Stage assembly including a damping assembly

• US 6,724,466 B2
• Filed: 03/26/2002
• Issued: 04/20/2004
• Est. Priority Date: 03/26/2002
• Status: Expired due to Fees

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Hazelton, Andrew J., Ono, Kazuya
• Primary Examiner(s): Adams, Russell
• Assistant Examiner(s): ESPLIN, DAVID B
• Application Number:
  US10/107,663
• Publication Number:
  US 20030184724A1
• Time in Patent Office: 756 Days
• Field of Search: 355/53, 355/72, 355/75, 355/77
• US Class Current: 355/72
• CPC Class Codes: G03F 7/70716 Stages
• CPC Class Codes: G03F 7/70766 Reaction force control means, e.g. countermass

Abstract

A stage assembly (10) for moving and positioning a device (30) includes a stage (14), a stage mover assembly (16), a device table (18), a table mover assembly (20) and a damping assembly (22). The table mover assembly (20) moves the device table (18) along a Z axis, about an X axis and about a Y axis relative to the stage (14) and generates reaction forces. The damping assembly (22) is coupled to the table mover assembly (20). Uniquely, the damping assembly (22) reduces the reaction forces created by the table mover assembly (20) that are transferred to the stage (14).

Claims

1. A stage assembly that moves a device, the stage assembly comprising:

a stage that is movable above a guide surface;

a device table coupled to the stage, the device table retaining the device;

a mover assembly connected to the device table, the mover assembly moving the device table relative to the stage and generates reaction forces and moves the stage; and

a damping assembly coupled to the mover assembly, the damping assembly reducing the reaction forces that are transferred to the stage.

2. The stage assembly of claim 1 wherein the damping assembly is coupled to the mover assembly and the stage.

3. The stage assembly of claim 1 wherein the mover assembly moves the device table with at least two degrees of freedom and the damping assembly reduces the reaction forces in the two degrees of freedom that are transferred to the stage.

4. The stage assembly of claim 1 wherein the mover assembly moves the device table with at least three degrees of freedom and the damping assembly reduces the reaction forces in the three degrees of freedom that are transferred to the stage.

5. The stage assembly of claim 1 wherein the mover assembly moves the device table along a Z axis that is orthogonal to the guide surface and the damping assembly reduces the reaction forces along the Z axis that are transferred to the stage.

6. The stage assembly of claim 5 wherein the mover assembly moves the device table along a Z axis at least, about an X axis and about a Y axis and the damping assembly reduces the reaction forces along the Z axis, about the X axis and about the Y axis that are transferred to the stage.

7. The stage assembly of claim 5 wherein the damping assembly includes a Z reaction mass that moves relative to the stage with at least one degree of freedom and wherein the mover assembly is coupled to the Z reaction mass.

8. The stage assembly of claim 7 wherein the Z reaction mass moves relative to the stage with three degrees of freedom.

9. The stage assembly of claim 7 wherein the damping assembly includes a mass guide that allows for motion of the Z reaction mass relative to the stage.

10. The stage assembly of claim 9 wherein the mass guide includes a flexible connector that flexibly secures the Z reaction mass to the stage.

11. The stage assembly of claim 9 wherein the mass guide allows for motion of the Z reaction mass along a Z axis and inhibits motion of the Z reaction mass along an X axis.

12. The stage assembly of claim 7 wherein the damping assembly includes mass trim that adjusts the position of the Z reaction mass relative to the stage.

13. The stage assembly of claim 12 wherein the mass trim includes at least one trim mover that is connected to the Z reaction mass and moves the Z reaction mass relative to the stage.

14. The stage assembly of claim 12 wherein the mass trim includes a fluid bellow that is connected to the Z reaction mass.

15. The stage assembly of claim 5 wherein the mover assembly includes a vertical mover assembly that moves the device table along a Z axis, about an X axis and about a Y axis relative to the stage, the vertical mover assembly including a first component secured to the device table and a second component secured to the damping assembly.

16. The stage assembly of claim 15 wherein the mover assembly includes a horizontal mover assembly that moves the device table along the X axis, along the Y axis and about the Z axis relative to the stage.

17. The stage assembly of claim 1 wherein the mover assembly generates reaction forces when moving the stage;

wherein the stage assembly further comprises a stage base that includes the guide surface and supports the stage and wherein the damper assembly reduces the reaction forces generated during movement of the stage by the mover assembly that are transferred to the stage base.

