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METHODS EMPLOYING HYBRID ADHESIVE MATERIALS TO SECURE COMPONENTS OF SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES TO ONE ANOTHER AND ASSEMBLIES AND PACKAGES INCLUDING COMPONENTS SECURED TO ONE ANOTHER WITH SUCH HYBRID ADHESIVE MATERIALS

  • US 6,717,259 B2
  • Filed: 04/11/2002
  • Issued: 04/06/2004
  • Est. Priority Date: 05/19/2000
  • Status: Expired due to Term
First Claim
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1. A system for securing at least two semiconductor device components to one another, comprising:

  • a hybrid adhesive material including a pressure-sensitive component and a thermoset component;

    an adhesive applicator configured to apply said hybrid adhesive material to at least a portion of a surface of a first semiconductor device component;

    a placement apparatus configured to receive a second semiconductor device component and to assemble the second semiconductor device component with the first semiconductor device component with said pressure-sensitive component of said hybrid adhesive material securing the first and second semiconductor device components to one another; and

    a heating element for applying heat to said hybrid adhesive material and curing at least said thermoset component thereof.

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