Methods of operating microelectronic devices, and methods of providing microelectronic devices

• US 6,718,163 B2
• Filed: 02/19/2003
• Issued: 04/06/2004
• Est. Priority Date: 03/01/1999
• Status: Expired due to Fees

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Technology, Inc.
• Inventors: Tandy, Patrick W.
• Primary Examiner(s): Tran, Pablo N.
• Application Number:
  US10/371,123
• Publication Number:
  US 20030129951A1
• Time in Patent Office: 412 Days
• Field of Search: 455/90, 455/84, 455/575, 455/66, 455/79, 455/351, 455/73, 455/80, 455/87, 455/74, 455/83, 455/77, 455/550, 455/41, 455/333, 455/128, 455/129, 455/269, 455/344, 455/346, 455/347, 455/348, 455/349, 455/568, 257/725, 257/723-724, 257/924, 257/787, 257/679, 257/700, 257/712, 257/728, 257/778, 340/825.32, 340/325.54, 342/42, 342/44, 342/51, 127/564
• US Class Current: 455/90.2
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01Q 1/2283 : mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H04B 1/3816 : Mechanical arrangements for accommodating identification devices, e.g. cards or chips; with connectors for programming identification devices
• CPC Class Codes: H04B 1/3833 : Hand-held transceivers

Abstract

Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices are described. In one embodiment, a microelectronic device includes a microelectronic package which provides a housing within which integrated circuitry is received. An integrated circuit die is received within the microelectronic package and includes integrated circuitry formed thereon. The integrated circuitry comprises first transmit/receive circuitry configured to transmit and receive radio frequency signals. Second transmit/receive circuitry is provided, discrete from the first transmit/receive circuitry, and is contained within the microelectronic package. The second circuitry is configured to transmit and receive radio frequency signals, wherein the first and second transmit/receive circuitry are configured to establish wireless communication between one another within the microelectronic package. In another embodiment, a microelectronic package is provided having housed therein integrated circuitry. Wireless communication is produced using a transmitter inside the microelectronic package. The produced wireless communication is received using a receiver inside the microelectronic package. Responsive to the receiving of such communication, the integrated circuitry is caused to operate in a designed manner.

Claims

1. A method comprising:

disposing an integrated circuit die within a microelectronic package, the integrated circuit die having integrated circuitry formed thereon, the integrated circuitry comprising first transmit/receive circuitry configured to transmit and receive radio frequency signals; and

disposing second transmit/receive circuitry, discrete from the first transmit/receive circuitry, within the microelectronic package, the second transmit/receive circuitry being configured to transmit and receive radio frequency signals wherein the first and second transmit/receive circuitry are configured to establish wireless communication between one another within the microelectronic package, wherein the die is void of external electrical connections for anything other than at least one of power and ground.

2. The method of claim 1, and comprising disposing more than one die in the microelectronic package.

3. The method of claim 1, and further comprising disposing the second transmit/receive circuitry on a second integrated circuit die.

4. The method of claim 1, and further comprising disposing a substrate within the housing, and supporting the first and second transmit/receive circuitry supported on the substrate.

5. The method of claim 1, and further comprising disposing a printed circuit board substrate within the housing, and supporting the first and second transmit/receive circuitry on the printed circuit board substrate.

6. The method of claim 1, wherein the microelectronic package is sized to be hand-carriable.

7. The method of claim 1, and further comprising disposing the first and second transmit/receive circuitry within 24 inches of one another within the microelectronic package.

8. The method of claim 1, wherein the first and second transmit/receive circuitry comprise individual respective antennas configured to transmit and receive wireless communications.

9. The method of claim 1, wherein the first and second transmit/receive circuitry comprise individual respective antennas configured to transmit and receive wireless RF communications.

10. The method of claim 1, wherein the first and second transmit/receive circuitry comprise individual respective antennas configured to transmit and receive the wireless communication, the method further comprising disposing the antennas within 24 inches of one another within the microelectronic package.

11. The method of claim 1, wherein the first and second transmit/receive circuitry comprise individual respective antennas configured to transmit and receive wireless communication, the method further comprising disposing the antennas within one inch of one another within the microelectronic package.

