Power feed and heat dissipating device for power semiconductor devices

• US 6,704,201 B2
• Filed: 10/29/2001
• Issued: 03/09/2004
• Est. Priority Date: 06/03/1999
• Status: Expired due to Fees

• Current Assignee: Tokyo R & D Co., Ltd.
• Original Assignee: Tokyo R & D Co., Ltd.
• Inventors: Kasuga, Nobuyuki
• Primary Examiner(s): THOMPSON, GREGORY D
• Application Number:
  US09/959,514
• Publication Number:
  US 20030047304A1
• Time in Patent Office: 862 Days
• Field of Search: 165/80.2, 165/185, 174/16.3, 257/706-707, 257/712-713, 257/666, 257/672, 257/787, 257/678, 257/693, 361/690, 361/704-710, 361/715, 361/717-722, 310/64, 310/71, 363/141, 363/144
• US Class Current: 361/704
• CPC Class Codes: H01L 25/11 the devices being of a type provided for in group H01L29/00
• CPC Class Codes: H01L 25/115 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H02K 11/33 Drive circuits, e.g. power electronics H02K11/38 takes precedence
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0263 High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board H05K1/0293 takes precedence
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 2201/10272 Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
• CPC Class Codes: H05K 2201/10492 Electrically connected to another device

Abstract

In an electric circuit using a plurality of power semiconductor devices 1, the power semiconductor devices have heat radiation metallic parts 5 to which the electrodes in the power semiconductor devices are electrically connected within a package of the semiconductors. Among the plurality of power semiconductor devices, the heat radiation metallic parts of those having electrodes of the same potential connected to the heat radiation metallic parts are conductively fixed to a single radiator 6 having conductivity. Thus, the radiators are used as a single connection terminal. Besides, the plurality of radiators are conductively fixed to a single heat radiating plate 7 having conductivity, and the heat radiating plate is used as a single connection terminal, or the radiator is electrically insulated and fixed to another radiator 11.

Claims

1. An electric supply and heat radiating apparatus, comprising:

a circuit board;

a plurality of power semiconductor devices mounted on said circuit board, each device having a drain electrode and a heat radiating metallic part electrically connected to said drain electrode within a package of said power semiconductor device; and

at least one first conductive radiator used as a connection terminal, wherein among said plurality of said power semiconductor devices, only said power semiconductor devices which include said drain electrodes having the same potential are electrically connected and secured to said first conductive radiator through said heat radiating metallic parts thereof.

2. The electric supply and heat radiating apparatus according to claim 1, which further comprises a conductive heat radiating plate to which said at least one first conductive radiator is electrically connected and fixed, said conductive heat radiating plate used as a connection terminal.

3. The electric supply and heat radiating apparatus according to claim 1, wherein said first conductive radiator is electrically insured and fixed to a second conductive radiator.

4. The electric supply and heat radiating apparatus according to claim 3, an area at which said first and second conductive radiators are fixed is greater than an area at which said first conductive radiator and said heat radiating metallic parts are fixed.

5. An electric supply and heat radiating apparatus, comprising:

a circuit board;

a plurality of power semiconductor devices mounted on said circuit board, each device having a drain electrode and a heat radiating metallic part electrically connected to said drain electrode within a package of said power semiconductor device;

at least one first conductive radiator used as a connection terminal, wherein among said plurality of said power semiconductor devices, only said power semiconductor devices which include said drain electrodes having the same potential are electrically connected and secured to said first conductive radiator through said heat radiating metallic parts thereof; and

a conductive heat radiating plate to which said at least one first conductive radiator is electrically connected and fixed, said conductive heat radiating plate used as a connection terminal and electrically insured and fixed to a second conductive radiator.