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Solderable flexible adhesive interposer as for an electronic package, and method for making same

  • US 6,717,819 B1
  • Filed: 05/25/2000
  • Issued: 04/06/2004
  • Est. Priority Date: 06/01/1999
  • Status: Expired due to Fees
First Claim
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1. An electronic package having contacts adapted to be attached to a substrate, said electronic package comprising:

  • at least one electronic device, said electronic device having a plurality of contacts thereon;

    a solderable flexible adhesive interposer including;

    at least one layer of flexible dielectric adhesive having a modulus of elasticity less than about 35,000 kg/cm2 (about 500,000 psi), a plurality of conductive vias through said layer of flexible dielectric adhesive, said plurality of conductive vias being of a flexible electrically conductive adhesive having a modulus of elasticity less than about 35,000 kg/cm2 (about 500,000 psi) and being in a pattern corresponding to a pattern of contacts of one of said electronic device and a substrate, and a solderable electrically conductive metal formed on at least one exposed surface of said conductive vias and in electrical contact therewith, wherein at least one end of the plurality of conductive vias includes contacts adapted to be attached to the substrate and means for connecting the contacts of said electronic device to said conductive vias.

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