Compact thermosiphon with enhanced condenser for electronics cooling

• US 6,714,413 B1
• Filed: 10/15/2002
• Issued: 03/30/2004
• Est. Priority Date: 10/15/2002
• Status: Expired due to Term

• Current Assignee: Gula Consulting Limited Liability Company (Intellectual Ventures LLC)
• Original Assignee: Delphi Technologies, Inc. (Aptiv PLC)
• Inventors: Ghosh, Debashis, Bhatti, Mohinder Singh, Reyzin, Ilya
• Primary Examiner(s): Thompson, Gregory D.
• Application Number:
  US10/271,630
• Publication Number:
  US 20040070941A1
• Time in Patent Office: 532 Days
• Field of Search: 622/592, 174/15-- 1, 165/104.21, 165/104.26, 165/104.33, 165/80.3, 165/80.4, 257/714-716, 361/687, 361/694-701, 361/703, 361/710, 361/715
• US Class Current: 361/700
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28F 1/126 consisting of zig-zag shaped fins F28F1/105 takes precedence
• CPC Class Codes: F28F 3/02 Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations F28F3/08 takes precedence
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat sink assembly for cooling an electronic device comprises a fan housed in a shroud, the fan including a hub and fan blades extending therefrom for causing an axially directed airflow through the shroud upon rotation of the fan blades. A thermosiphon comprises an evaporator defining an evaporating chamber containing a working fluid therein and further including a condenser mounted thereabove. The thermosiphon is positioned at one end of the shroud such that the fan is aligned with the condenser for directing the axial airflow therethrough. The condenser includes a base having an upper surface and a plurality of fins extending substantially upwardly from the upper surface. The condenser also includes a plurality of tubes forming a tube grouping. Each tube having an opening in fluid communication with the evaporator and for receiving and condensing vapor of the working fluid received from the evaporator. The tubes are axially aligned with the airflow and are laterally positioned such that a lateral width of the tube grouping is approximately equal to a width of the hub and substantially in lateral alignment therewith.

Claims

1. A heat sink assembly for cooling an electronic device, said heat sink assembly comprising:

a fan housed in a shroud, said fan including a hub having a diameter “

H” and

fan blades extending therefrom for causing an axially directed airflow through said shroud upon rotation of said fan blades; and

a thermosiphon comprising an evaporator defining an evaporating chamber containing a working fluid therein and a condenser mounted thereabove, said thermosiphon positioned at one end of said shroud such that said fan is aligned with said condenser for directing said axial airflow therethrough;

wherein;

said condenser including a base having an upper surface and having a plurality of fins extending substantially upwardly from said upper surface and further including a plurality of tubes forming a tube grouping, each said tube having an opening in fluid communication with said evaporator and for receiving and condensing vapor of said working fluid from said evaporator, said tubes being axially aligned with said airflow and laterally positioned such that a lateral width of said tube grouping is approximately equal to a width of said fan hub and substantially in lateral alignment therewith.

2. The heat sink assembly according to claim 1 wherein said upwardly extending fins are affixed to said upper surface of said base to conduct heat from said base to said upwardly extending fins.

3. The heat sink assembly according to claim 2 wherein said upwardly extending fins are integrally formed with said base.

4. The heat sink assembly according to claim 2 wherein said upwardly extending fins are accordion-like convoluted fins.

5. The heat sink assembly according to claim 1 wherein said upwardly extending fins from said base have a height dimension “

d”

, such that the ratio d/H falls within the expression 0.075≦

d/H≦

0.4.

6. The heat sink assembly according to claim 1 wherein said base has a lower surface defining at least a portion of said evaporating chamber and includes a plurality of lower fins on said lower surface, said lower fins extending into said evaporating chamber.

7. The heat sink assembly according to claim 1 wherein said tubes have a height dimension “

L”

, and said evaporating chamber has a height dimension “

h”

such that the ratio h/L falls within the expression 0.075≦

h/L≦

0.25.

8. The heat sink assembly according to claim 1 wherein said evaporator includes a baseplate.

9. The heat sink assembly according to claim 8 further comprising an electronic device to be cooled mounted on a bottom surface of said baseplate and wherein said tube openings are substantially vertically aligned over said electronic device.

10. The heat sink assembly according to claim 1 wherein said tubes have a width dimension “

a”

, such that the ratio a/H falls within the expression 0.08≦

a/H≦

0.3.

11. The heat sink assembly according to claim 1 further including a primary convoluted fin affixed to each of outermost tubes of said tube grouping, said primary convoluted fin laterally extending substantially to a tip diameter of said fan blades and vertically extending from a top of said upwardly extending fins substantially to a top of said tubes.

12. The heat sink assembly according to claim 1 further including a primary convoluted fin affixed to each of outermost tubes of said tube grouping, said primary convoluted fin vertically extending from a top of said upwardly extending fins substantially to a top of said tubes and laterally extending outwardly therefrom wherein said primary convoluted fin has a laterally extending dimension of “

q”

such that the ratio q/H falls within the expression 0.08≦

q/H≦

0.4.

13. The heat sink assembly according to claim 12 wherein said primary convoluted fin has a fin density falling within the range of 8-20 fins per inch.

14. The heat sink assembly according to claim 12 wherein at least a first of said tubes has an inverted U-shape having two downwardly extending legs and further wherein each leg has an opening in fluid communication with said evaporating chamber.

