Screen input type display device

• US 6,721,019 B2
• Filed: 04/20/2001
• Issued: 04/13/2004
• Est. Priority Date: 05/17/2000
• Status: Expired due to Fees

• Current Assignee: Hitachi Device Engineering Co., Ltd., Hitachi Chiba Electronics Company Limited (Hitachi, Ltd.), Hitachi, Ltd.
• Original Assignee: Hitachi Device Engineering Co., Ltd., Hitachi Chiba Electronics Company Limited (Hitachi, Ltd.), Hitachi, Ltd.
• Inventors: Ishii, Koji, Ishii, Kazuo, Kakinuma, Akira, Kono, Masao, Otsuka, Haruhisa
• Primary Examiner(s): Flynn, Nathan J.
• Assistant Examiner(s): Erdem, Fazli
• Application Number:
  US09/838,213
• Publication Number:
  US 20010043291A1
• Time in Patent Office: 1,089 Days
• Field of Search: 349/12, 349/23, 349/24, 349/58, 349/156, 349/158, 349/162, 349/122, 349/117
• US Class Current: 349/12
• CPC Class Codes: G02F 1/13338 Input devices, e.g. touch panels
• CPC Class Codes: G02F 1/133616 Front illuminating devices
• CPC Class Codes: G02F 2203/02 reflective
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: G06F 3/045 using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact

Abstract

There is provided a highly reliable screen input type display device using a touch panel which can facilitate the control of a gap formed between upper and lower substrates and can stabilize the linearity of the resistance value detection of a resistance film, whereby an erroneous detection of coordinated can be eliminated. For this purpose, a tape-like conductive pressure sensitive adhesive member, which is formed by sandwiching a metal foil with conductive pressure sensitive adhesive material, is used at a connection portion between an upper wiring electrode mounted on an upper resistance film formed on an upper substrate and an inter-substrate connection wiring electrode formed on a lower substrate.

Claims

1. A screen input type display device which arranges a touch panel on a display surface of a display device, the touch panel comprising:

a first substrate having a first resistance film,

a second substrate having a second resistance film,

an inter-substrate connection wiring electrode being formed on the second substrate, and

a conductive pressure sensitive adhesive member being disposed between the first resistance film and the inter-substrate connection wiring electrode, the conductive pressure sensitive adhesive member electrically connecting the first resistance film and the inter-substrate connection wiring electrode, and the conductive pressure sensitive adhesive member having pressure sensitive adhesive material in which conductive particles are mixed formed on both surfaces of a metal foil for laminating the first substrate and the second substrate.

2. A screen input type display device according to claim 1, wherein the first resistance film and the conductive pressure sensitive adhesive member are directly brought into contact with each other.

3. A screen input type display device according to claim 1, wherein a first wiring electrode formed on the first resistance film is interposed between the first resistance film and the conductive pressure sensitive adhesive member.

4. A screen input type display device according to claim 1, wherein the metal foil is a copper foil.

5. A screen input type display device according to claim 1, wherein the conductive particles are metal particles.

6. A screen input type display device according to claim 1, wherein the conductive particles are plastic particles to which a conductive metal plating is applied or glass particles to which a conductive metal plating is applied.

7. A screen input type display device according to claim 1, wherein the conductive particles at the first substrate side of the metal foil and the conductive particles at the second substrate side of the metal foil are different in kind from each other.

8. A screen input type display device according to claim 1, wherein the first substrate is formed of a soft film member and the second substrate is formed of a hard plate.

9. A screen input type display device according to claim 1, wherein one of the first substrate and the second substrate is formed of a soft film member and the other is formed of a hard plate, the conductive particles at the hard plate side of the metal foil are formed of plastic particles to which a conductive metal plating is applied and the conductive particles at the soft film member side of the metal foil are formed of metal particles.

10. A screen input type display device which arranges a touch panel on a display surface of a display device, the touch panel comprising:

a first substrate having a first resistance film,

a second substrate having a second resistance film,

an inter-substrate connection wiring electrode being formed on the second substrate, and

a conductive pressure sensitive adhesive member being disposed between the first resistance film and the inter-substrate connection wiring electrode, the conductive pressure sensitive adhesive member electrically connecting the first resistance film and the inter-substrate connection wiring electrode, and the conductive pressure sensitive adhesive member having pressure sensitive adhesive material in which plastic particles to which a conductive metal plating is applied are mixed for laminating the first substrate and the second substrate.

11. A screen input type display device according to claim 10, wherein the first resistance film and the conductive pressure sensitive adhesive member are directly brought into contact with each other.

12. A screen input type display device according to claim 10, wherein a first wiring electrode formed on the first resistance film is interposed between the first resistance film and the conductive pressure sensitive adhesive member.

13. An electronic system having a touch panel on a display surface of a display device, the touch panel comprising:

a first substrate having a first resistance film,

a second substrate having a second resistance film,

an inter-substrate connection wiring electrode being formed on the second substrate, and

a conductive pressure sensitive adhesive member being disposed between the first resistance film and the inter-substrate connection wiring electrode, the conductive pressure sensitive adhesive member electrically connecting the first resistance film and the inter-substrate connection wiring electrode, and the conductive pressure sensitive adhesive member having pressure sensitive adhesive material in which conductive particles are mixed formed on both surfaces of a metal foil for laminating the first substrate and the second substrate.

14. An electronic system according to claim 13, wherein the first resistance film and the conductive pressure sensitive adhesive member are directly brought into contact with each other.

15. An electronic system according to claim 13, wherein a first wiring electrode formed on the first resistance film is interposed between the first resistance film and the conductive pressure sensitive adhesive member.

16. An electronic system according to claim 13, wherein the metal foil is a copper foil.

17. An electronic system according to claim 13, wherein the conductive particles are at least one of:

metal particles;

plastic particles to which a conductive metal plating is applied; and

, glass particles to which a conductive metal plating is applied.

18. An electronic system according to claim 13, wherein the conductive particles at the first substrate side of the metal foil and the conductive particles at the second substrate side of the metal foil are different in kind from each other.

19. An electronic system according to claim 13, wherein the first substrate is formed of a soft film member and the second substrate is formed of a hard plate.

20. An electronic system according to claim 13, wherein one of the first substrate and the second substrate is formed of a soft film member and the other is formed of a hard plate, the conductive particles at the hard plate side of the metal foil are formed of plastic particles to which a conductive metal plating is applied and the conductive particles at the soft film member side of the metal foil are formed of metal particles.