Disposing method for semiconductor elements

• US 6,723,576 B2
• Filed: 06/29/2001
• Issued: 04/20/2004
• Est. Priority Date: 06/30/2000
• Status: Expired due to Term

• Current Assignee: BOE Technology Group Co., Ltd.
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Kimura, Mutsumi, Inoue, Satoshi, Nozawa, Ryoichi
• Primary Examiner(s): Niebling, John F.
• Assistant Examiner(s): ISAAC, STANETTA D
• Application Number:
  US09/896,818
• Publication Number:
  US 20020160546A1
• Time in Patent Office: 1,026 Days
• Field of Search: 438/30, 438/40, 438/43, 438/67, 438/82, 438/99, 438/113, 438/455, 438/459, 438/665, 438/666, 438/692, 438/693, 438/701
• US Class Current: 438/30
• CPC Class Codes: H01L 2224/95092 Atmospheric pressure, e.g. dry self-assembly
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: H10K 59/129 Chiplets
• CPC Class Codes: H10K 59/131 Interconnections, e.g. wiring lines or terminals
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/13 using printing techniques, e.g. ink-jet printing or screen printing
• CPC Class Codes: H10K 71/40 Thermal treatment, e.g. annealing in the presence of a solvent vapour

Abstract

An active-matrix type organic EL display which uses transistors with less variation of characteristics (transistors in which active layer is a single crystal semiconductor) is made on a large area of a transparent base board at low cost. Plural unit of fine construction are formed on a silicon wafer in rows. This unit includes a driving element (switching transistor 34, driving transistor 37, capacity 36) of organic EL element (pixel) 35. Unit block 39 is produced by dividing this silicon wafer. This unit block 39 is disposed at a predetermined position of glass base board 52 (display base board). The driving element of each pixel 35 is connected by signal line 31, power supply line 32, scanning line 33, and capacity line 38.

Claims

1. A manufacturing method for an organic EL display which is provided with a semiconductor element for driving an organic EL element for a pixel or a plurality of pixels, comprising the steps of:

disposing a plurality of unit blocks having said semiconductor element on a first base board;

disposing each unit block on a second base board such that each unit block corresponds to the pixel or the plurality of pixels formed thereon, having a hole therein.

3. A manufacturing method for an organic EL display according to claim 1 comprising the steps of:

a concavity having a shape of the unit block being formed such that each unit block corresponds to the pixel or the plurality of pixels formed on the second base board; and

disposing each unit block at a position where the concavity is formed in a liquid.

4. A manufacturing method for an organic EL display according to claim 1 comprising the steps of:

a hole which penetrates in a thickness direction through the second base board being formed such that each unit block corresponds to the pixel or the plurality of pixels formed on the second base board;

introducing the unit block to a position of said hole on one face of the second base board by making a pressure at the one face of the second base board higher than a pressure at the other face, or by drawing a liquid into said hole, the unit block being disposed at the position of said hole on the second base board.

5. A manufacturing method for an organic EL display according to claim 4 wiring being performed by using said hole.

6. A manufacturing method for an organic EL display according to claim 1 the unit block being introduced to be disposed by Coulomb attractive force such that each unit block corresponds to the pixel or the plurality of pixels formed thereon.

7. A manufacturing method for an organic EL display according to claim 1 characterized in disposing materials for an organic EL element for a pixel or a plurality of pixels on the second base board by an ink jet method.

8. A manufacturing method for an organic EL display according to claim 1 characterized in forming wiring above the second base board by an ink jet method.

9. A manufacturing method for an organic EL display according to claim 1 wherein the driving method is active-matrix method.

2. A manufacturing method for an organic EL display, which is provided with a semiconductor element for driving an organic EL element for a pixel or a plurality of pixels, comprising the steps of:

disposing a plurality of unit blocks having said semiconductor element on a first base board, which is composed of a single crystalline semiconductor;

dicing the first base board so as to be divided per unit block; and

disposing each unit block on a second base board, such that each unit block corresponds to the pixel or the plurality of pixels formed thereon, having a hole therein.

24. A manufacturing method for an organic EL display according to claim 2 wherein the driving method is active-matrix method.

10. Manufacturing method for an organic EL display which is provided with a semiconductor element for driving an organic EL element for a pixel or a plurality of the pixels, comprising the steps of:

disposing a plurality of unit blocks having said semiconductor element and first connecting terminals which are connected to the semiconductor element on a first base board;

disposing wirings and second connecting terminals above a second base board; and

disposing each unit block on the second base board such that each unit block corresponds to the pixel or the plurality of pixels formed on the second base board and the first connecting terminals which are disposed on the unit block are connected with the second connecting terminals which are disposed on the second base board, having a hold therein.

