coating into said surface.

4. The method of claim 3 wherein the printing mixture comprises from 45 to 55 weight percent nickel metal flakes and from 55 to 45 weight percent high density polyethylene powder.

5. The method of claim 4 wherein the nickel flakes have a thickness of about 1 micron.

6. The method of claim 1 as applied to a rotational molding cycle wherein a rotational mold is charged with polyethylene molding resin, closed and heated to a molding temperature while rotating the mold about its major and minor axes for sufficient time to mold the resin against the interior surface of the mold and form a hollow-form part having said polyethylene surface, then cooled to a demolding temperature and opened and the part is ejected, including the steps of forming the transfer with said mixture and transferring the printed coating from the carrier sheet to the interior surface of the rotational mold at the demolding temperature prior to charging said mold with polyethylene molding resin.

7. The method of claim 6 including the step of forming said mixture with microcrystalline hydrocarbon wax.

8. The method of claim 7 wherein the printing mixture consists essentially of from 45 to 55 weight percent nickel metal flakes and from 45 to 55 weight percent wax.

9. The method of claim 8 wherein the nickel flakes have a thickness of about 1 micron.

10. The method of claim 1 wherein the printing mixture comprises from 45 to 55 weight percent nickel metal flakes and from 45 to 55 weight percent wax.