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Bumped integrated circuits for optical applications

  • US 6,707,148 B1
  • Filed: 05/21/2002
  • Issued: 03/16/2004
  • Est. Priority Date: 05/21/2002
  • Status: Active Grant
First Claim
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1. An optical and electrical apparatus comprising:

  • a packaged integrated circuit that includes, an integrated circuit having a first surface and a second surface, the first surface having a first set of light emitting or sensing devices and a plurality of bond pads;

    a conductive bump formed on each of the respective bond pads;

    a clear molding material that encapsulates the integrated circuit and a portion of each conductive bump such that each conductive bump is partially exposed through the clear molding material, whereby light can pass through the clear molding material and reach the first set of light emitting or sensing devices; and

    an electrical substrate having a plurality of electrical contact points and a first aperture wherein the packaged integrated circuit is positioned together with the electrical substrate wherein at least some of the conductive bumps are connected to respective electrical contact points and wherein the first aperture is located over the first set of light emitting or sensing devices.

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