Method of making a micromechanical device
First Claim
1. A method of making a microelectronic device comprising the steps of:
- providing a substrate;
forming an input signal line over the substrate;
forming an output signal line over the substrate and spaced apart from the input signal line;
forming a first sacrificial layer over the input signal line and the output signal line;
removing a portion of the first sacrificial layer over the input signal line to form a first opening and over the output signal line to form a second opening;
forming a second sacrificial layer over the first sacrificial layer, the first opening, and the second opening, wherein a first recess and a second recess are formed over the first opening and the second opening; and
forming a conductive layer over a portion of the second sacrificial layer, the first recess, and the second recess, wherein the step of forming the second sacrificial layer comprises forming a second polyimide layer.
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Accused Products
Abstract
A method of making a micromechanical device including forming recesses (28) using two sacrificial layers (22 and 27). A first sacrificial layer (22) is formed over an input signal line (16) and an output signal line (17). A portion of the first sacrificial layer (22) is removed to form openings (26) over the input signal line (16) and the output signal line (17). A second sacrificial layer (27) is formed over the first sacrificial layer (22) and openings (26) to form recesses (28) over the openings (26). A conductive layer (32) is formed over the second sacrificial layer (27) and the recesses (28). The conductive layer (32) serves as a shorting bar of a cantilever beam structure that couples input signal line (16) to output signal line (17) during operation.
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Citations
11 Claims
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1. A method of making a microelectronic device comprising the steps of:
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providing a substrate;
forming an input signal line over the substrate;
forming an output signal line over the substrate and spaced apart from the input signal line;
forming a first sacrificial layer over the input signal line and the output signal line;
removing a portion of the first sacrificial layer over the input signal line to form a first opening and over the output signal line to form a second opening;
forming a second sacrificial layer over the first sacrificial layer, the first opening, and the second opening, wherein a first recess and a second recess are formed over the first opening and the second opening; and
forming a conductive layer over a portion of the second sacrificial layer, the first recess, and the second recess, wherein the step of forming the second sacrificial layer comprises forming a second polyimide layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
forming a photoresist layer over the first sacrificial layer, patterning the photoresist layer to use as a mask to form the first opening and the second opening, removing the photoresist layer prior to the step of forming the second sacrificial layer.
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7. The method of claim 1, wherein the step of removing a portion of the first sacrificial layer comprising using a dry etch.
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8. The method of claim 1, wherein the step of forming the second sacrificial layer comprises the first recess and the second recess being formed in absence of an etch step.
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9. A method of making a microelectronic device comprising the steps of:
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providing a substrate;
forming an input signal line over the substrate;
forming an output signal line over the substrate and spaced apart from the input signal line;
forming a first sacrificial layer over the input signal line and the output signal line;
removing a portion of the first sacrificial layer over the input signal line to form a first opening and over the output signal line to form a second opening;
forming a second sacrificial layer over the first sacrificial layer, the first opening, and the second opening, wherein a first recess and a second recess are formed over the first opening and the second opening; and
forming a conductive layer over a portion of the second sacrificial layer, the first recess, and the second recess, further comprising the steps of;
forming a dielectric layer over the second sacrificial layer and the conductive layer; and
removing the first sacrificial layer and the second sacrificial layer to form a cantilever beam structure comprised of the conductive layer and the dielectric layer above the input signal line and the output signal line.
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10. A method of making a microelectronic device comprising the steps of:
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providing a substrate;
forming an input signal line and an output signal line over the substrate;
forming a first sacrificial layer over the substrate, the input signal line and the output signal line;
heating the first sacrificial layer;
dry etching a portion of the first sacrificial layer over the input signal line to form a first opening and over the output signal line to form a second opening;
forming a second sacrificial layer over the first sacrificial layer, the first opening, and the second opening to form a fist recess over the first opening and a second recess over the second opening, whereby the first recess and the second recess have rounded edges; and
heating the second sacrificial layer;
forming a conductive layer over the second sacrificial layer, the first recess, and the second recess;
forming a dielectric layer over the conductive layer and the second sacrificial layer;
removing the first and the second sacrificial layers to create a cantilever beam comprised of the dielectric layer and the conductive layer. - View Dependent Claims (11)
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Specification