Microcoil

• US 6,724,290 B1
• Filed: 09/22/2000
• Issued: 04/20/2004
• Est. Priority Date: 09/24/1999
• Status: Expired due to Fees

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Elsner, Bernhard, Ohnmacht, Markus
• Primary Examiner(s): Nguyen, Tuyen T.
• Application Number:
  US09/668,258
• Time in Patent Office: 1,306 Days
• Field of Search: 336/83, 336/200, 336/84.R, 336/84.M, 257/531, 360/281.5, 360/281.6, 360/319
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A coil constructed using the additive technique on the surface of a substrate is characterized in that the conductors of the coil are in contact with an insulating material made at least in part of diamond or diamond-like carbon.

Claims

1. A coil, comprising:

a plurality of conductors in contact with an insulating body;

wherein the insulating body includes one of diamond and a diamond-like carbon;

wherein the coil includes a structure arranged on a surface of a substrate and constructed thereon using an additive technique,

wherein the substrate is a semiconductor substrate,

wherein the coil is connected to an integrated circuit arranged in the substrate beneath the coil; and

wherein the structure of the coil is connected to the integrated circuit at a location in the substrate.

2. The coil according to claim 1, wherein:

the coil is surrounded by a sheathing of a magnetically shielding material.

3. The coil according to claim 1, wherein:

the insulating body includes at least a mixture containing diamond crystals.

4. The coil according to claim 3, wherein:

the mixture includes one of an oxide, a nitride, and a polymer material.

5. The coil according to claim 3, wherein:

the mixture includes a photolithographically structurable polymer material.

6. The coil according to claim 1, wherein:

the insulating body includes at least one layer of one of the diamond and the diamond-like carbon extending over an entire cross section of the coil.

7. The coil according to claim 6, wherein:

the at least one layer of one of the diamond and the diamond-like carbon is arranged in direct contact with the plurality of conductors.

8. The coil according to claim 6, wherein:

the plurality of conductors are arranged in multiple planes, each plane being provided with at least one of the at least one layer of the diamond and the diamond-like carbon.