18. The stage assembly of claim 1 wherein the mover assembly moves the device table with at least four degrees of freedom and the damping assembly reduces the reaction forces in the at least four degrees of freedom.

19. The stage assembly of claim 1 wherein the mover assembly moves the device table with six degrees of freedom and the damping assembly reduces the reaction forces in the six degrees of freedom.

20. An exposure apparatus including the stage assembly of claim 1.

21. A process for manufacturing a device including the step of utilizing the exposure apparatus according to claim 20.

22. A process for making a wafer on which an image has been formed including the step of utilizing the exposure apparatus according to claim 20.

23. A stage assembly that moves a device relative to a stage base, the stage assembly comprising:

a stage;

a device table that retains the device, the device table being coupled to the stage;

a mover assembly coupled to the device table, the mover assembly moving the stage and the device table with at least one degree of freedom relative to the stage base and generating reaction forces in at least one degree of freedom, the mover assembly moving the device table with at least one degree of freedom relative to the stage and generating reaction forces in at least one degree of freedom; and

a damping assembly coupled to the mover assembly, the damping assembly reducing the reaction forces from the mover assembly in at least one degree of freedom that are transferred to the stage base, the damping assembly reducing the reaction forces from the mover assembly in at least one degree of freedom that are transferred to the stage.

24. The stage assembly of claim 23 wherein the mover assembly moves the device table with five degrees of freedom and the damping assembly is adapted to reduce the reaction forces in the five degrees of freedom that are transferred to the stage base.

25. The stage assembly of claim 23 wherein the mover assembly moves the device table with six degrees of freedom and the damping assembly is adapted to reduce the reaction forces in the six degrees of freedom that are transferred to the stage base.

26. The stage assembly of claim 23 wherein the damping assembly reduces the reaction forces that are transferred to the stage base during movement of the stage relative to the stage base.

27. The stage assembly of claim 23 wherein the mover assembly moves the device table along a Z axis, about an X axis and about a Y axis, the Z axis is orthogonal to a guide surface of the stage base and, the X axis and the Y axis being orthogonal to the Z axis and the damping assembly reduces the reaction forces along the Z axis, about the X axis and about the Y axis that are transferred to the stage base.

28. The stage assembly of claim 27 wherein the damping assembly includes a Z reaction mass that moves relative to the stage base with at least one degree of freedom and wherein the mover assembly is coupled to the Z reaction mass.

29. The stage assembly of claim 28 wherein the Z reaction mass moves relative to the stage base with three degrees of freedom.

30. The stage assembly of claim 29 wherein the damping assembly includes a mass guide that allows for motion of the Z reaction mass relative to the stage base.

31. The stage assembly of claim 30 wherein the mass guide includes a flexible connector that flexibly secures the Z reaction mass to the stage.

32. The stage assembly of claim 30 wherein the mass guide allows for motion of the Z reaction mass along a Z axis and inhibits motion of the Z reaction mass along an X axis relative to the stage base.

33. The stage assembly of claim 29 wherein the damping assembly includes a mass trim that adjusts the position of the Z reaction mass relative to the stage base.

34. The stage assembly of claim 33 wherein the mass trim includes at least one trim mover that is connected to the Z reaction mass and moves the Z reaction mass relative to the stage base.

35. The stage assembly of claim 33 wherein the mass trim includes a fluid bellow that is coupled to the Z reaction mass.

36. The stage assembly of claim 27 wherein the mover assembly includes a vertical mover assembly that moves the device table along a Z axis, about an X axis and about a Y axis relative to the stage base, the vertical mover assembly including a first component secured to the device table and a second component secured to the damping assembly.

37. The stage assembly of claim 36 wherein the mover assembly includes a horizontal mover assembly that moves the device table along the X axis, along the Y axis and about the Z axis relative to the stage base.

38. The stage assembly of claim 27 wherein the damping assembly includes a Z reaction mass that moves along a Z axis and a X reaction mass that moves along an X axis.

39. The stage assembly of claim 27 wherein the damping assembly includes a Z reaction mass that moves along a Z axis, a X reaction mass that moves along an X axis and a Y reaction mass that moves along a Y axis.

40. The stage assembly of claim 39 wherein the Z reaction mass also moves at least one of about the X axis and about the Y axis.

