Header assembly having integrated cooling device
First Claim
1. A header assembly, comprising:
- (a) a base substantially comprising a metallic material and having a device side and a connector side;
(b) a platform extending through both the device side and the connector side of the base and residing in a predetermined orientation with respect to the base, the platform having an inside portion proximate the device side of the base and an outside portion proximate the connector side of the base, and the platform including at least one conductive pathway extending substantially through the platform; and
(c) a cooling device directly attached to the inside portion of the platform.
5 Assignments
0 Petitions
Accused Products
Abstract
A header assembly including a base and a platform extending through the base and substantially perpendicular thereto. The platform includes conductive pathways that connect electrical components on either side of the base, and the conductive pathways cooperate to form a connector at the first end of the platform. A laser is mounted on top of a thermoelectric cooler that is directly joined to the second end of the platform. The laser and thermoelectric cooler are enclosed in a hermetic chamber cooperatively defined by the base, the platform, and a cap that is joined to the base. A photodiode optically coupled with the laser and a thermistor thermally coupled with the laser cooperate with the thermoelectric cooler and a control circuit to facilitate control of the performance of the laser.
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Citations
49 Claims
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1. A header assembly, comprising:
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(a) a base substantially comprising a metallic material and having a device side and a connector side;
(b) a platform extending through both the device side and the connector side of the base and residing in a predetermined orientation with respect to the base, the platform having an inside portion proximate the device side of the base and an outside portion proximate the connector side of the base, and the platform including at least one conductive pathway extending substantially through the platform; and
(c) a cooling device directly attached to the inside portion of the platform. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 15)
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11. A header assembly, comprising:
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(a) a base substantially comprising a metallic material and having a device side and a connector side;
(b) a platform extending perpendicularly through both the device side and the connector side of the base, the platform having an inside portion proximate the device side of the base and an outside portion proximate the connector side of the base, and the platform including at least one conductive pathway extending substantially through the platform;
(c) a cooling device directly attached to the inside portion of the platform; and
(d) an electronic device mounted on the cooling device. - View Dependent Claims (12, 13, 14, 16, 17)
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18. A header assembly, comprising:
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(a) a base substantially comprising a metallic material and having a device side and a connector side;
(b) a platform extending perpendicularly through both the device side and the connector side of the base, the platform having an inside portion proximate the device side of the base and an outside portion proximate the connector side of the base, and the platform including at least one conductive pathway extending substantially through the platform;
(c) an electronic device mounted indirectly to the inside portion of the platform; and
(d) means for transferring heat, the means for transferring heat being directly thermally coupled with the electronic device. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A transistor header assembly, comprising:
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(a) a base substantially comprising a metallic material and having a device side and a connector side;
(b) a platform disposed in a substantially perpendicular orientation with respect to the base and extending through both the device side and the connector side of the base, the platform having an inside portion proximate the device side of the base and an outside portion proximate the connector side of the base, and the platform including at least one conductive pathway extending substantially through the platform;
(c) a thermoelectric cooler directly attached to the inside portion of the platform;
(d) a laser mounted on the thermoelectric cooler; and
(e) a cap connected to the device side of the base, the cap cooperating with the platform and the device side of the base to define a hermetic chamber that encloses the laser and the thermoelectric cooler. - View Dependent Claims (29, 30, 31, 32)
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33. In a header assembly that includes a platform extending through a device side and a connector side of a base of the transistor header assembly, the platform having an inside portion proximate the device side of the base and an outside portion proximate the connector side of the base, a laser being mounted indirectly to the inside portion of the platform, and the platform also including at least one conductive pathway extending substantially through the platform, a laser control system comprising:
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(a) means for transferring heat, the means for transferring heat being directly thermally coupled with the laser;
(b) a light intensity measuring device optically coupled with the laser;
(c) a temperature sensing device thermally coupled with the laser;
(d) a control circuit in communication with the temperature sensing device, the light intensity measuring device, and the means for transferring heat; and
(e) a power source in electrical communication with the control circuit and the means for transferring heat. - View Dependent Claims (34, 35, 36, 37, 38)
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39. A header assembly, comprising:
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(a) a base substantially comprising a metallic material and having a device side and a connector side;
(b) a platform extending perpendicularly through both the device side and the connector side of the base, the platform having an inside portion proximate the device side of the base and an outside portion proximate the connector side of the base, and the platform including at least one conductive pathway extending substantially through the platform;
(c) a cooling device directly attached to the outside portion of the platform; and
(d) an electronic device attached directly to the platform. - View Dependent Claims (40, 41, 42, 43)
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44. An opto-electronic system, comprising:
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(a) a header assembly, comprising;
(i) a base substantially comprising a metallic material and having a device side and a connector side;
(ii) a platform extending through both the device side and the connector side of the base and residing in a predetermined orientation with respect to the base, the platform having an inside portion proximate the device side of the base and an outside portion proximate the connector side of the base, and the platform including at least one conductive pathway extending substantially through the platform;
(iii) a cooling device directly attached to the inside portion of the platform; and
(iv) a laser mounted directly on the cooling device;
(b) a light intensity measuring device optically coupled with the laser;
(d) a temperature sensing device thermally coupled with the laser;
(e) a control circuit in communication with the temperature sensing device, the light intensity measuring device, and the cooling device; and
(f) a power source in electrical communication with the control circuit and the cooling device. - View Dependent Claims (45, 46, 47, 48, 49)
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Specification