Integrated circuit package separators

• US 6,718,858 B2
• Filed: 03/22/2000
• Issued: 04/13/2004
• Est. Priority Date: 10/20/1998
• Status: Expired due to Fees

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Tripard, Jason E.
• Primary Examiner(s): Choi, Stephen
• Application Number:
  US09/533,058
• Publication Number:
  US 20010052278A1
• Time in Patent Office: 1,483 Days
• Field of Search: 834/51, 834/671, 834/685, 834/686, 83/56, 836/14, 839/291, 839/39, 839/53, 269/54.5, 269/54.1, 269/295
• US Class Current: 83/467.1
• CPC Class Codes: H01L 21/481 Insulating layers on insulating parts, with or without metallisation
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2203/0165 Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
• CPC Class Codes: H05K 2203/0228 Cutting, sawing, milling or shearing
• CPC Class Codes: H05K 2203/167 Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: Y10S 83/953 with work support
• CPC Class Codes: Y10T 83/748 With work immobilizer
• CPC Class Codes: Y10T 83/7593 Work-stop abutment
• CPC Class Codes: Y10T 83/7633 Collapsible
• CPC Class Codes: Y10T 83/929 Tool or tool with support
• CPC Class Codes: Y10T 83/9372 Rotatable type

Abstract

In one aspect, the invention includes a method of forming integrated circuit packages. A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes extending therethrough. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes extending through it. The board is placed over the support upper surface with the pins extending into the holes in the board. While the board is over the support upper surface, it is cut to separate the integrated circuit packages from one another. After the cutting, the support is vertically displaced by the actuator to lift the support off the pins. In another aspect, the invention encompasses an integrated circuit package separator for separating integrated circuit packages from a board.

Claims

1. An integrated circuit package separator for separating integrated circuit packages from a board comprising a plurality of integrated circuits bonded thereto, the board having a plurality of holes extending within it, the separator comprising:

a base having a plurality of pins extending upwardly therefrom;

a support over the base and having an upper surface, the support having a plurality of holes extending therethrough, the pins extending through the holes and upwardly beyond the upper surface of the support;

the support and pins being configured such that the pins extend into the holes in the board when the board is placed over the support upper surface;

an actuator comprising a lift member laterally spaced from the base and beneath the support, and the lift member configured to vertically displace the support and lift the support off the pins by contacting the support, the actuator powered by at least one of a gas source, a fluid source and an electricity source, wherein the actuator comprises a release valve configured to equilibrate a back-pressure of the actuator to ambient during lifting of the support; and

a cutting mechanism configured to cut the board while the board is over the support upper surface and thereby separate the integrated circuit packages from one another.

2. The separator of claim 1 wherein the pins align with the board such that each of the separated integrated circuit packages is retained to the support by at least one pin.

3. The separator of claim 1 wherein the pins align with the board such that each of the separated integrated circuit packages is retained to the support by at least two pins.

4. The separator of claim 1 wherein the support is a sheet comprising aluminum and having a thickness of at least {fraction (3/16)} inches.

5. The separator of claim 1 wherein the actuator is pneumatically powered.

6. The separator of claim 1 wherein the lift member has a substantially planar upper surface and the base has a substantially planar upper surface, the lift member substantially planar upper surface being substantially flush with the base substantially planar upper surface.

7. The separator of claim 1 wherein the lift member has at least one post extending upwardly therefrom, the at least one post extending through a hole in the support.

8. The separator of claim 1 wherein the lift member has at least two posts extending upwardly therefrom, the at least two posts extending through holes in the support and aligning the support relative to the lift member.

9. The separator of claim 1 wherein the actuator is pneumatically powered;

the actuator comprising a pair of gas ports, one of the ports being a gas inlet when the actuator lifts the support and the other port being a gas outlet when the actuator lifts the support;

the separator further comprising at least one pressure release valve in fluid communication with the gas outlet.

10. The separator of claim 1 wherein the lift member is configured to move only perpendicularly relative the support.

11. The separator of claim 1 wherein the actuator is pneumatically powered and comprises a pneumatic cylinder to alternatively lift and lower the lift member.

