Interface materials and methods of production and use thereof

• US 6,706,219 B2
• Filed: 05/07/2001
• Issued: 03/16/2004
• Est. Priority Date: 09/17/1999
• Status: Expired due to Term

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Nguyen, My
• Primary Examiner(s): Gupta, Yogendra N.
• Assistant Examiner(s): VIJAYAKUMAR, KALLAMBELLA M
• Application Number:
  US09/851,103
• Publication Number:
  US 20010038093A1
• Time in Patent Office: 1,044 Days
• Field of Search: 252/502, 252/511, 252/512, 252/518.1, 252/520.1, 252/520.3, 252/519, 252/514, 252/520.21, 106/1.18, 106/1.19, 106/1.21, 427/212, 427/222, 427/219, 528/10, 524/404, 524/413, 524/495, 524/439
• US Class Current: 252/511
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 1/203 Fluxing, i.e. applying flux onto surfaces
• CPC Class Codes: B23K 2101/42 Printed circuits
• CPC Class Codes: B23K 35/0244 Powders, particles or spheres; Preforms made therefrom
• CPC Class Codes: B23K 35/025 Pastes, creams, slurries
• CPC Class Codes: B23K 35/26 with the principal constituent melting at less than 400 degrees C
• CPC Class Codes: B23K 35/262 Sn as the principal constituent
• CPC Class Codes: B23K 35/3613 Polymers, e.g. resins
• CPC Class Codes: C08F 279/00 Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
• CPC Class Codes: C08F 279/02 on to polymers of conjugated dienes
• CPC Class Codes: C08K 3/08 Metals
• CPC Class Codes: C08K 9/02 Ingredients treated with inorganic substances
• CPC Class Codes: C08L 15/00 Compositions of rubber derivatives C08L11/00, C08L13/00 take precedence
• CPC Class Codes: C08L 2666/02 Organic macromolecular compounds, natural resins, waxes or and bituminous materials
• CPC Class Codes: C08L 51/04 grafted on to rubbers
• CPC Class Codes: C22C 1/0416 Aluminium-based alloys
• CPC Class Codes: C22C 1/0483 Alloys based on the low melting point metals Zn, Pb, Sn, Cd, In or Ga
• CPC Class Codes: C22C 26/00 Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
• CPC Class Codes: C22C 32/0084 carbon or graphite as the main non-metallic constituent
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: Y10T 428/24116 : Oblique to direction of web
• CPC Class Codes: Y10T 428/25 : Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
• CPC Class Codes: Y10T 428/256 : Heavy metal or aluminum or compound thereof
• CPC Class Codes: Y10T 428/28 : Web or sheet containing structurally defined element or component and having an adhesive outermost layer
• CPC Class Codes: Y10T 428/31504 : Composite [nonstructural laminate]
• CPC Class Codes: Y10T 428/31663 : As siloxane, silicone or silane
• CPC Class Codes: Y10T 428/31678 : Of metal

Abstract

An interface material comprising a resin mixture and at least one solder material is herein described. The resin material may comprise any suitable resin material, but it is preferred that the resin material be silicone-based comprising one or more compounds such as vinyl silicone, vinyl Q resin, hydride functional siloxane and platinum-vinylsiloxane. The solder material may comprise any suitable solder material, such as indium, silver, copper, aluminum and alloys thereof, silver coated copper, and silver coated aluminum, but it is preferred that the solder material comprise indium or indium-based compounds and/or alloys. The interface material, or polymer solder, has the capability of enhancing heat dissipation in high power semiconductor devices and maintains stable thermal performance. The interface material may be formulated by mixing the components together to produce a paste which may be applied by dispensing methods to any particular surface and cured at room temperature or elevated temperature. It can be also formulated as a highly compliant, cured, tacky elastomeric film or sheet for other interface applications where it can be preapplied, for example on heat sinks, or in any other interface situations.

Claims

1. An interface material for electronic devices comprising at least one resin material and at least about 50 weight percent of at least one solder material.

2. The interface material of claim 1, wherein the interface material further comprises at least one wetting enhancer.

3. The interface material of claim 1 wherein the at least one resin material comprises a silicone resin.

4. The interface material of claim 3, wherein the silicone resin comprises a vinyl terminated siloxane, a reinforcing additive, a crosslinker and a catalyst.

5. The interface material of claim 4, wherein the vinyl terminated siloxane is vinyl silicone.

6. The interface material of claim 4, wherein the reinforcing additive is vinyl Q resin.

7. The interface material of claim 4, wherein the crosslinker comprises a hydride functional siloxane.

8. The interface material of claim 4, wherein the catalyst comprises a platinum complex.

9. The interface material of claim 8, wherein the platinum complex is a platinum-vinylsiloxane compound.

10. The interface material of claim 2, wherein the wetting enhancer comprises an organo-titanite compound.

11. The interface material of claim 1, wherein the at least one solder material comprises an indium-based alloy or compound.

12. The interface material of claim 11, wherein the indium-based alloy or compound comprises InSn, InAg or In.

13. The interface material of claim 1, wherein the at least one solder material comprises a tin-based alloy or compound.

14. The interface material of claim 13, wherein the tin-based alloy or compound comprises SnAgCu or SnBi.

15. The interface material of claim 1, wherein the interface material comprises one of an aluminum or an aluminum-based alloy or compound.

16. The interface material of claim 1, further comprising gallium.

17. The interface material of claim 1, further comprising a filler material.

18. The interface material of claim 17, wherein the filler material comprises carbon micro fibers.

19. The interface material of claim 1, wherein the material has a viscosity that exceeds 450 poises.

20. The interface material of claim 1, wherein the material has a thermal impedance of less than 0.3 cm²°

C./w.

21. The interface material of claim 1, wherein the at least one resin material is also crosslinkable.

22. The interface material of claim 1, wherein the at least one solder material is present in an amount of at least about 60 weight percent.

23. The interface material of claim 22, wherein the at least one solder material is present in an amount of at least about 70 weight percent.

24. The interface material of claim 23, wherein the at least one solder material is present in an amount of at least about 80 weight percent.

33. A method of increasing the thermal conductivity of the interface material of claim 1 comprising incorporating therein carbon micro fibers and at least one thermally conductive filler.

34. A method according to claim 33 wherein said carbon micro fiber is present in an amount of at least about 0.5 wt. %, or in a ratio of carbon micro fibers to polymer of at least 0.05.

35. A method according to claim 33 further comprising additionally incorporating a filler comprising at least one of silver, copper, aluminum, and alloys thereof, boron nitride, aluminum nitride, silver coated copper, silver coated aluminum, and carbon fibers;

and mixtures thereof.

25. A dispensable paste of an interface comprising at least one resin material and at least about 50 weight percent of at least one solder material.

26. The dispensable paste of claim 25, wherein the paste further comprises at least one wetting enhancer.

27. An interface material for electronic devices comprising the paste of claim 25.

28. A method of making an interface material, comprising:

providing at least one resin material;

providing at least about 50 weight percent of at least one solder material; and

combining the at least one resin material with the at least one solder material to form the interface material.

29. The method of claim 28, further comprising adding at least one wetting enhancer to the interface material.

30. The method of claim 28, further comprising formulating a dispensable paste of the interface material.

31. The method of claim 29 further comprising formulating a dispensable paste of the interface material.

32. The method of claim 28, further comprising molding said interface material as a sheet or film capable of being cut to size and applied as an interface between components in an electronic device.