Method and apparatus for providing communication between a defect source identifier and a tool data collection and control system

• US 6,714,884 B2
• Filed: 10/15/2001
• Issued: 03/30/2004
• Est. Priority Date: 10/16/2000
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Dor, Amos, Radzinski, Maya
• Primary Examiner(s): Barlow, John
• Assistant Examiner(s): VO, HIEN XUAN
• Application Number:
  US09/978,300
• Publication Number:
  US 20020069024A1
• Time in Patent Office: 897 Days
• Field of Search: 702/82, 702/81, 702/84, 702/35, 700/110, 700/121, 438/7, 356/237.1, 156/345.13
• US Class Current: 702/82
• CPC Class Codes: G06Q 30/02 Marketing; Price estimation or determination; Fundraising
• CPC Class Codes: G06Q 50/04 Manufacturing
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: Y02P 90/30 Computing systems specially adapted for manufacturing

Abstract

A method and apparatus for providing communication between a defect source identifier and a tool data collection and control system. The defect source identifier collects wafer data until a defect is identified. Upon identification of a defect, a request is sent to the tool data collection and control system to request data of the tool parameters at the time the defect occurred. The tool data collection and control system retrieves the tool parameters and communicates them to the defect source identifier through a network. The tool parameters are processed by the defect source identifier to extract certain wafer data. The selected wafer data is communicated to the tool data collection and control system and is used to execute a prediction model to predict failure possible of the tool elements.

Claims

1. Apparatus for processing a semiconductor wafer comprising:

a semiconductor wafer processing tool;

a defect source Identifier, coupled to at least one metrology station, for collecting wafer data from wafers that are processed in the defect source identifier;

a tool data collection and control system coupled to the defect source identifier and the semiconductor wafer processing tool, for predicting component failure within the semiconductor wafer processing tool in response to the wafer data collected by the defect source identifier; and

a data mining engine coupled to the defect source identifier and the tool data collection and control system, wherein the data mining engine correlates the wafer data with process tool data collected by the tool data collection and control system.

2. The apparatus of claim 1 wherein said tool data collection and control system produces control signals for the semiconductor wafer processing tool.

3. The apparatus of claim 2 wherein said control signals are used to avoid component failure in the semiconductor wafer processing tool.

4. The apparatus of claim 1 further comprising a communications network connecting the defect source identifier to the tool data collection and control system.

5. The apparatus of claim 1 wherein said metrology station is Integrated into the semiconductor wafer processing tool.

6. The apparatus of claim 1 wherein the defect source identifier is coupled to at least one of a wafer review station, an electrical test station, and an inspection station, which provide additional wafer data.

7. The apparatus of claim 1 wherein wafer data comprises defect data.

8. The apparatus of claim 1 further comprising a defect knowledge library coupled to said defect source identifier.

9. The apparatus of claim 1 further comprising a process knowledge library coupled to said defect source identifier.

10. The apparatus of claim 1 further comprising a knowledge library containing defect and process information, coupled to said defect source identifier.

11. A method of processing a semiconductor wafer comprising:

processing the semiconductor wafer in a semiconductor wafer processing tool;

collecting wafer data regarding defects on the semiconductor wafer;

collecting process data regarding process parameters used during processing of the semiconductor wafer; and

predicting failure of a component of semiconductor wafer processing tool in response to data using a data mining engine coupled to the defect source identifier and the toot data collection and control system to correlate the wafer data and the process data.

12. The method of claim 11 further comprising:

adjusting the semiconductor wafer processing tool to avoid the predicted component failure.

13. The method of claim 11 further comprising:

correlating the wafer data with the process data to enhance the prediction accuracy.

14. The method of claim 11 wherein the wafer data is produced using at least one of a wafer review station, a wafer inspection station, an electrical test station, or a metrology station.

15. The method of claim 11 further comprising:

storing the wafer data in a defect knowledge library and storing the process data in a process knowledge library.

16. A method of processing a semiconductor wafer comprising:

processing the semiconductor wafer in a semiconductor wafer processing tool;

collecting wafer data regarding defects on the semiconductor wafer using a defect source identifier;

collecting process data regarding process parameters used during processing of the semiconductor wafer using a tool data collection and control system;

communicating the wafer data to the tool data collection and control system; and

predicting failure of a component of semiconductor wafer processing tool in response to data the wafer data and the process data.

17. The method of claim 16 further comprising:

requesting additional wafer data to be collected by the defect source identifier and communicated to the tool data collection and control system.

18. The method of claim 16 further comprising:

adjusting the semiconductor water processing tool to avoid the predicted component failure.

19. The method of claim 16 further comprising:

correlating the wafer data with the process data to enhance the prediction accuracy.

20. The method of claim 16 wherein the wafer data is produced using at least one of a wafer review station, a wafer inspection station, an electrical test station, or a metrology station.