Thin alkali metal film member and method of producing the same

• US 6,713,216 B2
• Filed: 06/18/2001
• Issued: 03/30/2004
• Est. Priority Date: 07/19/2000
• Status: Expired due to Fees

• Current Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Original Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Inventors: Ota, Nobuhiro, Kugai, Hirokazu, Yamanaka, Shosaku
• Primary Examiner(s): CHANEY, CAROL DIANE
• Application Number:
  US09/884,632
• Publication Number:
  US 20020028383A1
• Time in Patent Office: 1,016 Days
• Field of Search: 429/218.1, 429/231.95, 429/162, 296/235
• US Class Current: 429/231.95
• CPC Class Codes: C23C 14/14 Metallic material, boron or silicon
• CPC Class Codes: C23C 14/564 Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
• CPC Class Codes: H01M 10/052 Li-accumulators
• CPC Class Codes: H01M 10/0562 Solid materials
• CPC Class Codes: H01M 4/0404 by coating on electrode collectors
• CPC Class Codes: H01M 4/0421 involving vapour deposition
• CPC Class Codes: H01M 4/0423 Physical vapour deposition
• CPC Class Codes: H01M 4/0426 Sputtering
• CPC Class Codes: H01M 4/134 Electrodes based on metals, Si or alloys
• CPC Class Codes: H01M 4/1395 of electrodes based on metals, Si or alloys
• CPC Class Codes: H01M 4/38 of elements or alloys
• CPC Class Codes: H01M 4/383 Hydrogen absorbing alloys
• CPC Class Codes: H01M 4/40 Alloys based on alkali metals
• CPC Class Codes: H01M 4/66 Selection of materials
• CPC Class Codes: Y02E 60/10 Energy storage using batteries
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49115 including coating or impregnating

Abstract

A member having a lithium metal thin film is provided, which is extremely thin, uniform, and not degraded by air. The member includes a substrate and a thin lithium metal film formed on the substrate by a vapor deposition method. The thin film typically has a thickness of 0.1 μm to 20 μm. The substrate is typically made of a metal, an alloy, a metal oxide, or carbon. The substrate typically has a thickness of 1 μm to 100 μm. The member is used as an electrode member for a lithium cell.

Claims

1. A thin alkali metal film member, comprising:

a substrate; and

a thin alkali metal film formed directly on said substrate by vapor deposition of a material selected from the group consisting of alkali metals and alkali metal alloys, wherein said thin alkali metal film has a film thickness within the range of 0.1 μ

m to 20 μ

m, wherein an in-plane thickness variation range of said thin alkali metal film is within ±

30% of said film thickness, and wherein said substrate is made of a material selected from the group consisting of copper, nickel, aluminum, iron, niobium, titanium, tungsten, indium, molybdenum, magnesium, alloys composed of at least two metals from said group, stainless steel, and electrically conductive carbon.

2. The thin alkali metal film member according to claim 1, wherein said thin alkali metal film has a thickness of 1 μ

m to 10 μ

m.

3. The thin alkali metal film member according to claim 1, wherein said substrate has a thickness of 1 μ

m to 100 μ

m.

4. The thin alkali metal film member according to claim 1, wherein said thin alkali metal film is made of a material selected from the group consisting of lithium and lithium alloys.

5. The thin alkali metal film member according to claim 4, constructed as an electrode for a lithium cell.

6. A method of producing a thin alkali metal film member, comprising the following steps:

(a) preparing a substrate of a material selected from the group consisting of copper, nickel, aluminum, iron, niobium, titanium, tungsten, indium, molybdenum, magnesium, alloys composed of at least two metals from said group, stainless steel, and electrically conductive carbon,

(b) vapor depositing directly on said substrate a thin alkali metal film made of a source material selected from the group consisting of alkali metals and alkali metal alloys, and

(c) continuing said vapor depositing step until said thin alkali metal film has a film thickness within the range of 0.1 μ

m to 20 μ

m and an in-plane thickness variation range of ±

30% of said film thickness.

7. The method according to claim 6, wherein said vapor depositing step is any step selected from the group consisting of sputtering, vacuum evaporation, laser ablation, and ion plating.

8. The method according to claim 6, wherein said vapor deposition method is carried out in a vacuum of not greater than 1.33×

10<sup>−

4</sup> Pa (1×

10<sup>−

6</sup> Torr).

9. The method according to claim 6, wherein said step of vapor depositing is performed in a gas atmosphere selected from the group consisting of helium, neon, argon, krypton, and a mixture gas of two or more gases from said group.

10. The method according to claim 9, wherein said gas atmosphere has a purity of at least 99.99%.

11. The method according to claim 6, comprising the further steps of:

(d) enclosing said source material in a container and closing said container to provide a closed container holding said source material,

(e) placing said closed container with said source material held inside said closed container, into an auxiliary chamber (4) of a thin film deposition system,

(f) evacuating said auxiliary chamber (4) to form an evacuated chamber,

(g) opening said closed container and removing said source material from said now open container inside said evacuated chamber, and

(h) transferring said source material from said evacuated chamber into said thin film deposition system and then performing said vapor depositing step (b) in said thin film deposition system to produce said thin alkali metal film member.

12. The method according to claim 11, further comprising introducing into said evacuated chamber and into said thin film deposition system a gas selected from the group consisting of helium, nitrogen, neon, argon, krypton, a mixture gas of two or more gases from said group, and dry air having a dew point of −

500°

C. or lower, when said source material is taken out of said container in said auxiliary chamber and transferred into said thin film deposition system.

13. The method according to claim 6, further comprising removing said thin alkali metal film member from said thin film deposition system into an evacuated space for avoiding exposing said thin alkali metal film member to air, placing said thin alkali metal film member into a closable container in said evacuated space, and closing said closable container.

14. The method according to claim 13, further comprising introducing into said evacuated space and into said thin film deposition system a gas selected from the group consisting of helium, nitrogen, neon, argon, krypton, a mixture gas of two or more gases from said group, and dry air having a dew point of −

50°

C. or lower, when said thin alkali metal film member is transferred into said evacuated space and placed into said closable container.

15. The method according to claim 6, wherein said source material for said thin alkali metal film is selected from the group consisting of lithium and lithium alloys for producing a negative electrode for a lithium cell.

16. The method according to claim 15, further comprising forming an inorganic solid electrolyte layer on said thin alkali metal film for producing said negative electrode for said lithium cell.

17. The method according to claim 16, further comprising making said inorganic solid electrolyte layer of a material containing lithium within the range of 30% to 65% by an atomic percentage, sulfur, and at least one or more elements selected from the group consisting of phosphorus, silicon, boron, germanium, and gallium.

18. The method according to claim 16, wherein said inorganic solid electrolyte layer further contains at least one element selected from the group consisting of oxygen and nitrogen.

19. The method according to claim 16, wherein said inorganic solid electrolyte layer has an ionic conductance of at least 1×

10<sup>−

4</sup> S/cm at 25°

C.