12. The method of claim 1, wherein the first and second transmit/receive circuitry comprise individual respective antennas configured to transmit and receive wireless communication, the method further comprising disposing the antennas within one half inch of one another within the microelectronic package.

13. A method comprising:

disposing an integrated circuit die within a microelectronic package and supporting the die by an integrated circuitry-supporting substrate inside the package, the integrated circuit die having integrated circuitry formed thereon, the integrated circuitry having first transmit/receive circuitry configured to transmit and receive wireless communications, the integrated circuit die having physical-electrical connection structure securing it to the integrated circuitry-supporting substrate, said structure supplying electrical connections only for power and ground;

disposing second transmit/receive circuitry, discrete from the first transmit/receive circuitry, within the package, the second transmit/receive circuitry being configured to transmit and receive wireless communications; and

causing the first and second transmit/receive circuitry to establish wireless communications between one another within the microelectronic package to cause the integrated circuitry on the integrated circuitry die to operate in a designed manner.

14. The method of claim 13, wherein the wireless communication comprises RF communication.

15. The method of claim 13, and further comprising disposing the second transmit/receive circuitry on a second integrated circuit die supported by the integrated circuitry-supporting substrate.

16. The method of claim 13, and further comprising supporting the second transmit/receive circuitry by the integrated circuitry-supporting substrate.

17. The method of claim 13, wherein the package is sized to be hand-transportable.

18. The method of claim 13, and further comprising operably associating individual antennas with the first and second transmit/receive circuitry respectively, and disposing the antennas within the microelectronic package within 24 inches of one another.

19. The method of claim 13, further comprising operably associating individual antennas with the first and second transmit/receive circuitry respectively, and disposing the antennas within the microelectronic package within one inch of one another.

20. The method of claim 13, further comprising operably associating individual antennas with the first and second transmit/receive circuitry respectively, and disposing the antennas within the microelectronic package within one half inch of one another.

21. The method of claim 13, and further comprising hermetically sealing the package.

22. A method of operating a microelectronic device comprising:

mounting a transmitter integrated circuit within a microelectronic package, wherein the transmitter integrated circuit is void of electrical external connections for anything except power and ground;

mounting an integrated circuit receiver within the package;

producing wireless communication using the transmitter;

receiving the produced wireless communication using the receiver inside the microelectronic package; and

responsive to said receiving, causing integrated circuitry separate from the transmitter and receiver to operate.

23. The method of claim 22 further comprising positioning the transmitter and the receiver within 24 inches of one another.

24. The method of claim 22 further comprising positioning the transmitter and the receiver within one inch of one another.

25. The method of claim 22 further comprising positioning the transmitter and the receiver within one half inch of one another.

26. The method of claim 22 further comprising fabricating the integrated circuitry.

27. A method of operating a microelectronic device comprising:

transmitting a wireless communication signal using an integrated circuitry transmitter inside a microelectronic package, the transmitter being void of external electrical connections for anything other than power and ground;

receiving the transmitted wireless communication signal using an integrated circuitry receiver inside the microelectronic package; and

responsive to said receiving, causing the integrated circuitry within the microelectronic package to operate in a designed manner.

28. The method of claim 27 further comprising positioning the transmitter and the receiver within 24 inches of one another.

29. The method of claim 27 further comprising positioning the transmitter and the receiver within one inch of one another.

30. The method of claim 27 further comprising positioning the transmitter and the receiver within one half inch of one another.

31. The method of claim 27 further comprising fabricating one of the integrated circuitry transmitter or receiver.

32. A method of forming a microelectronic device comprising:

mounting an integrated circuitry transmitter within a microelectronic package; and

mounting an integrated circuit die within the package, wherein the integrated circuit die has physical-electrical connection structure securing it within the package, said structure supplying electrical connections only for power and ground, the die having integrated circuitry disposed thereon including an integrated circuit receiver, wherein the transmitter and receiver are configured to establish direct wireless communication with one another, wherein operating instructions for the integrated circuitry on the die are transmitted and received within the microelectronic package.

33. The method of claim 32, wherein the transmitter and the receiver are mounted within 24 inches of one another.

34. The method of claim 32, wherein the transmitter and the receiver are mounted within one inch of one another.

35. The method of claim 32, wherein the transmitter and the receiver are mounted within one half inch of one another.