Transducer and method of manufacture

• US 6,705,511 B1
• Filed: 11/29/1999
• Issued: 03/16/2004
• Est. Priority Date: 05/28/1997
• Status: Expired due to Term

• Current Assignee: Synaptics (UK) Ltd. (Synaptics Incorporated)
• Original Assignee: Synaptics (UK) Ltd. (Synaptics Incorporated)
• Inventors: Ely, David T. E., Dames, Andrew N.
• Primary Examiner(s): Elve, M. Alexandra
• Assistant Examiner(s): DUNN, COLLEEN P
• Application Number:
  US09/424,706
• Time in Patent Office: 1,569 Days
• Field of Search: 228/180.5, 228/179.1, 228/178, 228/110.1, 228/111.5
• US Class Current: 228/180.5
• CPC Class Codes: G01B 3/004 Scales; Graduations
• CPC Class Codes: G01D 5/20 by varying inductance, e.g. by a movable armature

Abstract

A method of manufacturing a transducer used in sensing or generating magnetic fields in a position detector wherein the transducer has a substrate and a conductor fixed to the substrate in a predetermined pattern. A wire laying device controllably lays wire onto the substrate so as to form the predetermined pattern. Relative movement is caused between the laying device and the substrate, and the wire is bonded to the substrate as it is laid thereon.

Claims

1. A method of manufacturing a transducer having a substrate and a continuous conductor fixed to the substrate in three or more locations in a predetermined pattern, the conductor being for use in sensing or generating magnetic fields in a position detector, the method comprising the steps of:

providing a wire laying device for controllably laying a wire onto the substrate;

laying a continuous wire on the substrate to form said predetermined pattern of conductor on the substrate, using the laying device, by causing the relative movement between the laying device and the substrate; and

bonding the continuous wire to the substrate at three or more locations as it is laid on said substrate.

2. A method according to claim 1, wherein said bonding step bonds said continuous wire to said substrate at three or more discrete locations along the length of the wire.

3. A method according to claim 1, wherein said bonding step bonds said continuous wire to said substrate substantially along the entire length of the wire.

4. A method according to claim 1, wherein said laying step lays said pattern of wire on said substrate, which pattern of wire is more than 0.6 m long.

5. A method according to claim 1, wherein said bonding step uses said laying device to bond the wire to the substrate at said three or more locations.

6. A method according to claim 1, wherein said bonding step comprises the step of changing the physical state of a bonding material from a liquid to a solid.

7. A method according to claim 6, further comprising the step of changing the state of said bonding material from a solid to a liquid prior to changing the state of the bonding material from a liquid to a solid.

8. A method according to claim 7, wherein the physical state of said bonding material is changed from a solid state into a liquid state by applying energy to it.

9. A method according to claim 6, wherein said bonding material is initially provided on said substrate or on said wire.

10. A method according to claim 1, wherein said bonding step comprises the step of applying at least one of:

ultrasonic energy, heat energy and UV energy to the wire and/or to the substrate.

11. A method according to claim 1, wherein said laying step moves said laying device or said substrate.

12. A method according to claim 1, wherein said laying device has an outlet through which said wire passes during the laying of the wire on the substrate, and wherein said laying step is operable to rotate said outlet in dependence upon said predetermined pattern so that the direction of wire placement on said substrate is constant.

13. A method according to claim 1, wherein said predetermined pattern of conductor is a repetitive pattern of conductor which is continuously laid on the substrate.

14. A method according to claim 13, wherein said substrate is flexible, and wherein the method further comprises the step of coiling the part of the substrate which has already received the pattern of continuous wire.

15. A method according to claim 1, wherein said laying step is operable to lay said predetermined pattern of conductor along a linear path.

16. A method according to claim 15, said substrate being elongated and having a longitudinal axis, and wherein said laying step is operable to move said substrate along said longitudinal axis of said substrate.

