Covering sheet, triplate line using the sheet, signal bus for computer using the sheet and covering structure of electronic circuit using the sheet

• US 6,703,909 B2
• Filed: 11/26/2001
• Issued: 03/09/2004
• Est. Priority Date: 11/28/2000
• Status: Expired due to Fees

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: Fujishiro, Yoshikazu, Miura, Taro
• Primary Examiner(s): Pascal, Robert
• Assistant Examiner(s): TAKAOKA, DEAN O
• Application Number:
  US09/991,648
• Publication Number:
  US 20020127924A1
• Time in Patent Office: 834 Days
• Field of Search: 333/128, 333/246, 361/794, 361/795, 428/422, 428/116, 428/117, 428/118
• US Class Current: 333/128
• CPC Class Codes: H01P 1/215 using ferromagnetic material
• CPC Class Codes: H05K 1/0233 Filters, inductors or a magnetic substance
• CPC Class Codes: H05K 9/0039 Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing printed shielding conductors, ground planes or power planes for reduction of cross-talk or noise in printed circuits H05K1/0218

Abstract

The covering sheet includes at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein, a ground conductor layer laminated on one surface of the magnetic material layer, and a plurality of via holes for passing conducting unit for grounding the ground conductor layer, or includes a laminate consisting of at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein and at least one dielectric layer having a permittivity lower than that of the magnetic material layer, and a ground conductor layer laminated on one surface of the laminate.

Claims

1. A covering sheet comprising:

at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein;

a ground conductor layer laminated on one surface of said magnetic material layer, one surface of said ground conductor layer being exposed to a free space; and

a plurality of via holes for passing conducting means for grounding said ground conductor layer to a ground path of a signal bus covered by the covering sheet,

said ground conductor layer, said signal bus and said ground path forming a triplate line structure.

2. The covering sheet as claimed in claim 1, wherein said sheet further comprises a plurality of conducting means, electrically connected to said ground conductor layer through said plurality of via holes, for grounding said ground conductor layer.

3. A covering sheet comprising:

a laminate consisting of at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein and at least one dielectric layer having a permittivity lower than that of said magnetic material layer;

a ground conductor layer laminated on one surface of said laminate, one surface of said ground conductor layer being exposed to a free space; and

a plurality of via holes for passing conducting means for grounding said ground conductor layer to a ground path of a signal bus covered by the covering sheet,

said ground conductor layer, said signal bus and said ground path forming a triplate line structure.

4. The sheet as claimed in claim 3, wherein said dielectric layer is adjacent to said ground conductor layer.

5. The sheet as claimed in claim 3, wherein said magnetic material layer is adjacent to said ground conductor layer.

6. The sheet as claimed in claim 3, wherein said dielectric layer is a layer of solid dielectric material.

7. The sheet as claimed in claim 3, wherein said dielectric layer is mainly a layer of air.

8. A triplate line bus including an insulator circuit board, a micro-strip line formed on one surface of said insulator circuit board, a ground conductor formed on the other surface of said insulator circuit board, and a covering sheet covering said micro-strip line with a ground conductor positioned outside,

said covering sheet comprising at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein, a ground conductor layer laminated on one surface of said magnetic material layer, one surface of said ground conductor layer being exposed to a free space, and a plurality of via holes for passing conducting means for grounding said ground conductor layer,

said ground conductor being electrically connected to said ground conductor,

said ground conductor layer, said micro-strip line and said ground conductor forming a triplate line structure.

9. A signal bus for a computer having a triplate line structure, including an insulator circuit board, a micro-strip line formed on one surface of said insulator circuit board, a ground conductor formed on the other surface of said insulator circuit board, and a covering sheet applied on said micro-strip line with said ground conductor positioned outside,

said covering sheet comprising at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein, a ground conductor layer laminated on one surface of said magnetic material layer, one surface of said ground conductor layer being exposed to a free space, and a plurality of via holes for passing conducting means for grounding said ground conductor layer to said ground conductor,

said ground conductor layer, said micro-strip line and said ground conductor forming a triplate line structure.