15. The heat sink assembly according to claim 14 wherein said first of said tubes has a width dimension “

b”

, such that the ratio b/H falls within the expression 0.08≦

b/H≦

0.3.

16. The heat sink assembly according to claim 14 having at least a second of said tubes forming said tube grouping.

17. The heat sink assembly according to claim 16 wherein an outermost one of said legs of said first and second tubes and an innermost one of said legs have a secondary convoluted fin extending therebetween.

18. The heat sink assembly according to claim 17 wherein said secondary convoluted fin has a height dimension of “

p”

such that the ratio p/H falls within the expression 0.08≦

p/H≦

0.5.

19. The heat sink assembly according to claim 18 wherein said primary convoluted fin and said secondary convoluted fin have a fin density falling within the range of 8-20 fins per inch.

20. The heat sink assembly according to claim 19 wherein said primary convoluted fin has a fin density different than said secondary convoluted fin.

21. The heat sink assembly according to claim 17 further including a third convoluted fin extending between two innermost ones of said legs of said first and second tubes.

22. The heat sink assembly according to claim 16 wherein said second tube comprises a central stem tube having a single inlet in fluid communication with said evaporator.

23. The heat sink assembly according to claim 22 wherein said central stem tube has a width dimension “

c”

, such that the ratio c/H falls within the expression 0.08≦

c/H≦

0.25.

24. A condenser for a heat sink assembly for cooling an electronic device, said condenser comprising:

a base having an upper housing affixed thereto, said upper housing having open ends, and further having a plurality of fins extending substantially upwardly from an upper surface of said base and within said upper housing;

a fan mounted at one of said open ends, said fan including a hub having a diameter “

H” and

fan blades extending therefrom for causing an axially directed airflow through said housing upon rotation of said fan blades;

a plurality of tubes within said upper housing for transmitting therethrough a vapor of a working fluid, said tubes defining a tube grouping, said tubes being arranged in axial alignment with said fan hub and laterally positioned such that a lateral width of said tube grouping is approximately equal to a width of said hub and substantially in lateral alignment therewith.

25. The condenser according to claim 24 wherein said upwardly extending fins are affixed to said upper surface of said base to conduct heat from said base to said upwardly extending fins.

26. The condenser according to claim 25 wherein said upwardly extending fins are integrally formed with said base.

27. The condenser according to claim 25 wherein said upwardly extending fins are accordion-like convoluted fins.

28. The condenser according to claim 24 wherein said upwardly extending fins from said base have a height dimension “

d”

, such that the ratio d/H falls within the expression 0.075≦

d/H≦

0.4.

29. The condenser according to claim 24 wherein said base has a lower surface and includes a plurality of lower fins on said lower surface and extending downwardly therefrom.

30. The condenser according to claim 24 wherein said tubes have a width dimension “

a”

, such that the ratio a/H falls within the expression 0.08≦

a/H≦

0.3.

31. The condenser according to claim 24 wherein each said tube defines at least one opening for receiving into said tube a vapor of a working fluid and for discharge of condensed working fluid.

32. The condenser according to claim 24 further including a primary convoluted fin affixed to each of outermost tubes of said tube grouping, said primary convoluted fin laterally extending substantially to a tip diameter of said fan blades and vertically extending from a top of said upwardly extending fins substantially to a top of said tubes.

33. The condenser according to claim 24 further including a primary convoluted fin affixed to each of outermost tubes of said tube grouping, said primary convoluted fin vertically extending from a top of said upwardly extending fins substantially to a top of said tubes and laterally extending outwardly therefrom wherein said primary convoluted fin has a laterally extending dimension of“

q”

such that the ratio q/H falls within the expression 0.08≦

q/H≦

0.4.

34. The condenser according to claim 33 wherein said primary convoluted fin has a fin density falling within the range of 8-20 fins per inch.

35. The condenser according to claim 33 wherein at least a first of said tubes has an inverted U-shape having two downwardly extending legs and further wherein each said tube defines at least one opening for receiving into said tube a vapor of a working fluid and for discharge of condensed working fluid.

36. The condenser according to claim 35 wherein said first of said tubes has a width dimension “

b”

, such that the ratio b/H falls within the expression 0.08≦

b/H≦

0.3.

37. The condenser according to claim 35 having at least a second of said tubes forming said tube grouping.

38. The condenser according to claim 37 wherein an outermost one of said legs of said first and second tubes and an innermost one of said legs have a secondary convoluted fin extending therebetween.

39. The condenser according to claim 38 wherein said secondary convoluted fin has a height dimension of “

p”

such that the ratio p/H falls within the expression 0.08≦

p/H≦

0.5.

40. The condenser according to claim 39 wherein said primary convoluted fin and said secondary convoluted fin have a fin density falling within the range of 8-20 fins per inch.

41. The condenser according to claim 40 wherein said primary convoluted fin has a fin density different than said secondary convoluted fin.

42. The condenser according to claim 38 further including a third convoluted fin extending between two innermost ones of said legs of said first and second tubes.

43. The condenser according to claim 37 wherein said second tube comprises a central stem tube having a single inlet for receiving into said second tube a vapor of a working fluid and for discharge of condensed working fluid.

44. The condenser according to claim 43 wherein said central stem tube has a width dimension “

c”

, such that the ratio c/H falls within the expression 0.08≦

c/H≦

0.25.