Leadless chip carrier with embedded inductor
First Claim
1. A structure comprising:
- a substrate having a top surface for receiving a die;
a conductor patterned on said top surface of said substrate, said conductor having a first terminal and a second terminal, each of said first and second terminals situated on said top surface of said substrate, said first terminal of said conductor being adapted for connection to a first substrate signal bond pad, said first substrate signal bond pad situated on said top surface of said substrate and said second terminal of said conductor being adapted for connection to a first die signal bond pad, said first die signal bond pad situated on said top surface of said substrate;
a printed circuit board attached to a bottom surface of said substrate;
at least one via in said substrate;
said at least one via providing an electrical connection between a second die signal bond pad and said printed circuit board.
3 Assignments
0 Petitions
Accused Products
Abstract
One embodiment comprises a substrate having a top surface for receiving a semiconductor die. According to a disclosed embodiment, an inductor is patterned on the top surface of the substrate. The inductor is easily accessible by connecting its first and second terminals to, respectively, a substrate signal bond pad and a semiconductor die signal bond pad. In another disclosed embodiment, an inductor is fabricated within the substrate. The inductor comprises via metal segments connecting interconnect metal segments on the top and bottom surfaces of the substrate. The first and second terminals of the inductor are easily accessible through first and second substrate signal bond pads. One embodiment comprises at least one via in the substrate. The at least one via provides an electrical connection between a signal bond pad of the semiconductor die and a printed circuit board attached to the bottom surface of the substrate.
38 Citations
20 Claims
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1. A structure comprising:
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a substrate having a top surface for receiving a die;
a conductor patterned on said top surface of said substrate, said conductor having a first terminal and a second terminal, each of said first and second terminals situated on said top surface of said substrate, said first terminal of said conductor being adapted for connection to a first substrate signal bond pad, said first substrate signal bond pad situated on said top surface of said substrate and said second terminal of said conductor being adapted for connection to a first die signal bond pad, said first die signal bond pad situated on said top surface of said substrate;
a printed circuit board attached to a bottom surface of said substrate;
at least one via in said substrate;
said at least one via providing an electrical connection between a second die signal bond pad and said printed circuit board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A structure comprising:
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a substrate having a top surface for receiving a die;
a conductor patterned within said substrate, said conductor comprising an inductor, said conductor having a first terminal and second terminal, each of said first and second terminals situated on said top surface of said substrate, a first substrate signal bond pad being said first terminal of said conductor and a second substrate signal bond pad being said second terminal of said conductor;
a printed circuit board attached to a bottom surface of said substrate;
at least one via in said substrate;
said at least one via providing an electrical connection between a die signal bond pad and said printed circuit board. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification