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Method of eliminating uncontrolled voids in sheet adhesive layer

  • US 6,707,163 B2
  • Filed: 04/13/2001
  • Issued: 03/16/2004
  • Est. Priority Date: 04/13/2001
  • Status: Expired due to Term
First Claim
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1. For use in an integrated circuit package, an adhesive layer for affixing one package component to another package component comprising:

  • an adhesive material region; and

    at least one venting slot extending within the adhesive material region from a region proximate to a central region of said adhesive material region towards a side or corner of a periphery of said adhesive material region, the at least one venting slot for controlling a size and location of voids between said adhesive material region and components joined by said adhesive material region during packaging.

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