Device for testing electronic devices

• US 6,720,784 B2
• Filed: 06/19/2002
• Issued: 04/13/2004
• Est. Priority Date: 06/20/2001
• Status: Active Grant

• Current Assignee: Heatron, Inc. (NIBE Industrier AB)
• Original Assignee: Heatron, Inc. (NIBE Industrier AB)
• Inventors: Deutschlander, G. James, Giardina, Richard N., Fetscher, Brian S., Martter, Robert H., Sundberg, Craig C.
• Primary Examiner(s): Nguyen, Vinh P.
• Application Number:
  US10/175,522
• Publication Number:
  US 20030016025A1
• Time in Patent Office: 664 Days
• Field of Search: 298/30, 298/42, 298/43, 174/256, 174/258, 174/255, 174/257, 174/260, 361/260, 361/793, 324/755, 324/754, 324/760, 324/765
• US Class Current: 324/750.05
• CPC Class Codes: G01R 31/2849 Environmental or reliability testing, e.g. burn-in or validation tests of individual semiconductors G01R31/2642; of printed circuits boards G01R31/2817; of IC's G01R31/2855
• CPC Class Codes: G01R 31/2863 Contacting devices, e.g. sockets, burn-in boards or mounting fixtures in general G01R1/04
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49126 Assembling bases

Abstract

An electric circuit board to test electronic devices at elevated temperatures. The board comprises a steel base having a dielectric coating layer and a circuit formed on the layer. The circuit includes a connector region for attachment to an external electrical source and a mounting region for mounting sockets for supporting, powering and monitoring the electronic devices during elevated temperature testing. The board displays a leakage current of less than 10μ Amps at 350° C.

Claims

1. A burn-in board for use In testing semiconductor chips at elevated temperatures comprising a steel base having a dielectric coating formed thereon, said dielectric coating having a circuit formed thereon, said circuit having a connector region for attachment to an external electrical source and a mounting region for mounting sockets for supporting said chips, said burn-in board having a leakage current of less than 10μ

Amps at 350°

C.

2. A burn-in board as set forth in claim 1 wherein said dielectric coating comprises multiple discrete layers of dielectric material.

3. A burn-in board as set forth in claim 1 wherein said dielectric coating comprises two discrete layers of dielectric material.

4. A burn-in board as set forth in claim 1 wherein said dielectric coating comprises a first layer of porcelain enamel and a second layer of high-performance porcelain enamel.

5. A burn-in board as set forth in claim 4 wherein said first and second layers of enamel are nonhomogeneous.

6. A burn-in board as set forth in claim 1 wherein said dielectric coating comprises at least three discrete layers of dielectric material.

7. A burn-in board as set forth in claim 6 wherein said discrete layers are homogeneous.

8. A burn-in board as set forth in claim 7 wherein said burn-in board displays a leakage current of less than 1μ

Amps at 350°

C.

9. A burn-in board as set forth in claim 1 wherein said base comprises stainless steel.