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Method of making a micromechanical device

  • US 6,706,548 B2
  • Filed: 01/08/2002
  • Issued: 03/16/2004
  • Est. Priority Date: 01/08/2002
  • Status: Expired due to Term
First Claim
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1. A method of making a microelectronic device comprising the steps of:

  • providing a substrate;

    forming an input signal line over the substrate;

    forming an output signal line over the substrate and spaced apart from the input signal line;

    forming a first sacrificial layer over the input signal line and the output signal line;

    removing a portion of the first sacrificial layer over the input signal line to form a first opening and over the output signal line to form a second opening;

    forming a second sacrificial layer over the first sacrificial layer, the first opening, and the second opening, wherein a first recess and a second recess are formed over the first opening and the second opening; and

    forming a conductive layer over a portion of the second sacrificial layer, the first recess, and the second recess, wherein the step of forming the second sacrificial layer comprises forming a second polyimide layer.

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