Optical reflective structures and method for making
First Claim
1. A method of constructing an electronic circuit assembly comprising the steps of:
- a) forming at least one electrode on a substrate;
b) forming a layer of undercladding material upon the substrate and over the electrode;
c) forming a wave guide core layer on said layer of cladding material;
d) patterning said wave guide layer to produce at least one optical wave guide and exposed undercladding material;
e) forming a layer of overcladding material upon the exposed undercladding material and over the optical wave guide;
f) forming at least one via aperture through said overcladding material and said undercladding material; and
g) disposing a conductive material in said via aperture to produce an electronic circuit assembly.
1 Assignment
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Accused Products
Abstract
A method of constructing an electronic circuit assembly comprising forming at least one electrode on a substrate; forming a layer of undercladding material upon the substrate and over the electrode; and forming a wave guide core layer on the layer of cladding material. The wave guide layer is patterned to produce at least one optical wave guide and exposed undercladding material. The method of constructing further includes forming a layer of overcladding material upon the exposed undercladding material and over the optical wave guide; forming at least one via aperture through the overcladding material and the undercladding material; and disposing a conductive material in the via aperture to produce an electronic circuit assembly.
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Citations
38 Claims
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1. A method of constructing an electronic circuit assembly comprising the steps of:
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a) forming at least one electrode on a substrate;
b) forming a layer of undercladding material upon the substrate and over the electrode;
c) forming a wave guide core layer on said layer of cladding material;
d) patterning said wave guide layer to produce at least one optical wave guide and exposed undercladding material;
e) forming a layer of overcladding material upon the exposed undercladding material and over the optical wave guide;
f) forming at least one via aperture through said overcladding material and said undercladding material; and
g) disposing a conductive material in said via aperture to produce an electronic circuit assembly. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of constructing an electronic circuit assembly comprising the steps of:
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a) forming at least one electrode on a substrate;
b) disposing an electro-optic device on the substrate;
c) forming a layer of undercladding material upon the substrate and over the electrode and the electro-optic device;
d) disposing a second electrode on the layer of undercladding material;
e) disposing an intermediate layer of cladding material over exposed portions of the layer of undercladding material and over the second electrode;
f) forming a wave guide core layer on said layer of cladding material;
g) patterning said wave guide layer to produce at least one optical wave guide and exposed undercladding material;
h) forming a layer of overcladding material upon the exposed undercladding material and over the optical wave guide;
i) forming at least one via aperture through said overcladding material and said undercladding material; and
j) disposing a conductive material in said via aperture to produce an electronic circuit assembly. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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32. A method of constructing an electronic circuit assembly comprising the steps of:
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a) forming a layer of undercladding material upon a first substrate;
b) forming a wave guide core layer on said layer of cladding material;
c) patterning said wave guide layer to produce at least one optical wave guide and exposed undercladding material;
d) forming a layer of overcladding material upon the exposed undercladding material;
e) forming at least one via aperture through said overcladding material and said undercladding material;
f) disposing a conductive material in said via aperture leaving a first portion of the conductive material exposed; and
g) coupling the first portion of the conductive material to a second substrate to produce an electronic circuit. - View Dependent Claims (33, 34, 35, 36, 37)
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38. A method of constructing an electronic circuit assembly comprising the steps of:
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a) forming a layer of undercladding material upon a first substrate;
b) forming a wave guide core layer on said layer of cladding material;
c) patterning said wave guide layer to produce at least one optical wave guide and exposed undercladding material;
d) forming a layer of overcladding material upon the exposed undercladding material and over the optical wave guide;
e) disposing an electrode on the layer of overcladding material;
f) disposing an electro-optic device on the layer of overcladding material;
g) depositing an intermediate layer of cladding material over exposed overcladding material and over the electrode and the electro-optic device;
h) removing a portion of the intermediate layer of cladding material and a portion of a top of the electrode until a plane along the top of the electro-optic device registers with a residual electrode surface and a residual cladding surface respectively remaining after removal of the portion of the top of the electrode and the portion of the intermediate layer of cladding material;
i) disposing a second electrode on the residual electrode surface;
j) coupling the second electrode to a second substrate;
k) removing the first substrate to expose the undercladding material;
l) forming at least one via aperture through said overcladding material and said undercladding material; and
m) disposing a conductive material in said via aperture to produce an electronic circuit assembly.
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Specification