IC chip mounting structure and display device

• US 6,703,702 B2
• Filed: 07/26/2002
• Issued: 03/09/2004
• Est. Priority Date: 07/30/2001
• Status: Expired due to Fees

• Current Assignee: Maxell, Ltd.
• Original Assignee: Fujitsu Hitachi Plasma Display Limited (Hitachi, Ltd.)
• Inventors: Inoue, Hirokazu, Kawada, Toyoshi, Sano, Yuji
• Primary Examiner(s): CLARK, JASMINE JHIHAN B
• Application Number:
  US10/202,831
• Publication Number:
  US 20030020152A1
• Time in Patent Office: 592 Days
• Field of Search: 257/684, 257/687, 257/584, 257/621, 257/729, 257/723, 361/736, 361/748-750, 361/752, 361/790
• US Class Current: 257/684
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/147 at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence

Abstract

IC CHIP MOUNTING STRUCTURE has IC chips having protruding electrodes, a flexible printed circuit board having conductors connected to the protruding electrodes of the IC chips, and a protective plate attached to the flexible printed circuit board. The protective plate has openings to accommodate the driver IC chips. A resin member having a high heat conductivity is arranged in the opening in contact with the surface of the IC chip. The IC chip mounting structure can be attached to a chassis of a plasma display device so that heat generated by the driver IC chip is transferred to the chassis via the heat conductive resin member.

Claims

1. An IC chip mounting structure comprising:

at least one IC chip having a first surface having electrodes formed thereon, a second surface opposite to said first surface;

a wiring board having said IC chip mounted on a first side thereof and conductors connected to the electrodes of said IC chip;

a protective member attached to said wiring board and having an opening comprising a peripheral wall surrounding said IC chip; and

a heat conductive first member formed of a resin material arranged in said opening of said protective member to cover and protect said second surface of said IC chip and a circumference thereof.

2. The IC chip mounting structure according to claim 1, further comprising a support member mounted on said wiring board on a second side thereof, opposite to the first side having said IC chip mounted thereon.

3. The IC chip mounting structure according to claim 1, further comprising a heat conductive second member mounted on said wiring board on the first side thereof having said IC chip mounted thereon to cover said heat conductive first member.

4. The IC chip mounting structure according to claim 1, wherein the thickness of said protective member is greater than the height of said IC chip, a part of said heat conductive first member is located in said opening of said protective member, and another part of said heat conductive first member is located outside said opening of said protective member.

5. A display device, comprising:

a flat display panel comprising a pair of substrates having a plurality of electrodes;

a circuit board having a circuit for supplying a drive voltage to said electrodes of one of said substrates;

a chassis mounted on said flat display panel and having said circuit board arranged thereon; and

a driver IC module mounted on said chassis and connecting the electrodes on said one of the substrates and the circuit of said circuit board to each other;

wherein said driver IC module comprises;

at least one driver IC chip having a first surface having electrodes formed thereon and a second surface opposite to said first surface;

a wiring board having said driver IC chip mounted thereon and conductors connected to the electrodes of said driver IC chip;

a protective member having an opening comprising a peripheral wall surrounding said driver IC chip; and

a heat conductive member arranged in said opening of said protective member in contact with said second surface of said driver IC chip.

6. The display device according to claim 5, wherein said wiring board includes a first terminal portion connected to the electrodes of said one of the substrates, a second terminal portion connected to the circuit of said circuit board, and a driver IC chip portion between said first terminal portion and said second terminal portion and having said driver IC chip mounted thereon, said driver IC chip contacts with said chassis thermally through said heat conductive member.

7. An IC chip mounting structure, comprising:

an IC chip;

a wiring board having the IC chip mounted thereon; and

at least one protective member arranged on the wiring board adjacent to at least two sides of the IC chip for protecting the IC chip;

wherein said wiring board is made of a flexible wiring board having flexibility and said protective member is made of a material harder than the flexible wiring board.

8. The IC chip mounting structure according to claim 7, further comprising at least one of:

a first member arranged on the back side of the IC chip to cover the IC chip;

a heat conductive second member arranged to cover the first member; and

a support member arranged on the side opposite to the side of the wiring board having the IC chip mounted thereon to support the wiring board.

9. The IC chip mounting structure according to claim 7, further comprising:

a first member arranged on the back side of the IC chip to cover the IC chip; and

a heat conductive second member arranged to cover the first member, said heat conductive second member also functioning as said protective member.

10. The IC chip mounting structure according to claim 8, wherein at least one of said protective member, said heat conductive second member and said support member is made of a metallic material and has a structure by which a ground terminal of said IC chip is electrically connected to at least one of said protective member, said heat conductive second member and said support member.

11. A display device, comprising:

a flat display panel;

a chassis arranged on the back side of the flat display panel; and

a driver IC module having a driver IC chip connected to display electrodes of the flat display panel for driving the flat display panel, and a wiring board having the driver IC chip mounted thereon;

wherein the driver IC module is attached to the chassis, and a protective member or protective structure for at least the driver IC chip is arranged adjacent to at least two sides of the driver IC chip.

12. The IC chip mounting structure according to claim 11, wherein the display device according to claim 12, further comprising at least one of:

a first member arranged on the back side of the IC chip to cover the IC chip;

a heat conductive second member arranged to cover said first member; and

a support member arranged on the side opposite to the side of the wiring board having the IC chip mounted thereon.

13. The display device according to claim 11, wherein a plurality of driver IC modules are provided on the chassis and provided with a support member commonly arranged on the back side of the wiring boards of the plurality of driver IC modules.

14. The IC chip mounting structure according to claim 12, wherein at least one of said protective member, said heat conductive second member and said support member is made of a metallic material and has a structure by which a ground terminal of said IC chip is electrically connected to at least said one of said protective member, said heat conductive second member and said support member.

15. The IC chip mounting structure according to claim 11, wherein said flat display panel comprises a plasma display panel.