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Leadless chip carrier with embedded inductor

  • US 6,710,433 B2
  • Filed: 08/14/2001
  • Issued: 03/23/2004
  • Est. Priority Date: 11/15/2000
  • Status: Expired due to Term
First Claim
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1. A structure comprising:

  • a substrate having a top surface for receiving a die;

    a conductor patterned on said top surface of said substrate, said conductor having a first terminal and a second terminal, each of said first and second terminals situated on said top surface of said substrate, said first terminal of said conductor being adapted for connection to a first substrate signal bond pad, said first substrate signal bond pad situated on said top surface of said substrate and said second terminal of said conductor being adapted for connection to a first die signal bond pad, said first die signal bond pad situated on said top surface of said substrate;

    a printed circuit board attached to a bottom surface of said substrate;

    at least one via in said substrate;

    said at least one via providing an electrical connection between a second die signal bond pad and said printed circuit board.

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