Two stage cooling system employing thermoelectric modules

• US 6,705,089 B2
• Filed: 04/04/2002
• Issued: 03/16/2004
• Est. Priority Date: 04/04/2002
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Simons, Robert E., Ellsworth, Michael J. Jr., Chu, Richard C.
• Primary Examiner(s): Jiang, Chen Wen
• Application Number:
  US10/115,903
• Publication Number:
  US 20030188538A1
• Time in Patent Office: 712 Days
• Field of Search: 62/32, 623/32, 62/33, 62/37, 622/592, 165/104.33, 165/80.3, 165/80.4, 361/687, 361/689, 361/699, 361/688, 361/697, 361/695, 136/203, 136/204
• US Class Current: 62/3.2
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: F25B 2321/0251 by a gas
• CPC Class Codes: F25B 25/005 using primary and secondary systems
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H10N 10/13 characterised by the heat-exchanging means at the junction

Abstract

A cooling system is provided for cooling a heat generating component of an electronic device. The cooling system includes at least two cooling subsystems for a staged reduction of the temperature of a cooling fluid exposed to heat generated by the heat generated component. A first stage cooling subsystem reduces the temperature of the cooling fluid to ambient temperature or above, while a second stage cooling subsystem reduces the temperature of the cooling fluid exiting the first stage cooling subsystem to below ambient temperature. The first stage cooling subsystem is passive while the second stage cooling subsystem is active and can include one or more thermoelectric modules.

Claims

1. A cooling system for cooling a heat generating component using a cooling liquid, said cooling system comprising:

a first stage cooling subsystem, said first stage cooling subsystem reducing a temperature of the cooling liquid to ambient temperature or above;

a second stage cooling subsystem in fluid communication with said first stage cooling subsystem, said second stage cooling subsystem further reducing temperature of the cooling liquid exiting said first cooling subsystem to below ambient temperature;

wherein said first stage cooling subsystem comprises a first heat exchanger and said second stage cooling subsystem comprises a second heat exchanger, said second heat exchanger being an active heat exchanger, and wherein said active heat exchanger employs at least one thermoelectric module; and

a fan for producing a single airstream within the cooling system, said fan being axially aligned with said first stage cooling subsystem and said second stage cooling system, wherein said fan moves said single airstream serially over said first stage cooling system and said second stage cooling subsystem.

2. The cooling system of claim 1, wherein said first heat exchanger is a passive heat exchanger.

3. The cooling system of claim 2, wherein said passive heat exchanger is an air-cooled heat exchanger.

4. The cooling system of claim 3, wherein said air-cooled heat exchanger includes tubes configured to carry the cooling liquid and transfer heat from the cooling fluid to fins exposed to said single airstream.

5. A method for fabricating a cooling system for cooling an electronic device using a cooling liquid, said method comprising:

thermally coupling a heat transfer device to a heat generating component, said heat transfer device being configured to carry the cooling liquid;

positioning a first stage cooling subsystem in fluid communication with an output of said heat transfer device, said first stage cooling subsystem being configured to reduce a temperature of the cooling liguid to ambient temperature or above;

positioning a second stage cooling subsystem in fluid communication with an output of said first stage cooling subsystem, said second stage cooling subsystem being configured to reduce temperature of the cooling liquid exiting said first stage cooling subsystem below ambient temperature;

wherein said first stage cooling subsystem comprises a first heat exchanger and said second stage cooling subsystem comprises a second heat exchanger, said second heat exchanger being an active heat exchanger, and wherein said active heat exchanger employs at least one thermoelectric module and

providing a fan for producing a single airstream within the cooling system; and

wherein said method further comprises axially aligning said fan, said first stage cooling subsystem and said second stage cooling subsystem, wherein when in use, said fan moves said single airstream serially over said first stage cooling subsystem and said second stage cooling subsystem.

6. The method of claim 5, wherein said first heat exchanger is a passive heat exchanger.

7. The method of claim 6, wherein said passive heat exchanger is an air-cooled heat exchanger.

8. The method of claim 7, wherein said air-cooled heat exchanger includes tubes configured to carry the cooling liquid and transfer heat from the cooling fluid to fins exposed to said single airstream.