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Flip chip in leaded molded package and method of manufacture thereof

  • US 6,720,642 B1
  • Filed: 12/16/1999
  • Issued: 04/13/2004
  • Est. Priority Date: 12/16/1999
  • Status: Expired due to Term
First Claim
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1. A semiconductor die package comprising:

  • a lead frame including a plurality of leads;

    a semiconductor die including a backside, and source and drain terminals, wherein the backside, and the source and drain terminals are at opposite sides of the semiconductor die, and wherein the semiconductor die is directly coupled to the leadframe using solder; and

    a molding compound having a window, the molding compound covering at least a portion of the leadframe and at least a portion of the semiconductor die, wherein the plurality of leads extend out of the molding compound and laterally away from the molding compound, and wherein the backside of the semiconductor die is exposed through the window and forms an exterior surface of semiconductor die package and is substantially flush with an exterior surface of the molding compound.

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