Die bonder

• US 6,722,412 B2
• Filed: 10/09/2002
• Issued: 04/20/2004
• Est. Priority Date: 11/19/2001
• Status: Active Grant

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Huang, Yao-ting, Chou, Kuang-Chun
• Primary Examiner(s): SELLS, JAMES D
• Application Number:
  US10/268,240
• Publication Number:
  US 20030094241A1
• Time in Patent Office: 559 Days
• Field of Search: 156/499, 156/538, 156/539, 156/556, 156/558, 156/578, 156/580, 156/583.1, 297/40, 297/42, 297/59
• US Class Current: 156/499
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: Y10T 156/17 Surface bonding means and/or assemblymeans with work feeding or handling means
• CPC Class Codes: Y10T 156/1744 Means bringing discrete articles into assembled relationship
• CPC Class Codes: Y10T 156/1798 with liquid adhesive or adhesive activator applying means
• CPC Class Codes: Y10T 29/53187 Multiple station assembly apparatus

Abstract

A die bonder includes a conveyor, a pre-heater, at least one carrier, a paste-dispensing mechanism, a die taking/placing mechanism, and a heater. The conveyor continuously operates in a ring-shaped manner. The carrier is carried on the conveyor to position the substrate. The pre-heater heats the substrate to eliminate the moisture in the substrate. The paste-dispensing mechanism dispenses an adhesive agent onto the substrate. Then, the die taking/placing mechanism places a die onto the substrate at a position where the adhesive agent is dispensed. Finally, the heater is used to cure the adhesive agent so as to bond the die to the substrate.

Claims

1. A die bonder for bonding a die to a substrate, comprising:

a conveyor continuously operating in a ring-shaped manner;

at least one carrier carried on the conveyor for positioning the substrate;

a paste-dispensing mechanism for dispensing an adhesive agent on the substrate; and

a die taking/placing mechanism for placing a die on the substrate at a position where the adhesive agent is dispensed.

2. The die bonder according to claim 1, further comprising:

a pre-heating mechanism for heating the substrate before the adhesive agent is dispensed.

3. The die bonder according to claim 1, further comprising:

a heater for curing the adhesive agent so as to bond the die to the substrate.

4. The die bonder according to claim 1, wherein the conveyor comprises a linear track.

5. The die bonder according to claim 1, wherein the conveyor comprises a plurality of rollers.

6. The die bonder according to claim 1, wherein the conveyor circulates along a horizontal direction.

7. The die bonder according to claim 1, wherein the conveyor circulates along a vertical direction.

8. The die bonder according to claim 1, wherein the carrier comprises a plurality of pressers arranged on the carrier, the substrate is pressed and clamped by the pressers so that the substrate can be positioned on the carrier.

9. The die bonder according to claim 1, wherein the carrier is formed with a plurality of suction holes for providing a vacuum suction force so as to position the substrate on the carrier.

10. The die bonder according to claim 1, wherein the carrier is formed by a heat-resistant material.

11. The die bonder according to claim 1, further comprising:

a substrate robot for placing the substrate onto the carrier.

12. The die bonder according to claim 1, further comprising:

a puller for taking out the substrate from the carrier.

13. The die bonder according to claim 1, wherein the conveyor comprises:

a carrier magazine for storing the at least one carrier;

a elevator for moving the carrier magazine up and down; and

a shifter for transferring the carrier magazine.