10. A covering sheet comprising:

a magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein;

a dielectric layer being laminated on said magnetic material layer with one surface of the dielectric layer adjacent to said magnetic material layer and having a permittivity lower than that of said magnetic material layer; and

a ground conductor layer laminated on the other side of said dielectric layer;

one surface of said ground conductor layer being exposed to a free space; and

a plurality of via holes for passing conducting means for grounding said ground conductor layer to a ground path of a signal bus covered by the covering sheet,

said ground conductor layer, said signal bus and said ground path forming a triplate line structure.

11. The sheet as claimed in claim 10, wherein said dielectric layer is a layer of solid dielectric material.

12. The sheet as claimed in claim 10, wherein said dielectric layer is mainly a layer of air.

13. A triplate line bus including an insulator circuit board, a micro-strip line formed on one surface of said insulator circuit board, a first covering sheet covering said micro-strip line, and a second covering sheet covering the other surface of said insulator circuit board,

said first or second covering sheet comprising a laminate consisting of at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein and at least one dielectric layer having a permittivity lower than that of said magnetic material layer, and a ground conductor layer laminated on one surface of said laminate, one surface of said ground conductor layer being exposed to a free space,

said ground conductor layers of said first and second covering sheets being electrically connected to a ground conductor of said insulator circuit boards,

said ground conductor layer, said micro-strip line and said ground conductor forming a triplate line structure.

14. The triplate line bus as claimed in claim 13, wherein said ground conductor layers are connected to said ground conductor at a plurality of points.

15. The triplate line bus as claimed in claim 13, wherein said ground conductor layers are electrically connected to said ground conductor via a plurality of via holes passing through said sheet.

16. A covering structure of electronic circuits, including an insulator circuit board, an electronic circuit formed on one surface of said insulator circuit board, a ground conductor formed on the other surface of said insulator circuit board, and a covering sheet covering said electronic circuit,

said covering sheet comprising a laminate consisting of at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein and at least one dielectric layer having a permittivity lower than that of said magnetic material layer, and a ground conductor layer laminated on one surface of said laminate,

one surface of said ground conductor layer being exposed to a free space,

said ground conductor layer being electrically connected to said ground conductor,

said ground conductor layer, said electronic circuit and said ground path forming a triplate line structure.

17. The structure as claimed in claim 16, wherein said ground conductor layer is connected to said ground conductor at a plurality of points.

18. The structure as claimed in claim 16, wherein said ground conductor layer is electrically connected to said ground conductor via a plurality of via holes passing through said sheet.

19. A triplate line bus including an insulator circuit board, a micro-strip line formed on one surface of said insulator circuit board, a ground conductor formed on the other surface of said insulator circuit board, and a covering sheet covering said micro-strip line with said ground conductor positioned outside,

said covering sheet comprising a laminate consisting of at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein and at least one dielectric layer having a permittivity lower than that of said magnetic material layer, and a ground conductor layer laminated on one surface of said laminate, one surface of said ground conductor layer being exposed to a free space,

said ground conductor layer being electrically connected to said ground conductor,

said ground conductor layer, said micro-strip line and said ground conductor forming a triplate line structure.

20. The triplate line bus as claimed in claim 19, wherein said ground conductor layer is electrically connected to said ground conductor via a plurality of via holes passing through said sheet.

21. The triplate line bus as claimed in claim 19, wherein said ground conductor layer is connected to said ground conductor at a plurality of points.

22. A triplate line bus including an insulator circuit board, a micro-strip line formed on one surface of said insulator circuit board, a first covering sheet covering said micro-strip line, and a second covering sheet covering the other surface of said insulator circuit board,

said first or second covering sheet comprising at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein, a ground conductor layer laminated on one surface of said magnetic material layer, one surface of said ground conductor layer being exposed to a free space, and a plurality of via holes for passing conducting means for grounding said ground conductor layer to a ground conductor of said insulator circuit board,

said ground conductor layer, said micro-strip line and said ground conductor forming a triplate line structure.