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Thermally-capacitive phase change encapsulant for electronic devices

  • US 6,703,128 B2
  • Filed: 02/15/2002
  • Issued: 03/09/2004
  • Est. Priority Date: 02/15/2002
  • Status: Expired due to Term
First Claim
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1. An encapsulation material for an electronic module, the encapsulation material comprising:

  • a polymer matrix material; and

    electrically-conductive phase change particles dispersed in the matrix material, the phase change particles being encapsulated by a dielectric coating so as to be electrically insulated from each other;

    wherein the dielectric coating is a polymer capable of containing the phase change particles when molten.

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