Method for adding redundant vias on VLSI chips
First Claim
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1. A program product, which, when executed by a processor, performs a method for replacement of single vias by redundant vias on a semiconductor chip, comprising the steps of:
- determining a value for each single via on said chip indicative of a magnitude of a delay anomaly resultant from a resistive defect in said single via;
replacing each single via with a redundant via if wiring area is available and no other single via contends for said area;
comparing said value for each contending single via in a plurality of contending single vias in an area of contention where no more than one redundant via can be created; and
replacing with a redundant via the contending single via in the plurality of contending single vias in the area of contention for which said value indicates the largest said delay anomaly would be caused by a resistive defect in said single via.
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Abstract
A method is shown which replaces single vias with redundant vias on candidate signals on a semiconductor integrated circuit chip. Where limited space prevents such replacement on more than one signal wire, the method assigns priority to the via through which more current must flow to charge or discharge capacitance. This prioritization reduces the magnitude of delay anomalies arising from vias containing process related resistance defects.
34 Citations
6 Claims
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1. A program product, which, when executed by a processor, performs a method for replacement of single vias by redundant vias on a semiconductor chip, comprising the steps of:
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determining a value for each single via on said chip indicative of a magnitude of a delay anomaly resultant from a resistive defect in said single via;
replacing each single via with a redundant via if wiring area is available and no other single via contends for said area;
comparing said value for each contending single via in a plurality of contending single vias in an area of contention where no more than one redundant via can be created; and
replacing with a redundant via the contending single via in the plurality of contending single vias in the area of contention for which said value indicates the largest said delay anomaly would be caused by a resistive defect in said single via. - View Dependent Claims (2, 3, 4, 5, 6)
computing delays and timing margins for each signal on said chip; and
removing all single vias on signals having less than a predetermined amount of timing margin from consideration for replacement with redundant vias.
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4. The program product of claim 1, wherein the step of determining said value further comprises the steps of:
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determining for each single via an amount of capacitance which must be charged or discharged by current flowing through said single via; and
assigning said amount, or a quantity indicative of said amount, to said value.
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5. The program product of claim 1, wherein the step of determining said value comprises the steps of:
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traversing each signal wire, starting at a driver on said wire;
incrementing a counter each time a single via is traversed in a direction traveling away from said driver; and
assigning the counter, or a quantity proportional to said counter, to said value for each single via as said wire is traversed.
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6. The program product of claim 1, wherein the step of determining said value further comprises the steps of:
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tracing each signal wire backwards from each receiver on said signal wire;
counting the total number of all vias traversed from all receivers on said wire to each instant single via, including vias traversed on all branches of said signal wire from all receivers to said instant single via; and
assigning said count, or a number proportional to said count, to said value for each single via.
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Specification