METHODS EMPLOYING HYBRID ADHESIVE MATERIALS TO SECURE COMPONENTS OF SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES TO ONE ANOTHER AND ASSEMBLIES AND PACKAGES INCLUDING COMPONENTS SECURED TO ONE ANOTHER WITH SUCH HYBRID ADHESIVE MATERIALS
First Claim
1. A system for securing at least two semiconductor device components to one another, comprising:
- a hybrid adhesive material including a pressure-sensitive component and a thermoset component;
an adhesive applicator configured to apply said hybrid adhesive material to at least a portion of a surface of a first semiconductor device component;
a placement apparatus configured to receive a second semiconductor device component and to assemble the second semiconductor device component with the first semiconductor device component with said pressure-sensitive component of said hybrid adhesive material securing the first and second semiconductor device components to one another; and
a heating element for applying heat to said hybrid adhesive material and curing at least said thermoset component thereof.
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Accused Products
Abstract
A method for securing two or more semiconductor device components to one another is provided. A hybrid adhesive material, including a pressure-sensitive component and a thermoset component, is used to at least temporarily secure the semiconductor device components to each other. The pressure-sensitive component of the hybrid adhesive material temporarily secures the semiconductor device components to one another. When the semiconductor device components are properly aligned, the hybrid adhesive material may be heated to cure the thermoset component thereof and to more permanently secure the semiconductor device components to one another. The cure temperature may be lower than about 200° C. and as low as about 120° C. or less. A system for effecting the method of the present invention is also disclosed, as well as semiconductor device assemblies that include the hybrid adhesive material.
34 Citations
31 Claims
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1. A system for securing at least two semiconductor device components to one another, comprising:
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a hybrid adhesive material including a pressure-sensitive component and a thermoset component;
an adhesive applicator configured to apply said hybrid adhesive material to at least a portion of a surface of a first semiconductor device component;
a placement apparatus configured to receive a second semiconductor device component and to assemble the second semiconductor device component with the first semiconductor device component with said pressure-sensitive component of said hybrid adhesive material securing the first and second semiconductor device components to one another; and
a heating element for applying heat to said hybrid adhesive material and curing at least said thermoset component thereof. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A semiconductor device component comprising:
a quantity of hybrid adhesive material including at least a pressure-sensitive component and a thermoset component on at least a portion of at least one surface of the semiconductor device component, said pressure-sensitive component configured to at least temporarily secure the semiconductor device component to at least one other semiconductor device component. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
Specification