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Semiconductor wafer edge marking

  • US 6,710,364 B2
  • Filed: 06/20/2002
  • Issued: 03/23/2004
  • Est. Priority Date: 09/24/1999
  • Status: Active Grant
First Claim
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1. A system for reading identification information from the edges of semiconductor wafers, comprising:

  • a wafer carrier, for retaining one or more wafers, and having an opening through which an edge of the one or more wafers retained therein is visible; and

    a sensor, for sensing reflected light from an edge of a wafer retained in the wafer carrier.

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