Apparatus and method for focal point control for laser machining

• US 6,720,567 B2
• Filed: 01/30/2001
• Issued: 04/13/2004
• Est. Priority Date: 01/30/2001
• Status: Expired due to Term

• Current Assignee: Prima Power Laserdyne, LLC
• Original Assignee: GSI Lumonics Corporation (Novanta Inc.)
• Inventors: Fordahl, Craig A, Hiebel, Michael J.
• Primary Examiner(s): Sugarman, Scott J.
• Assistant Examiner(s): HANIG, RICHARD E
• Application Number:
  US09/774,276
• Publication Number:
  US 20020153500A1
• Time in Patent Office: 1,169 Days
• Field of Search: 250/559.29, 250/559.38, 219/121.78, 219/121.83
• US Class Current: 250/559.29
• CPC Class Codes: B23K 2101/001 Turbines
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/046 Automatically focusing the laser beam
• CPC Class Codes: B23K 26/048 by controlling the distance between laser head and workpiece
• CPC Class Codes: B23K 26/382 by boring
• CPC Class Codes: B23K 26/389 of fluid openings, e.g. nozzles, jets laser machining of inkjet nozzles B41J2/1634
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved
• CPC Class Codes: F01D 5/186 Film cooling F01D5/187 takes precedence

Abstract

Method and apparatus for maintaining the focal point of a laser beam used for laser machining relative to a workpiece, including an optical distance measuring sensor having a measurement beam, a mirror for combining the measurement and laser beams into a predetermined optical path having a common axis for both beams, and a focusing element which may be in the form of a refractive lens or a reflective parabolic mirror located in the optical path, and a control means for controlling the location of the focal point of the laser beam based on the distance sensed by measurement beam. In drilling, once the hole breaks through the workpiece, the application of the laser beam can be stopped by observing a departure from the incremental distance measurement change.

Claims

1. A method for maintaining a focal point of a machining laser beam relative to a surface of a part to be machined comprising:

directing the machining laser beam having a first fixed focal point and a measurement beam having a second fixed focal point onto the surface through a common beam focusing element and along a substantially coaxial path, said first focal point and said second focal point having a known separation distance along an optical axis of the focusing element;

receiving a portion of the measurement beam reflected from the surface in a beam sensor element and determining a first separation distance between the measurement beam second focal point and the surface;

generating an error signal representative of a second separation distance between the machining laser beam first focal point and the surface based on the measured first separation distance and the known separation distance; and

summing the error signal with a position command signal for moving the part to be machined with respect to the machining laser beam such that the machining laser beam first focal point remains substantially coincident with the surface during movement thereof.

2. The method of claim 1 wherein the beam focusing element is a plano-convex lens.

3. The method of claim 1 wherein the beam focusing element is a parabolic reflector.

4. A method according to claim 1 wherein the part is supported for controlled movement in five axes, further comprising the step of:

processing the error signal to develop a sensor vector error signal; and

,

summing the sensor vector error signal with a composite position command for moving the part such that the machining laser beam first focal point remains substantially coincident with the surface for any surface orientation.

5. The method of claim 1 wherein the laser machining beam is used for drilling a hole in the part, and wherein the step of receiving the portion of the measurement beam reflected from the surface in a beam sensor element further comprises the step of determining a depth of a hole being drilled by the laser machining beam.

6. The method of claim 1 wherein the laser machining beam is used for drilling a through hole in the part, and wherein the step of receiving the portion of the measurement beam reflected from the surface in a beam sensor element further comprises the step of determining when the laser machining beam breaks through the part.

7. A method for machining with a laser beam, the method comprising the steps of:

a) determining a location of a part surface of the workpiece using a measurement beam from an optical sensor directed along an optical axis and through an optical focusing element to focus the measurement beam at a measurement beam focal point, said measurement beam having a first wavelength;

b) machining the workpiece using a laser beam having second wavelength different from the first wavelength directed along the optical axis with the measurement beam and through the optical focusing element to focus the laser beam at a laser beam focal point;

c) controlling the location of the focal point of the laser beam with respect to the part surface of the workpiece based on the location sensed by the measurement beam while accommodating the difference in the location of the focal points in determining the location of the workpiece such that the laser beam focal point is positioned at a desired location with respect to the workpiece for laser machining.

