IC package with edge connect contacts
First Claim
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1. An apparatus for use in a data processing device, comprising:
- an integrated circuit (IC) package having a plurality of outer leads extended outwardly from the IC package;
a first receptacle for receiving the IC package, the first receptacle including a first opening to receive the plurality of outer leads when the IC package is inserted into the first receptacle through a second opening disposed away from the first opening; and
a second receptacle disposed on the data processing device for receiving the first receptacle, the second receptacle having a plurality of contacts, wherein the plurality of outer leads of the IC package directly contact, via the first opening, with the plurality of contacts of the second receptacle respectively when the first receptacle is inserted into the second receptacle.
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Abstract
An apparatus and method for allowing the lead pins of an integrated circuit (IC) package to provide the electrical interface between the IC package and a receptacle of the host data processing system is described. The present invention comprises an IC package housed within a card casing to form an IC card, with the leads from the IC package providing the electrical interface between the IC card and the data processing system into which the IC card is inserted. Thus, the present invention eliminates the need for a printed circuit board (PCB) and connector to provide the interconnection between the IC package and the data processing system.
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Citations
18 Claims
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1. An apparatus for use in a data processing device, comprising:
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an integrated circuit (IC) package having a plurality of outer leads extended outwardly from the IC package;
a first receptacle for receiving the IC package, the first receptacle including a first opening to receive the plurality of outer leads when the IC package is inserted into the first receptacle through a second opening disposed away from the first opening; and
a second receptacle disposed on the data processing device for receiving the first receptacle, the second receptacle having a plurality of contacts, wherein the plurality of outer leads of the IC package directly contact, via the first opening, with the plurality of contacts of the second receptacle respectively when the first receptacle is inserted into the second receptacle. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for use in a data processing device, comprising:
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providing an integrated circuit (IC) package having a plurality of outer leads extended outwardly from the IC package;
providing a first receptacle for receiving the IC package, the first receptacle including a first opening and a second opening disposed away from the first opening;
inserting the IC package into the first receptacle through the second opening, such that the first opening receives the plurality of outer leads of the IC package; and
inserting the first receptacle with the inserted IC package into a second receptacle disposed on the data processing device, the second receptacle having a plurality of contacts, wherein the plurality of outer leads of the IC package directly contact, via the first opening, with the plurality of contacts of the second receptacle respectively when the first receptacle is inserted into the second receptacle. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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Specification