Transducer and method of manufacture
First Claim
1. A method of manufacturing a transducer having a substrate and a continuous conductor fixed to the substrate in three or more locations in a predetermined pattern, the conductor being for use in sensing or generating magnetic fields in a position detector, the method comprising the steps of:
- providing a wire laying device for controllably laying a wire onto the substrate;
laying a continuous wire on the substrate to form said predetermined pattern of conductor on the substrate, using the laying device, by causing the relative movement between the laying device and the substrate; and
bonding the continuous wire to the substrate at three or more locations as it is laid on said substrate.
3 Assignments
0 Petitions
Accused Products
Abstract
A method of manufacturing a transducer used in sensing or generating magnetic fields in a position detector wherein the transducer has a substrate and a conductor fixed to the substrate in a predetermined pattern. A wire laying device controllably lays wire onto the substrate so as to form the predetermined pattern. Relative movement is caused between the laying device and the substrate, and the wire is bonded to the substrate as it is laid thereon.
-
Citations
37 Claims
-
1. A method of manufacturing a transducer having a substrate and a continuous conductor fixed to the substrate in three or more locations in a predetermined pattern, the conductor being for use in sensing or generating magnetic fields in a position detector, the method comprising the steps of:
-
providing a wire laying device for controllably laying a wire onto the substrate;
laying a continuous wire on the substrate to form said predetermined pattern of conductor on the substrate, using the laying device, by causing the relative movement between the laying device and the substrate; and
bonding the continuous wire to the substrate at three or more locations as it is laid on said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
-
-
35. A method of manufacturing a transducer having a substrate and a continuous conductor fixed to the substrate in a predetermined pattern, the conductor being for use in sensing or generating magnetic fields in a position detector, the method comprising the steps of:
-
providing a wire laying device for controllably laying a wire onto the substrate;
causing the laying device to lay a continuous wire on the substrate to form said predetermined pattern of conductor on the substrate, by (i) sensing the current position of the wire laying device relative to the substrate;
(ii) comparing said current position with an expected position derived from said predetermined pattern; and
(iii) controlling the relative movement between said wire laying device and said substrate in dependence upon the result of said comparison step to cause said continuous wire to be laid on said substrate as said predetermined pattern of conductor; and
bonding the continuous wire to the substrate at three or more locations to form the transducer. - View Dependent Claims (36)
-
-
37. A method of manufacturing a transducer having a substrate and a continuous conductor fixed to the substrate in a predetermined pattern, the conductor being for use in sensing or generating magnetic fields in a position detector, the method comprising the steps of:
-
providing a wire laying device for controllably laying a wire onto a softenable substrate; and
bonding a continuous wire on the substrate at three or more locations to form said predetermined pattern of conductor on the substrate by;
(i) causing the relative movement between the laying device and the substrate in order to locate the laying device at a first predetermined location on the substrate, determined in dependence upon said predetermined pattern;
(ii) using the laying device to hold the wire against the substrate at the first predetermined location;
(iii) bonding the wire to the substrate at said first predetermined location by temporarily softening the substrate at said first predetermined location by applying energy in the vicinity of said first predetermined location, so that when the substrate hardens it bonds to the wire;
(iv) repeating steps (i), (ii) and (iii) for at least two subsequent predetermined locations on the substrate, determined in dependence upon said predetermined pattern until said wire has been bonded on the substrate at three or more locations to form said predetermined pattern of conductor.
-
Specification