IC package with edge connect contacts

• US 6,704,204 B1
• Filed: 06/23/1998
• Issued: 03/09/2004
• Est. Priority Date: 06/23/1998
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Eskildsen, Steven R., Franz, Jeffrey C., Brannam, David S.
• Primary Examiner(s): Vigushin, John B.
• Assistant Examiner(s): DINH, TUAN T
• Application Number:
  US09/103,110
• Time in Patent Office: 2,086 Days
• Field of Search: 361/736-737, 361/752, 361/753, 361/754, 361/801-802, 361/459, 439/76.1, 439/64, 439/945, 439/946, 439/701, 439/70-71
• US Class Current: 361/737
• CPC Class Codes: H01L 23/32 Holders for supporting the complete device in operation, i.e. detachable fixtures H01L23/40 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01R 12/83 connected with pivoting of printed circuits or like after insertion
• CPC Class Codes: H01R 13/50 formed as an integral body H01R13/514 takes precedence
• CPC Class Codes: H01R 13/6485 Electrostatic discharge protection in general H05F1/00, for electric apparatus H05K9/0067
• CPC Class Codes: H01R 13/665 with built-in electronic circuit H01R13/70, H01R13/719 take precedence
• CPC Class Codes: H05K 5/026 having standardized interfaces flash memory cards G06K19/077
• CPC Class Codes: H05K 5/0286 Receptacles therefor, e.g. card slots, module sockets, card groundings

Abstract

An apparatus and method for allowing the lead pins of an integrated circuit (IC) package to provide the electrical interface between the IC package and a receptacle of the host data processing system is described. The present invention comprises an IC package housed within a card casing to form an IC card, with the leads from the IC package providing the electrical interface between the IC card and the data processing system into which the IC card is inserted. Thus, the present invention eliminates the need for a printed circuit board (PCB) and connector to provide the interconnection between the IC package and the data processing system.

Claims

1. An apparatus for use in a data processing device, comprising:

an integrated circuit (IC) package having a plurality of outer leads extended outwardly from the IC package;

a first receptacle for receiving the IC package, the first receptacle including a first opening to receive the plurality of outer leads when the IC package is inserted into the first receptacle through a second opening disposed away from the first opening; and

a second receptacle disposed on the data processing device for receiving the first receptacle, the second receptacle having a plurality of contacts,

wherein the plurality of outer leads of the IC package directly contact, via the first opening, with the plurality of contacts of the second receptacle respectively when the first receptacle is inserted into the second receptacle.

2. The apparatus of claim 1, wherein the first opening is a front opening.

3. The apparatus of claim 1, wherein the second opening is a back opening such that the IC package is inserted into the first receptacle from a back of the first receptacle.

4. The apparatus of claim 1, wherein the second opening is a bottom opening such that the IC package is inserted into the first receptacle from a bottom of the first receptacle using a rotating movement.

5. The apparatus of claim 1, wherein the first receptacle provides a physical and electrostatic discharge protection for the IC package.

6. The apparatus of claim 1, wherein the first receptacle further comprises at least one stop disposed at the second opening to securely hold the IC package within the first receptacle.

7. The apparatus of claim 1, wherein the first receptacle having the inserted IC package is removable from the second receptacle without soldering.

8. The apparatus of claim 1, wherein the second receptacle encapsulates at least a portion of the first receptacle when the first receptacle is inserted into the second receptacle.

9. The apparatus of claim 1, wherein the second receptacle is capable of being disposed on the data processing device via soldering and wherein the first receptacle does not directly contact with the data processing device when the first receptacle is inserted into the second receptacle.

10. A method for use in a data processing device, comprising:

providing an integrated circuit (IC) package having a plurality of outer leads extended outwardly from the IC package;

providing a first receptacle for receiving the IC package, the first receptacle including a first opening and a second opening disposed away from the first opening;

inserting the IC package into the first receptacle through the second opening, such that the first opening receives the plurality of outer leads of the IC package; and

inserting the first receptacle with the inserted IC package into a second receptacle disposed on the data processing device, the second receptacle having a plurality of contacts,

wherein the plurality of outer leads of the IC package directly contact, via the first opening, with the plurality of contacts of the second receptacle respectively when the first receptacle is inserted into the second receptacle.

11. The method of claim 10, wherein the first opening is a front opening.

12. The method of claim 10, wherein the second opening is a back opening such that the IC package is inserted into the first receptacle from a back of the first receptacle.

13. The method of claim 10, wherein the second opening is a bottom opening such that the IC package is inserted into the first receptacle from a bottom of the first receptacle using a rotating movement.

14. The method of claim 10, wherein the first receptacle provides a physical and electrostatic discharge protection for the IC package.

15. The method of claim 10, wherein the first receptacle further comprises at least one stop disposed at the second opening to securely hold the IC package within the first receptacle.

16. The method of claim 10, wherein the first receptacle having the inserted IC package is removable from the second receptacle without soldering.

17. The method of claim 10, wherein the second receptacle encapsulates at least a portion of the first receptacle when the first receptacle is inserted into the second receptacle.

18. The method of claim 10, wherein the second receptacle is capable of being disposed on the data processing device via soldering and wherein the first receptacle does not directly contact with the data processing device when the first receptacle is inserted into the second receptacle.