41. The stage assembly of claim 39 wherein the mover assembly includes (i) a stage mover assembly that moves the stage relative to the stage base, the stage mover assembly being coupled to the X reaction mass and the Y reaction mass so that movement of the stage by the stage mover assembly results in movement of the X reaction mass and the Y reaction mass, and (ii) a table mover assembly that moves the device table relative to the stage, the table mover assembly being coupled to the Z reaction mass so that movement of the device table by the table mover assembly results in movement of the Z reaction mass.

42. The stage assembly of claim 39 further comprising a reaction mover assembly that adjusts the position of the X reaction mass relative to the stage base along the X axis.

43. The stage assembly of claim 42 wherein the reaction mover assembly adjusts the position of the Y reaction mass relative to the stage base along the Y axis.

44. An exposure apparatus including the stage assembly of claim 23.

45. A process for manufacturing a device including the step of utilizing the exposure apparatus according to claim 44.

46. A process for making a wafer on which an image has been formed including the step of utilizing the exposure apparatus according to claim 44.

47. A stage assembly that moves a device along a Z axis, about an X axis and about a Y axis relative to a stage base, the X axis and the Y axis being substantially orthogonal to the Z axis, the stage assembly comprising:

a stage that is supported by the stage base;

a device table that retains the device;

a mover assembly connected to the device table, the mover assembly moving the device table along the Z axis, about the X axis and about the Y axis and generating reaction forces, the mover assembly moving the device table with at least one degree of freedom relative to the stage and generating reaction forces in at least one degree of freedom; and

a damping assembly coupled to the mover assembly, the damping assembly being adapted to reduce the reaction forces along at least one of the Z axis, about the X axis and about the Y axis that are transferred to the stage base, the damping assembly reducing the reaction forces from the mover assembly in at least one degree of freedom that are transferred to the stage.

48. The stage assembly of claim 47 wherein the mover assembly moves the device table with at least four degrees of freedom relative to the stage base and generates reaction forces in at least four degrees of freedom;

and the damping assembly reduces the reaction forces from the mover assembly in at least four degrees of freedom that are transferred to the stage base.

49. The stage assembly of claim 47 wherein the mover assembly moves the device table with six degrees of freedom and the damping assembly is adapted to reduce the reaction forces in the six degrees of freedom that are transferred to the stage base.

50. The stage assembly of claim 47 wherein the mover assembly moves the stage relative to the stage base.

51. The stage assembly of claim 50 wherein the damping assembly reduces the reaction forces that are transferred to the stage base during movement of the stage relative to the stage base.

52. The stage assembly of claim 47 wherein the damping assembly includes a Z reaction mass that moves relative to the stage base with at least one degree of freedom and wherein the mover assembly is coupled to the Z reaction mass.

53. The stage assembly of claim 52 wherein the Z reaction mass moves relative to the stage base with three degrees of freedom.

54. The stage assembly of claim 52 wherein the damping assembly includes a mass guide that allows for motion of the Z reaction mass relative to the stage base.

55. The stage assembly of claim 54 wherein the mass guide includes a flexible connector that flexibly secures the Z reaction mass.

56. The stage assembly of claim 54 wherein the mass guide allows for motion of the Z reaction mass along the Z axis and inhibits motion of the Z reaction mass along the X axis relative to the stage base.

57. The stage assembly of claim 52 wherein the damping assembly includes mass trim that adjusts the position of the Z reaction mass relative to the stage base.

58. The stage assembly of claim 57 wherein the mass trim includes at least one trim mover that is connected to the Z reaction mass and moves the Z reaction mass relative to the stage base.

59. The stage assembly of claim 57 wherein the mass trim includes a fluid bellow that is coupled to the Z reaction mass.

60. The stage assembly of claim 47 wherein the mover assembly includes a vertical mover assembly that moves the device table along the Z axis, about the X axis and about the Y axis relative to the stage base, the vertical mover assembly including a first component coupled to the device table and a second component coupled to the damping assembly.

61. The stage assembly of claim 60 wherein the mover assembly includes a horizontal mover assembly that moves the device table along the X axis, along the Y axis and about the Z axis relative to the stage base.

62. The stage assembly of claim 47 wherein the damping assembly includes a Z reaction mass that moves along the Z axis and a X reaction mass that moves along the X axis.

