Header assembly having integrated cooling device

• US 6,703,561 B1
• Filed: 08/29/2002
• Issued: 03/09/2004
• Est. Priority Date: 09/06/2001
• Status: Expired due to Term

• Current Assignee: II-VI Delaware, Inc. (Coherent Corp.)
• Original Assignee: Finisar Corporation (II-VI Incorporated)
• Inventors: Giaretta, Giorgio, Schiaffino, Stefano, Stewart, James, Hofmeister, Rudolf J., Rosenberg, Paul K.
• Primary Examiner(s): Ngo, Hung V.
• Application Number:
  US10/231,395
• Time in Patent Office: 558 Days
• Field of Search: 174/52.5, 174/52.1, 174/16.3, 257/732, 257/733, 257/712, 257/713, 361/714, 361/717
• US Class Current: 174/541
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01S 5/02212 Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
• CPC Class Codes: H01S 5/02325 Mechanically integrated components on mount members or optical micro-benches
• CPC Class Codes: H01S 5/024 Arrangements for thermal management
• CPC Class Codes: H01S 5/02415 by using a thermo-electric cooler [TEC], e.g. Peltier element
• CPC Class Codes: H01S 5/06804 by monitoring an external parameter, e.g. temperature
• CPC Class Codes: H01S 5/06837 Stabilising otherwise than by an applied electric field or current, e.g. by controlling the temperature
• CPC Class Codes: H01S 5/183 having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

Abstract

A header assembly including a base and a platform extending through the base and substantially perpendicular thereto. The platform includes conductive pathways that connect electrical components on either side of the base, and the conductive pathways cooperate to form a connector at the first end of the platform. A laser is mounted on top of a thermoelectric cooler that is directly joined to the second end of the platform. The laser and thermoelectric cooler are enclosed in a hermetic chamber cooperatively defined by the base, the platform, and a cap that is joined to the base. A photodiode optically coupled with the laser and a thermistor thermally coupled with the laser cooperate with the thermoelectric cooler and a control circuit to facilitate control of the performance of the laser.

Claims

1. A header assembly, comprising:

(a) a base substantially comprising a metallic material and having a device side and a connector side;

(b) a platform extending through both the device side and the connector side of the base and residing in a predetermined orientation with respect to the base, the platform having an inside portion proximate the device side of the base and an outside portion proximate the connector side of the base, and the platform including at least one conductive pathway extending substantially through the platform; and

(c) a cooling device directly attached to the inside portion of the platform.

2. The header assembly as recited in claim 1, wherein the platform comprises a first feedthru having thermal properties such that it is substantially thermally conductive, and a second feedthru having thermal properties such that it is substantially thermally nonconductive.

3. The header assembly as recited in claim 1, wherein the cooling device comprises thermoelectric cooler.

4. The header assembly as recited in claim 1, further comprising a cap that cooperates with the base to define a hermetic chamber substantially enclosing the inside portion of the platform and the cooling device.

5. The header assembly as recited in claim 1, wherein when the platform resides in the predetermined orientation, the platform is substantially perpendicular to the base.

6. The header assembly as recited in claim 1, further comprising an electronic device mounted directly to the cooling device.

7. The header assembly as recited in claim 1, further comprising an optical device mounted directly to the cooling device, the optical device being selected from the group consisting of:

light transmitting devices and light receiving devices.

8. The header assembly as recited in claim 1, wherein the platform comprises a first type of materials having thermal properties that render the first type of materials substantially conductive, and the platform further comprises a second type of materials having thermal properties that render the second type of materials substantially non-conductive.

9. The header assembly as recited in claim 1, wherein the cooling device is electrically connected at least indirectly with the at least one conductive pathway of the platform.

10. The header assembly as recited in claim 1, wherein the platform further comprises a connector located on the outside portion of the platform and connected at least indirectly with the at least one conductive pathway.