11. Manufacturing method for an organic EL display according to claim 10

the unit blocks having plural semiconductor elements for driving plural neighboring organic EL elements,

a planar shape of the unit block is polygonal and the first connecting terminals are rotationally symmetrically centered at a center of the polygon, and a number of corners of the polygon corresponds to a number of the semiconductors formed on the unit block.

12. Manufacturing method for a organic EL display according to claim 10

the unit blocks having plural semiconductor elements for driving plural neighboring organic EL elements, and

a planar shape of the unit blocks being rectangular, the first connecting terminals are disposed so as to be axis symmetric with respect to center lines which are parallel with a longer side of the rectangle or a shorter side of the rectangle.

13. Manufacturing method for an organic EL display according to claim 10

the unit block having plural semiconductor elements for driving plural neighboring organic EL elements, and

a planar shape of the unit block is polygonal and the first connecting terminals are disposed along diagonal lines of the polygon, and a position of the first terminals on the diagonal lines being such that the first connecting terminals are connected to the same wiring when the unit block is disposed on the second base board and the wiring is formed.

14. Manufacturing method for an organic EL display according to claim 11 said polygon being an equilateral polygon.

15. Manufacturing method for an organic EL display according to claim 13 said polygon being an equilateral polygon.

23. Manufacturing method for an organic EL display according to claim 10 wherein the wirings are a scanning line, a signal line, and a power supply line.

25. A manufacturing method for an organic EL display according to claim 10 wherein the driving method is active-matrix method.

16. A manufacturing method for an organic EL display, which is provided with an organic EL element and a semiconductor element for driving the organic EL element for a pixel or a plurality of the pixels, comprising the steps of:

disposing each unit block on a base board such that each unit block corresponds to the pixel or the plurality of pixels formed on the base board, having a hold therein,

each unit block having 3 semiconductor elements for driving 3 neighboring organic EL elements,

plural groups of organic EL elements made of 3 pieces of neighboring organic EL elements such as red color light emitting, blue color light emitting, green color light emitting being disposed on the base board, and

each of the semiconductor elements for driving 3 pieces of neighboring organic EL elements being disposed at a position which is centered relative to the 3 pieces of neighboring organic EL element per group.

17. A manufacturing method for an organic EL display, which is provided with an organic EL element and a semiconductor element for driving the organic EL element for a pixel or a plurality of pixels, comprising the steps of:

disposing each unit block on a base board such that each unit block corresponds to the pixel or the plurality of pixels formed on the base board, having a hole therein,

the unit block having plural semiconductor elements for driving plural neighboring organic EL elements, and

plural groups of organic EL elements made of 6 pieces of neighboring organic EL elements such as 2 pieces of red color light emitting, 2 pieces of blue color light emitting, 2 pieces of green color light emitting being disposed on the base board,

each unit block having semiconductor elements for driving 6 pieces of neighboring organic EL elements being disposed at a position which is centered relative to the 6 pieces of neighboring organic EL element per group.

18. A disposing method for a semiconductor element in which a unit block having a semiconductor element is disposed at a predetermined position on a base board,

the disposing method for a semiconductor element characterized in that by arranging a hole, which penetrates in a thickness direction through the base board and by making a pressure at one face of the base board higher than a pressure at the other face, or by drawing a liquid into said hole, the unit block being disposed at a position of the hole on the base board so as to introduce the unit block to the position of said hole on one face of the base board.

19. A disposing method for a semiconductor element in which a unit block having a semiconductor element is disposed at a predetermined position on a base board, comprising the steps of:

disposing a plurality of unit blocks having said semiconductor element and first connecting terminals which are connected to the semiconductor element on a first base board;

disposing wirings and second connecting terminals above a second base board;

disposing each unit block on the second base board at a predetermined position so as to connect the first connecting terminals which are disposed on the unit block with the second connecting terminals which are disposed on the second base board, having a hole therein.

20. A manufacturing method for a semiconductor device having a process in which a unit block having plural semiconductor elements is disposed at a predetermined position on a first base board,

a planar shape of the unit block is polygonal and first connecting terminals are disposed along diagonal lines of the polygon,

and a position of the first terminals on the diagonal lines being such that the first connecting terminals are connected to the same wiring when the unit block is disposed on a second base board, having a hole therein.

21. A manufacturing method for an organic EL display according to claim 20 said polygon being an equilateral polygon.

22. A manufacturing method for an electro-optic device which is provided with a semiconductor element for driving an organic electro-optic for a pixel or a plurality of pixels, comprising the steps of:

disposing a plurality of unit blocks having said semiconductor element on a first base board;

disposing each unit block, which is formed on the first base board, on a second base board, having a hole therein such that each unit block corresponds to the pixel or the plurality of pixels formed thereon.