8. The method of claim 7 wherein the wavelength of the laser beam is about 1064 nanometers and the wavelength of the measurement beam is about 685 nanometers.

9. A method of detecting break through from a blind hole to a through hole in a workpiece during laser machining comprising the steps of:

a) sharing an optical path by a sensor and a laser wherein;

i) an optical measurement beam of a first wavelength is delivered and sensed by the sensor for sensing a location of a surface of a workpiece, and

ii) a laser beam of a second wavelength different than the first wavelength is generated by the laser for machining a surface of the workpiece wherein the optical path includes an optical focusing element for focusing both beams, said focusing element having distinct and separate focal points for the optical measurement beam and said laser beam the separate focal points having a known focal separation along an optical axis of the focusing element;

b) directing the optical measurement beam through the optical path to determine a separation distance between the focal point of the measurement beam and a surface of the workpiece;

c) moving the surface of the workpiece to adjust the separation distance between the focal point of the measurement beam and the surface of the workpiece to position the focal point of the laser beam substantially at a desired location relative to the surface of the workpiece;

d) directing a laser beam through the optical path to the workpiece to remove material from the surface thereby forming a new surface; and

e) comparing the present distance sensed with the last location sensed and repeating at least steps b) and d) and e) when the difference between the present location sensed and last location sensed is less than a predetermined value.

10. The method of claim 9 further comprising an additional step:

f) discontinuing at least step d) when the difference is greater than the predetermined value.

11. The method of claim 9 wherein the optical measurement beam and the laser beam have different wavelengths, and step c) further comprises applying a correction to the optical measurement beam to compensate for a difference between the locations of the respective focal points of the beams.

12. The method of claim 9 wherein step e) is performed during a piercing operation of the laser machining.

13. The method of claim 9 wherein step e) is performed during a drilling operation of the laser machining.

14. Apparatus for measuring the location of a focal point of a laser machining beam with respect to a surface of a workpiece to be machined by the beam comprising:

a) a laser machining system having a laser beam of a first optical wavelength directed along a predetermined optical machining path;

b) an optical measuring sensor having a measurement beam of a second optical wavelength that is different than the first optical wavelength directed along at least a part of the optical machining path; and

c) an optical focusing element having a different predetermined focal length characteristic with respect to said first and said second optical wavelengths, the optical focusing element being located in a shared portion of the optical machining path such that the focal length characteristic of the optical focusing element simultaneously provides a measurement focal length for the optical distance measuring sensor using the measurement beam and an operating focal length for optical machining using the laser beam.

15. The apparatus of claim 14 wherein the optical focusing element is a refractive type optical element.

16. The apparatus of claim 15 wherein the optical focusing element is a lens.

17. The apparatus of claim 14 wherein the optical focusing element is a reflective optical element.

18. The apparatus of claim 17 wherein the optical focusing element is a concave mirror.

19. The apparatus of claim 18 wherein the concave mirror is a parabolic mirror.

20. The apparatus of claim 14 further comprising a beam combining element for receiving the laser beam along a first axis and the measurement beam along a second axis different from the first axis and for combining the laser beam and measurement beam into the optical machining path.

21. The apparatus of claim 20 wherein the beam combining element reflects one of the beams and transmits the other of the beams to combine the beams along a common axis.

22. The apparatus of claim 14 wherein the first axis is located 90 degrees with respect to the second axis and the beam combining element is an optical element positioned and coated to reflect one of the laser beam and measurement beam and transmit the other of the laser beam and measurement beam.

23. The apparatus of claim 14 wherein the first optical wavelength is nominally 1064 nanometers.

24. The apparatus of claim 23 wherein the second optical wavelength is nominally 685 nanometers.