Bumped integrated circuits for optical applications
First Claim
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1. An optical and electrical apparatus comprising:
- a packaged integrated circuit that includes, an integrated circuit having a first surface and a second surface, the first surface having a first set of light emitting or sensing devices and a plurality of bond pads;
a conductive bump formed on each of the respective bond pads;
a clear molding material that encapsulates the integrated circuit and a portion of each conductive bump such that each conductive bump is partially exposed through the clear molding material, whereby light can pass through the clear molding material and reach the first set of light emitting or sensing devices; and
an electrical substrate having a plurality of electrical contact points and a first aperture wherein the packaged integrated circuit is positioned together with the electrical substrate wherein at least some of the conductive bumps are connected to respective electrical contact points and wherein the first aperture is located over the first set of light emitting or sensing devices.
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Abstract
An optical integrated circuit application where the integrated circuit is packaged in a clear molding material and is attached to a printed circuit board having an aperture is described. The integrated circuit senses and/or emits light through the clear molding material and through the aperture in the printed circuit board.
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Citations
13 Claims
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1. An optical and electrical apparatus comprising:
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a packaged integrated circuit that includes, an integrated circuit having a first surface and a second surface, the first surface having a first set of light emitting or sensing devices and a plurality of bond pads;
a conductive bump formed on each of the respective bond pads;
a clear molding material that encapsulates the integrated circuit and a portion of each conductive bump such that each conductive bump is partially exposed through the clear molding material, whereby light can pass through the clear molding material and reach the first set of light emitting or sensing devices; and
an electrical substrate having a plurality of electrical contact points and a first aperture wherein the packaged integrated circuit is positioned together with the electrical substrate wherein at least some of the conductive bumps are connected to respective electrical contact points and wherein the first aperture is located over the first set of light emitting or sensing devices. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An optical and electrical apparatus comprising:
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a packaged integrated circuit that includes, an integrated circuit having a first surface and a second surface, the first surface having a first and second set of light emitting or sensing devices and a plurality of bond pads;
a conductive bump formed on each of the respective bond pads;
a clear molding material that encapsulates the integrated circuit and a portion of each conductive bump such that each conductive bump is partially exposed through the clear molding material, whereby light can pass through the clear molding material and reach the first set of light emitting or sensing devices; and
an electrical substrate having a plurality of electrical contact points and a first and second aperture wherein the packaged integrated circuit is positioned on the electrical substrate wherein at least some of the conductive bumps are connected to respective electrical contact points and wherein the first and second apertures are located respectively over the first and second set of light emitting or sensing devices. - View Dependent Claims (9, 10, 11, 12, 13)
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Specification