63. The stage assembly of claim 47 wherein the damping assembly includes a Z reaction mass that moves along the Z axis, a X reaction mass that moves along the X axis and a Y reaction mass that moves along the Y axis.

64. The stage assembly of claim 63 wherein the Z reaction mass also moves at least one of about the X axis and about the Y axis.

65. The stage assembly of claim 63 wherein the mover assembly includes (i) a stage mover assembly that moves the stage relative to the stage base, the stage mover assembly being coupled to the X reaction mass and the Y reaction mass so that movement of the stage by the stage mover assembly results in movement of the X reaction mass and the Y reaction mass, and (ii) a table mover assembly that moves the device table relative to the stage, the table mover assembly being coupled to the Z reaction mass so that movement of the device table by the table mover assembly results in movement of the Z reaction mass.

66. The stage assembly of claim 63 further comprising a reaction mover assembly that adjusts the position of the X reaction mass relative to the stage base along the X axis.

67. The stage assembly of claim 66 wherein the reaction mover assembly adjusts the position of the Y reaction mass relative to the stage base along the Y axis.

68. An exposure apparatus including the stage assembly of claim 47.

69. A process for manufacturing a device including the step of utilizing the exposure apparatus according to claim 68.

70. A process for making a wafer on which an image has been formed including the step of utilizing the exposure apparatus according to claim 68.

71. A method for making a stage assembly that moves a device, the method comprising the steps of:

providing a stage, the stage being movable above a guide surface;

connecting a stage mover assembly to the stage;

providing a device table that retains the device;

connecting a table mover assembly to the device table, the table mover assembly generating reaction forces; and

connecting a damping assembly to the table mover assembly, the damping assembly reducing the reaction forces that are transferred to the stage.

72. The method of claim 71 wherein the mover assembly moves the device table along a Z axis that is orthogonal to the guide surface and the damping assembly reduces the reaction forces along the Z axis that are transferred to the stage.

73. The method of claim 72 wherein the table mover assembly moves the device table with at least two degrees of freedom and the damping assembly reduces the reaction forces with at least two degrees of freedom that are transferred to the stage.

74. The method of claim 72 wherein the table mover assembly moves the device table with at least three degrees of freedom and the damping assembly reduces the reaction forces with at least three degrees of freedom that are transferred to the stage.

75. The method of claim 74 wherein the table mover assembly moves the device table along a Z axis, about an X axis and about a Y axis and the damping assembly reduces the reaction forces along a Z axis, about an X axis and about a Y axis that are transferred to the stage.

76. The method of claim 72 wherein the damping assembly includes a Z reaction mass that moves relative to the stage with at least one degree of freedom and wherein the table mover assembly is coupled to the Z reaction mass.

77. The method of claim 76 wherein the step of providing a Z reaction mass includes the step of connecting the Z reaction mass to the stage so that the Z reaction mass is free to move relative to the stage with three degrees of freedom.

78. The method of claim 76 wherein the Z reaction mass moves relative to the stage with three degrees of freedom.

79. A method for making an exposure apparatus that forms an image on a substrate, the method comprising the steps of:

providing an irradiation apparatus that irradiates the substrate with radiation to form the image on the substrate; and

providing the stage assembly made by the method of claim 71.

80. A method of making a wafer utilizing the exposure apparatus made by the method of claim 79.

96. A method for making an object including at least the photolithography process, wherein the photolithography process utilizes the exposure apparatus made by the method of claim 79.

81. A method for making a stage assembly that moves a device relative to a stage base, the method comprising the steps of:

providing a stage that is supported by the stage base;

providing a device table that retains the device;

connecting a mover assembly to the device table, the mover assembly moving the device table with at least four degrees of freedom relative to the stage base and generating reaction forces in the four degrees of freedom; and

connecting a damping assembly to the mover assembly, at least a portion of the damping assembly being located substantially directly between the stage and the device table, the damping assembly reducing the reaction forces from the mover assembly in at least four degrees of freedom that are transferred to the stage base.

82. The method of claim 81 wherein the mover assembly moves the device table along a Z axis that is orthogonal to a guide surface of the stage base, about an X axis and about a Y axis, and the damping assembly reduces the reaction forces along the Z axis, about the X axis and about the Y axis that are transferred to the stage base.

83. The method of claim 81 wherein the mover assembly moves the device table with at least five degrees of freedom and the damping assembly reduces the reaction forces with at least five degrees of freedom that are transferred to the stage base.