17. A method according to claim 16, wherein said laying step is operable to move said substrate along said axis in predetermined discrete amounts.

18. A method according to claim 16, wherein said laying step uses pinch rollers to move said substrate along said axis.

19. A method according to claim 1, further comprising the steps of sensing the relative position of said substrate and said laying device and controlling the laying step using the sensed position.

20. A method according to claim 19, wherein said sensing step monitors features on said substrate.

21. A method according to claim 19, wherein said sensing step monitors the position of wire already laid on said substrate.

22. A method according to claim 19, further comprising the step of printing features on the substrate and wherein said sensing step monitors said printed features.

23. A method according to claim 22, wherein said printing step prints said features as the wire is being laid.

24. A method according to claim 22, wherein said printing step uses an ink jet or a bubble jet type printer.

25. A method according to claim 24, wherein said printer is located in the vicinity of said laying device.

26. A method according to claim 16, wherein said predetermined pattern of conductor is laid along a continuous path which is more than 2 m long.

27. A method according to claim 1, wherein said predetermined pattern of conductor is laid over a continuous path which is more than 0.6 m long.

28. A method according to claim 1, wherein said predetermined pattern of conductor is such that the resulting transducer is suitable for use in sensing position in an X, Y digitising tablet.

29. A method according to claim 1, wherein said laying step is operable to lay said predetermined pattern of conductor in a circular path.

30. A method according to claim 1, further comprising the steps of laying a protective layer over the wires after they have been bonded onto the substrate.

31. A method according to claim 30, further comprising the steps of laying and bonding a further pattern of wires onto the protective layer.

32. A method according to claim 1, wherein said laying device is operable to lay wire having a diameter in the range of 0.1 mm to 0.5 mm.

33. A method according to claim 1, wherein said laying device is operable to lay wire having a diameter of approximately 0.2 mm.

34. A method according to claim 1, wherein said providing step provides a plurality of laying devices each for laying a respective wire on said substrate, and wherein said laying step lays said plurality of wires on said substrate at the same time.

35. A method of manufacturing a transducer having a substrate and a continuous conductor fixed to the substrate in a predetermined pattern, the conductor being for use in sensing or generating magnetic fields in a position detector, the method comprising the steps of:

providing a wire laying device for controllably laying a wire onto the substrate;

causing the laying device to lay a continuous wire on the substrate to form said predetermined pattern of conductor on the substrate, by (i) sensing the current position of the wire laying device relative to the substrate;

(ii) comparing said current position with an expected position derived from said predetermined pattern; and

(iii) controlling the relative movement between said wire laying device and said substrate in dependence upon the result of said comparison step to cause said continuous wire to be laid on said substrate as said predetermined pattern of conductor; and

bonding the continuous wire to the substrate at three or more locations to form the transducer.

36. A method according to claim 35, wherein said bonding step bonds the wire to the substrate as it is being laid on the substrate.

37. A method of manufacturing a transducer having a substrate and a continuous conductor fixed to the substrate in a predetermined pattern, the conductor being for use in sensing or generating magnetic fields in a position detector, the method comprising the steps of:

providing a wire laying device for controllably laying a wire onto a softenable substrate; and

bonding a continuous wire on the substrate at three or more locations to form said predetermined pattern of conductor on the substrate by;

(i) causing the relative movement between the laying device and the substrate in order to locate the laying device at a first predetermined location on the substrate, determined in dependence upon said predetermined pattern;

(ii) using the laying device to hold the wire against the substrate at the first predetermined location;

(iii) bonding the wire to the substrate at said first predetermined location by temporarily softening the substrate at said first predetermined location by applying energy in the vicinity of said first predetermined location, so that when the substrate hardens it bonds to the wire;

(iv) repeating steps (i), (ii) and (iii) for at least two subsequent predetermined locations on the substrate, determined in dependence upon said predetermined pattern until said wire has been bonded on the substrate at three or more locations to form said predetermined pattern of conductor.