Curing light

• US 6,719,558 B2
• Filed: 02/11/2002
• Issued: 04/13/2004
• Est. Priority Date: 09/24/1999
• Status: Expired due to Term

• Current Assignee: CAO Group, Inc.
• Original Assignee: CAO Group, Inc.
• Inventors: Cao, Densen
• Primary Examiner(s): Lewis, Ralph A.
• Application Number:
  US10/073,819
• Publication Number:
  US 20020172917A1
• Time in Patent Office: 792 Days
• Field of Search: 433/29, 433/215, 606/1, 606/13, 606/16, 607/88, 362/119, 362/800, 362/804
• US Class Current: 433/29
• CPC Class Codes: A61C 19/004 Hand-held apparatus, e.g. guns
• CPC Class Codes: A61N 2005/0652 Arrays of diodes
• CPC Class Codes: B23K 26/0096 Portable laser equipment, e.g. hand-held laser apparatus surgical laser instruments A61B18/20, Dental Lasers A61C1/0046, Hand-held laser dental apparatus for curing resins A61C19/004
• CPC Class Codes: B23K 26/0608 in the same heat affected zone [HAZ] B23K26/0613, B23K26/0619 take precedence
• CPC Class Codes: B23K 26/064 by means of optical elements, e.g. lenses, mirrors or prisms
• CPC Class Codes: B23K 26/0643 comprising mirrors
• CPC Class Codes: B23K 26/0648 comprising lenses
• CPC Class Codes: B23K 26/0665 by beam condensation on the workpiece, e.g. for focusing
• CPC Class Codes: B23K 26/703 Cooling arrangements by using a fluid stream B23K26/14
• CPC Class Codes: Y10S 362/80 Light emitting diode
• CPC Class Codes: Y10S 362/804 Surgical or dental spotlight

Abstract

A curing light system useful for curing light activated composite materials is disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.

Claims

1. A curing light comprising:

a primary heat sink capable of dissipating heat created by a semiconductor light source,

a well in said heat sink, said well being sized to receive a semiconductor chip capable of producing light that is useful in curing light-curable materials,

a top opening of said well,

a bottom of said well,

a wall of said well, said wall of said well being capable of reflecting light of a particular wavelength,

a chip mounting pad located in said well in the vicinity of said well bottom, said chip mounting pad being capable of reflecting light of a particular wavelength,

a semiconductor chip capable of producing light that is useful in curing light-curable materials,

said semiconductor chip being located in said well on said chip mounting pad,

said semiconductor chip having a substrate and expitaxial layers,

said semiconductor chip being oriented on said pad so that said epitaxial layers of said chip are located between said substrate and said chip mounting paid, and so that said substrate is nearer said top opening of said well than said epitaxial layers of said chip.

2. A curing light as recited in claim 1 wherein light produced by said chip is reflected by said mounting pad toward said top opening of said well.

3. A curing light as recited in claim 1 wherein at least some light produced by said chip is reflected by said wall of said well toward said top opening of said well.

4. A curing light as recited in claim 1 wherein said well has a reflective wall that includes a material selected from the group consisting of Al, Au, Ag, Zn, Cu, Pt, chrome, metal, plating and plastic, said well wall being capable of reflecting light of a wavelength produced by said chip.

5. A curing light as recited in claim 1 further comprising a plurality of electrode bumps located between said chip and said chip mounting pad for providing electrical connection between said chip and said chip mounting pad.

6. A curing light as recited in claim 1 wherein said semiconductor chip is selected from the group consisting of light emitting diode chips, laser chips, light emitting diode chip array, diode laser chips, diode laser chip array, surface emitting laser chips, edge emitting laser chips, and VCSEL chips.

7. A curing light as recited in claim 1 wherein said chip mounting pad is held in place in said well by use of a heat conductive adhesive.

8. A curing light as recited in claim 1 further comprising a secondary heat sink, said secondary heat sink being affixed to said heat sink, and said secondary heat sink being capable of assisting in dissipation of heat produced by said chip.

9. A curing light as recited in claim 1, further comprising a wand adapted to be grasped by a human hand for applying light produced by the curing light to a light curable material.

10. A curing light as recited in claim 9 further comprising a switch on said wand for initiating emission of light from said semiconductor chip.

11. A curing light as recited in claim 1 further comprising a cover that provides protective covering for said semiconductor chip and which permits light emitted by said semiconductor chip to substantially pass through it.

12. A curing light as recited in claim 11 wherein said cover is selected from the group consisting of windows and focus lenses.

13. A curing light as recited in claim 8 wherein said secondary heat sink is elongate in shape.

14. A curing light comprising:

a primary heat sink capable of dissipating heat created by a semiconductor light source,

a well in said heat sink, said well being sized to receive a semiconductor chip capable of producing light that is useful in curing light-curable materials,

a top opening of said well,

a bottom of said well,

a wall of said well, said wall of said well being capable of reflecting light of a particular wavelength,

a chip mounting pad located in said well in the vicinity of said well bottom, said chip mounting pad being capable of reflecting light of a particular wavelength,

a semiconductor chip capable of producing light that is useful in curing light-curable materials, said semiconductor chip being located in said wall on said chip mounting pad,

a plurality of electrode bumps located between said chip and said chip mounting pad for providing electrical connection between said chip and said chip mounting pad

said semiconductor chip having a substrate and expitaxial layers,

said semiconductor chip being oriented on said pad so that said epitaxial layers of said chip are located between said substrate and said chip mounting paid, and so that said substrate is nearer said top opening of said well than said epitaxial layers of said chip;

wherein at least some light produced by said chip is reflected by said mounting pad toward said top opening of said well;

wherein at least some light produced by said chip is reflected by said wall of said well toward said top opening of said well.

15. A curing light as recited in claim 14 wherein said well has a reflective wall that includes a material selected from the group consisting of Al, Au, Ag, Zn, Cu, Pt, chrome, metal, plating and plastic, said well wall being capable of reflecting light of a wavelength produced by said chip.

16. A curing light as recited in claim 14 wherein said semiconductor chip is selected from the group consisting of light emitting diode chips, laser chips, light emitting diode chip array, diode laser chips, diode laser chip array, surface emitting laser chips, edge emitting laser chips, and VCSEL chips.

17. A curing light as recited in claim 14 further comprising a secondary heat sink, said secondary heat sink being affixed to said heat sink, and said secondary heat sink being capable of assisting in dissipation of heat produced by said chip.

18. A curing light as recited in claim 17 wherein said secondary heat sink is elongate in shape.

19. A curing light as recited in claim 17, further comprising

a wand adapted to be grasped by a human hand for applying light produced by the curing light to a light curable material, and

a switch on said wand for initiating emission of light from said semiconductor chip.

20. A curing light as recited in claim 14 further comprising a cover that provides protective covering for said semiconductor chip and which permits light emitted by said semiconductor chip to substantially pass through it, said cover being selected from the group consisting of windows and focus lenses.