84. The method of claim 81 wherein the mover assembly moves the device table with at least six degrees of freedom and the damping assembly reduces the reaction forces with at least six degrees of freedom that are transferred to the stage base.

85. The method of claim 81 wherein the step of connecting the damping assembly includes the step of connecting a Z reaction mass to the mover assembly, the Z reaction mass moving relative to the stage base with at least one degree of freedom.

86. The method of claim 85 wherein the step of connecting a Z reaction mass includes the step of coupling the Z reaction mass to the stage so that the Z reaction mass is free to move relative to the stage with three degrees of freedom.

87. A method for making an exposure apparatus that forms an image on a substrate, the method comprising the steps of:

providing an irradiation apparatus that irradiates the substrate with radiation to form the image on the substrate; and

providing the stage assembly made by the method of claim 81.

88. A method of making a wafer utilizing the exposure apparatus made by the method of claim 87.

97. A method for making an object including at least the photolithography process, wherein the photolithography process utilizes the exposure apparatus made by the method of claim 87.

89. A method for making a stage assembly that moves a device along a Z axis, about an X axis and about a Y axis relative to a stage base, the X axis and the Y axis being substantially orthogonal to the Z axis, the method comprising the steps of:

providing a stage that is supported by the stage base;

providing a device table that retains the device;

connecting a mover assembly to the device table, the mover assembly moving the device table along the Z axis, about the X axis and about the Y axis and generating forces along the Z axis, about the X axis and about the Y axis; and

connecting a damping assembly to the mover assembly, at least a portion of the damping assembly being located substantially directly between the stage and the device table, the damping assembly reducing the reaction forces along the Z axis, about the X axis and about the Y axis that are transferred to the stage base.

90. The method of claim 89 wherein the mover assembly moves the device table along the X axis and of the damping assembly reduces the reaction forces along the X axis that are transferred to the stage base.

91. The method of claim 90 wherein the mover assembly moves the device table along the Y axis and the damping assembly reduces the reaction forces along the Y axis that are transferred to the stage base.

92. The method of claim 91 wherein the mover assembly moves the device table about the Z axis and the damping assembly reduces the reaction forces about the Z axis that are transferred to the stage base.

93. The method of claim 92 wherein the step of connecting the damping assembly includes the step of connecting a Z reaction mass, and X reaction mass, and a Y reaction mass to the mover assembly respectively, and wherein

the Z reaction mass moves along the Z axis;

the X reaction mass moves along the X axis; and

the Y reaction mass moves along the Y axis.

94. A method for making an exposure apparatus that forms an image on a substrate, the method comprising the steps of:

providing an irradiation apparatus that irradiates the substrate with radiation to form the image on the substrate; and

providing the stage assembly made by the method of claim 89.

95. A method of making a wafer utilizing the exposure apparatus made by the method of claim 94.

98. A method for making an object including at least the photolithography process, wherein the photolithography process utilizes the exposure apparatus made by the method of claim 94.

99. A stage assembly that moves a device relative to a stage base, the stage assembly comprising:

a device table that retains the device;

a mover assembly coupled to the device table, the mover assembly moving the device table with at least four degrees of freedom relative to the stage base and generating reaction forces in at least four degrees of freedom, the mover assembly including a vertical assembly mover that moves the device table along a Z axis, about an X axis and about a Y axis relative to the stage base, the Z axis being orthogonal to a guide surface of the stage base, and the X axis and the Y axis being orthogonal to the Z axis; and

a damping assembly coupled to the mover assembly, the damping assembly reducing the reaction forces from the mover assembly in at least four degrees of freedom that are transferred to the stage base, the damping assembly reducing the reaction forces along the Z axis, about the X axis and about the Y axis that are transferred to the stage base, the vertical mover assembly including a first component secured to the device table and a second component secured to the damping assembly.

100. The stage assembly of claim 99 wherein the mover assembly includes a horizontal mover assembly that moves the device table along the X axis, along the Y axis and about the Z axis relative to the stage base.

101. The stage assembly of claim 99 wherein the mover assembly moves the device table with five degrees of freedom and the damping assembly is adapted to reduce the reaction forces in the five degrees of freedom that are transferred to the stage base.

102. The stage assembly of claim 99 wherein the mover assembly moves the device table with six degrees of freedom and the damping assembly is adapted to reduce the reaction forces in the six degrees of freedom that are transferred to the stage base.