15. The header assembly as recited in claim 1, further comprising a cap that cooperates with the base to define a hermetic chamber substantially enclosing the cooling device and the electronic device.

11. A header assembly, comprising:

(a) a base substantially comprising a metallic material and having a device side and a connector side;

(b) a platform extending perpendicularly through both the device side and the connector side of the base, the platform having an inside portion proximate the device side of the base and an outside portion proximate the connector side of the base, and the platform including at least one conductive pathway extending substantially through the platform;

(c) a cooling device directly attached to the inside portion of the platform; and

(d) an electronic device mounted on the cooling device.

12. The header assembly as recited in claim 11, wherein the electronic device comprises an optical device selected from the group consisting of:

light transmitting devices and light receiving devices.

13. The header assembly as recited in claim 11, wherein the platform comprises ceramic and metallic materials.

14. The header assembly as recited in claim 11, wherein the cooling device comprises a thermoelectric cooler.

16. The header assembly as recited in claim 11, wherein the platform comprises a first feedthru having thermal properties such that it is substantially conductive, and a second feedthru having thermal properties such that it is substantially non-conductive.

17. The header assembly as recited in claim 11, wherein the electronic device comprises a laser.

18. A header assembly, comprising:

(a) a base substantially comprising a metallic material and having a device side and a connector side;

(b) a platform extending perpendicularly through both the device side and the connector side of the base, the platform having an inside portion proximate the device side of the base and an outside portion proximate the connector side of the base, and the platform including at least one conductive pathway extending substantially through the platform;

(c) an electronic device mounted indirectly to the inside portion of the platform; and

(d) means for transferring heat, the means for transferring heat being directly thermally coupled with the electronic device.

19. The header assembly as recited in claim 18, wherein the means for transferring heat facilitates removal of heat from the electronic device.

20. The header assembly as recited in claim 18, wherein the means for transferring heat facilitates the transfer of heat to the electronic device.

21. The header assembly as recited in claim 18, wherein the means for transferring heat facilitates positioning of the electronic device.

22. The header assembly as recited in claim 18, wherein the means for transferring heat aids in controlling performance of the electronic device.

23. The header assembly as recited in claim 18, wherein the means for transferring heat electrically communicates, at least indirectly, with the at least one conductive pathway of the platform.

24. The header assembly as recited in claim 18, wherein the means for transferring heat comprises a thermoelectric cooler.

25. The header assembly as recited in claim 18, wherein the electronic device comprises an optical device selected from the group consisting of:

light transmitting devices and light receiving devices.

26. The header assembly as recited in claim 18, wherein the platform comprises a first feedthru having thermal properties such that it is substantially conductive, and a second feedthru having thermal properties such that it is substantially non-conductive.

27. The header assembly as recited in claim 18, further comprising a cap that cooperates with the base to define a hermetic chamber substantially enclosing the means for transferring heat and the electronic device.

28. A transistor header assembly, comprising:

(a) a base substantially comprising a metallic material and having a device side and a connector side;

(b) a platform disposed in a substantially perpendicular orientation with respect to the base and extending through both the device side and the connector side of the base, the platform having an inside portion proximate the device side of the base and an outside portion proximate the connector side of the base, and the platform including at least one conductive pathway extending substantially through the platform;

(c) a thermoelectric cooler directly attached to the inside portion of the platform;

(d) a laser mounted on the thermoelectric cooler; and

(e) a cap connected to the device side of the base, the cap cooperating with the platform and the device side of the base to define a hermetic chamber that encloses the laser and the thermoelectric cooler.

29. The transistor header assembly as recited in claim 28, wherein the platform comprises a first feedthru having thermal properties such that it is substantially conductive, and a second feedthru having thermal properties such that it is substantially non-conductive.

30. The transistor header assembly as recited in claim 28, wherein the platform comprises metallic materials and ceramic materials.

31. The transistor header assembly as recited in claim 28, further comprising a light intensity sensing device optically coupled with the laser.

