Heating device for heating semiconductor wafers in thermal processing chambers

• US 6,717,158 B1
• Filed: 01/06/2000
• Issued: 04/06/2004
• Est. Priority Date: 01/06/1999
• Status: Expired due to Term

• Current Assignee: Mattson Technology, Inc. (Beijing Economic & Technology Development Area)
• Original Assignee: Mattson Technology, Inc. (Beijing Economic & Technology Development Area)
• Inventors: Koren, Zion, Choy, Shuen Chun, Timans, Paul Janis, Gat, Arnon, Bogart, Bob, OʼCarroll, Conor Patrick, Bragg, Chris Francis
• Primary Examiner(s): NGUYEN, KIET TUAN
• Application Number:
  US09/478,247
• Time in Patent Office: 1,552 Days
• Field of Search: 392/416, 392/441, 219/405, 219/411, 250/492.2
• US Class Current: 250/492.2
• CPC Class Codes: F27B 17/0025 Especially adapted for treating semiconductor wafers
• CPC Class Codes: F27B 5/04 adapted for treating the charge in vacuum or special atmosphere
• CPC Class Codes: F27B 5/14 Arrangements of heating devices
• CPC Class Codes: F27D 19/00 Arrangements of controlling devices
• CPC Class Codes: H01L 21/67115 mainly by radiation

Abstract

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly of light energy sources for emitting light energy onto a wafer. The light energy sources can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be either active sources of light energy or passive sources which reflect, refract or absorb light energy. For instance, in one embodiment, the tuning devices can comprise a lamp spaced from a focusing lens designed to focus determined amounts of light energy onto a particular location of a wafer being heated.

Claims

1. An apparatus for heat treating semiconductor wafers comprising:

a thermal processing chamber adapted to contain a semiconductor wafer; and

a heating device in communication with said thermal processing chamber for heating a semiconductor wafer contained in said chamber, said heating device comprising;

(a) a plurality of light energy sources configured to emit light energy onto said semiconductor wafer, said light energy sources being positioned so as to form an irradiance distribution across a surface of said wafer; and

(b) at least one adjustable tuning device positioned amongst said light energy sources, said tuning device being configured to operate in conjunction with the plurality of light energy sources to change the irradiance distribution of said light energy sources in a manner for more uniformly heating said semiconductor wafer, said tuning device comprising an arc lamp.

2. An apparatus as defined in claim 1, wherein said tuning device further comprises at least one focusing lens, said focusing lens being configured to focus light energy being emitted by said arc lamp.

3. An apparatus as defined in claim 2, further comprising a light pipe positioned in between said arc lamp and said at least one focusing lens.

4. An apparatus as defined in claim 1, wherein said tuning device positioned to heat the outermost edges of said semiconductor wafer.

5. An apparatus as defined in claim 1, wherein said arc lamp is surrounded by a reflector.

6. An apparatus as defined in claim 5, wherein said reflector has an elliptical shape.

7. An apparatus as defined in claim 1, further comprising:

at least one temperature sensing device for sensing the temperature of said semiconductor wafer at least at one location; and

a controller in communication with said at least one temperature sensing device and at least one of said light energy sources, said controller being configured to control the amount of light energy being emitted by said at least one light energy source in response to temperature information received from said at least one temperature sending device.

8. An apparatus as defined in claim 1, further comprising a substrate holder for holding said semiconductor wafer, said substrate holder being configured to rotate said wafer.

9. An apparatus for heat treating semiconductor wafers comprising:

a thermal processing chamber adapted to contain a semiconductor wafer; and

a heating device in communication with said thermal processing chamber for heating a semiconductor wafer contained in said chamber, said heating device comprising a plurality of light energy sources configured to emit light energy onto said semiconductor wafer, said light energy sources being positioned so as to form an irradiance distribution across a surface of said wafer, and at least one tuning device positioned amongst said light energy sources, said tuning device comprising a light source spaced from at least one focusing lens, said focusing lens being configured to focus light energy being emitted by said light energy source onto a determined location on said semiconductor wafer in a manner that more uniformly heats said semiconductor wafer, said tuning device comprising an arc lamp.

10. An apparatus as defined in claim 9, further comprising:

at least one temperature sensing device for sensing the temperature of said semiconductor wafer at least at one location; and

a controller in communication with said temperature sensing device, with at least one of said light energy sources, and with said tuning device, said controller being configured to control the amount of light energy being emitted by said at least one light energy source and said tuning device in response to temperature information received from said temperature sensing device.

11. An apparatus as defined in claim 10, wherein said controller is configured to control the amount of light energy being emitted by said at least one tuning device independently of said light energy sources.

12. An apparatus as defined in claim 9, further comprising a light pipe positioned in between said arc lamp and said at least one focusing lens.

13. An apparatus as defined in claim 9, wherein said tuning device is positioned to heat the outermost edges of said semiconductor wafer.

14. An apparatus as defined in claim 9, wherein said arc lamp is surrounded by a reflector.

15. An apparatus as defined in claim 14, wherein said reflector has an elliptical shape.