12. The separator of claim 11 wherein the actuator comprises a release valve to enable the pneumatic cylinder to be maintained at ambient pressure prior to raising the lift member.

13. The separator of claim 11 wherein the actuator comprises a release valve to enable the pneumatic cylinder to be maintained generally at one atmosphere pressure prior to raising the lift member.

14. An integrated circuit package separator for separating integrated circuit packages from a board comprising a plurality of integrated circuits bonded thereto, the board having a plurality of holes extending within it, the separator comprising:

a base having a plurality of pins extending upwardly therefrom;

a support over the base and having an upper surface, the support having a plurality of holes extending therethrough and a pair of opposing ends, the pins extending through the holes and upwardly beyond the upper surface of the support;

the support and pins being configured such that the pins extend into the holes in the board when the board is placed over the support upper surface;

a pair of pneumatic actuators comprising first and second lift members laterally spaced from the base and beneath respective ends of the pair of opposing ends of the support, and the lift members configured to vertically displace the support and lift the support off the pins by contacting the support;

each actuator of the pair comprising release valves configured to equilibrate a back-pressure of each actuator to ambient during lifting of the support; and

a cutting mechanism configured to cut the board while the board is over the support upper surface and thereby separate the integrated circuit packages from one another.

15. The separator of claim 14 wherein the pins align with the board such that each of the separated integrated circuit packages is retained to the support by at least one pin.

16. The separator of claim 14 wherein the pins align with the board such that each of the separated integrated circuit packages is retained to the support by at least two pins.

17. The separator of claim 14 wherein the lift members have substantially planar upper surfaces and the base has a substantially planar upper surface, the substantially planar upper surfaces of the lift members being substantially flush with the base substantially planar upper surface.

18. The separator of claim 14 wherein at least one of the lift members has at least one post extending upwardly therefrom, the at least one post extending through a hole in the support.

19. The separator of claim 14 wherein the first and second lift members each have at least one post extending upwardly therefrom, the posts extending through holes in the support.

20. The separator of claim 14 wherein the first and second lift members each have at least two posts extending upwardly therefrom, the posts extending through holes in the support.

21. The separator of claim 20 wherein the at least two posts are tapered as each extends upwardly from the first and second lift members.

22. The separator of claim 14 wherein the actuators each comprise a pair of gas ports, one of each pair of ports being a gas inlet when the actuator lifts the support and the other port of each pair of ports being a gas outlet when the actuator lifts the support;

the separator further comprising at least one pressure release valve in fluid communication with the gas outlets.

23. The separator of claim 14 wherein the actuators each comprise a pair of gas ports, one of each pair of ports being a gas inlet when the actuator lifts the support and the other port of each pair of ports being a gas outlet when the actuator lifts the support;

the separator further comprising at least two pressure release valves, one of the pressure release valves being in fluid communication with one of the gas outlets, and another of the pressure release valves being in fluid communication with the other of the gas outlets.

24. The separator of claim 14 wherein the lift members are configured to move only perpendicularly relative the support.

25. An integrated circuit package separator for separating integrated circuit packages from a board comprising a plurality of integrated circuits bonded thereto, the board having a plurality of holes extending within it, the separator comprising:

a base having a plurality of pins extending upwardly therefrom;

a support over the base and having an upper surface, the support having a plurality of holes extending therethrough, the pins extending through the holes and upwardly beyond the upper surface of the support, the support and pins being configured such that the pins extend into the holes in the board when the board is placed over the upper surface of the support;

a pair of actuators, wherein individual actuators include a lift member laterally spaced from the base and beneath the support, and the lift member is configured to vertically displace a respective end of the support and lift the support off the pins by contacting the support, the actuator powered by at least one of a gas source, a fluid source and an electricity source, wherein the individual actuators include a release valve configured to equilibrate a back-pressure of the actuator to ambient during lifting of the support; and

a cutting mechanism configured to cut the board while the board is over the upper surface of the support to separate the integrated circuit packages from one another.