32. The transistor header assembly as recited in claim 28, further comprising a temperature sensing device thermally coupled with the laser.

33. In a header assembly that includes a platform extending through a device side and a connector side of a base of the transistor header assembly, the platform having an inside portion proximate the device side of the base and an outside portion proximate the connector side of the base, a laser being mounted indirectly to the inside portion of the platform, and the platform also including at least one conductive pathway extending substantially through the platform, a laser control system comprising:

(a) means for transferring heat, the means for transferring heat being directly thermally coupled with the laser;

(b) a light intensity measuring device optically coupled with the laser;

(c) a temperature sensing device thermally coupled with the laser;

(d) a control circuit in communication with the temperature sensing device, the light intensity measuring device, and the means for transferring heat; and

(e) a power source in electrical communication with the control circuit and the means for transferring heat.

34. The laser control system as recited in claim 33, wherein the means for transferring heat transfers heat to the laser in response to a signal from the control circuit.

35. The laser control system as recited in claim 33, wherein the means for transferring heat removes heat from the laser in response to a signal from the control circuit.

36. The laser control system as recited in claim 33, wherein the means for transferring heat aids in control of the temperature of the light intensity measuring device.

37. The laser control system as recited in claim 33, wherein the means for transferring heat transfers heat to, or removes heat from, the laser based in part upon signals from the light intensity measuring device and the temperature sensing device.

38. The laser control system as recited in claim 33, wherein the means for transferring heat comprises a thermoelectric cooler.

39. A header assembly, comprising:

(a) a base substantially comprising a metallic material and having a device side and a connector side;

(b) a platform extending perpendicularly through both the device side and the connector side of the base, the platform having an inside portion proximate the device side of the base and an outside portion proximate the connector side of the base, and the platform including at least one conductive pathway extending substantially through the platform;

(c) a cooling device directly attached to the outside portion of the platform; and

(d) an electronic device attached directly to the platform.

40. The header assembly as recited in claim 39, wherein the cooling device comprises a thermoelectric cooler.

41. The header assembly as recited in claim 39, wherein the electronic device comprises an optical device selected from the group consisting of:

light transmitting devices and light receiving devices.

42. The header assembly as recited in claim 39, wherein the platform comprises a first feedthru having thermal properties such that it is substantially conductive, and a second feedthru having thermal properties such that it is substantially non-conductive.

43. The header assembly as recited in claim 42, wherein the electronic device is mounted to the first feedthru, and the cooling device is attached to the second feedthru.

44. An opto-electronic system, comprising:

(a) a header assembly, comprising;

(i) a base substantially comprising a metallic material and having a device side and a connector side;

(ii) a platform extending through both the device side and the connector side of the base and residing in a predetermined orientation with respect to the base, the platform having an inside portion proximate the device side of the base and an outside portion proximate the connector side of the base, and the platform including at least one conductive pathway extending substantially through the platform;

(iii) a cooling device directly attached to the inside portion of the platform; and

(iv) a laser mounted directly on the cooling device;

(b) a light intensity measuring device optically coupled with the laser;

(d) a temperature sensing device thermally coupled with the laser;

(e) a control circuit in communication with the temperature sensing device, the light intensity measuring device, and the cooling device; and

(f) a power source in electrical communication with the control circuit and the cooling device.

45. The opto-electronic system as recited in claim 44, wherein the cooling device comprises a thermoelectric cooler.

46. The opto-electronic system as recited in claim 44, wherein the laser comprises a semiconductor laser.

47. The opto-electronic system as recited in claim 44, wherein at least one of the light intensity measuring device and the temperature sensing device is mounted directly to the cooling device.

48. The opto-electronic system as recited in claim 44, wherein when the platform resides in the predetermined orientation, the platform is substantially perpendicular to the base.

49. The opto-electronic system as recited in claim 44, wherein the platform comprises metallic materials and ceramic materials.