103. The stage assembly of claim 99 further comprising a stage, wherein the mover assembly moves the stage relative to the stage base and the mover assembly moves the device table relative to the stage and wherein the damping assembly is coupled to the stage and reduces the reaction forces that are transferred to the stage.

104. The stage assembly of claim 103 wherein the damping assembly reduces the reaction forces that are transferred to the stage base during movement of the stage relative to the stage base.

105. The stage assembly of claim 99 wherein the damping assembly includes a Z reaction mass that moves relative to the stage base with at least one degree of freedom and wherein the mover assembly is coupled to the Z reaction mass.

106. The stage assembly of claim 105 wherein the Z reaction mass moves relative to the stage base with three degrees of freedom.

107. The stage assembly of claim 105 wherein the damping assembly includes a mass guide that allows for motion of the Z reaction mass relative to the stage base.

108. The stage assembly of claim 107 wherein the mass guide includes a flexible connector that flexibly secures the Z reaction mass to a stage.

109. The stage assembly of claim 107 wherein the mass guide allows for motion of the Z reaction mass along the Z axis and inhibits motion of the Z reaction mass along the X axis relative to the stage base.

110. The stage assembly of claim 105 wherein the damping assembly includes a mass trim that adjusts the position of the Z reaction mass relative to the stage base.

111. The stage assembly of claim 110 wherein the mass trim includes at least one trim motor that is connected to the Z reaction mass and moves the Z reaction mass relative to the stage base.

112. The stage assembly of claim 110 wherein the mass trim includes a fluid bellow that is coupled to the Z reaction mass.

113. An exposure apparatus including the stage assembly of claim 99.

114. A process for manufacturing a device including the step of utilizing the exposure apparatus according to claim 113.

115. A process for making a wafer on which an image has been formed including the step of utilizing the exposure apparatus according to claim 113.

116. A stage assembly that moves a device relative to a stage base, the stage assembly comprising:

a device table that retains the device;

a mover assembly coupled to the device table, the mover assembly moving the device table with at least four degrees of freedom relative to the stage base and generating reaction forces in at least four degrees of freedom, the mover assembly moving the device table along a Z axis, about an X axis and about a Y axis relative to the stage base, the Z axis being orthogonal to a guide surface of the stage base, and the X axis and the Y axis being orthogonal to the Z axis; and

a damping assembly coupled to the mover assembly, the damping assembly reducing the reaction forces from the mover assembly in at least four degrees of freedom that are transferred to the stage base, the damping assembly reducing the reaction forces along the Z axis, about the X axis and about the Y axis that are transferred to the stage base, the damping assembly including a Z reaction mass that moves along the Z axis and an X reaction mass that moves along the X axis.

117. The stage assembly of claim 116 wherein the damping assembly further includes a Y reaction mass that moves along the Y axis.

118. The stage assembly of claim 117 wherein the Z reaction mass also moves at least one of about the X axis and about the Y axis.

119. The stage assembly of claim 117 wherein the mover assembly includes (i) a stage mover assembly that moves a stage relative to the stage base, the stage mover assembly being coupled to the X reaction mass and the Y reaction mass so that movement of the stage by the stage mover assembly results in movement of the X reaction mass and the Y reaction mass, and (ii) a table mover assembly that moves the device table relative to the stage, the table mover assembly being coupled to the Z reaction mass so that movement of the device table by the table mover assembly results in movement of the Z reaction mass.

120. The stage assembly of claim 117 further comprising a reaction mover assembly that adjusts the position of the X reaction mass relative to the stage base along the X axis.

121. The stage assembly of claim 120 wherein the reaction mover assembly adjusts the position of the Y reaction mass relative to the stage base along the Y axis.

122. The stage assembly of claim 116 wherein the mover assembly moves the device table with five degrees of freedom and the damping assembly is adapted to reduce the reaction forces in the five degrees of freedom that are transferred to the stage base.

123. The stage assembly of claim 116 wherein the mover assembly moves the device table with six degrees of freedom and the damping assembly is adapted to reduce the reaction forces in the six degrees of freedom that are transferred to the stage base.

124. The stage assembly of claim 116 further comprising a stage, wherein the mover assembly moves the stage relative to the stage base and the mover assembly moves the device table relative to the stage and wherein the damping assembly is coupled to the stage and reduces the reaction forces that are transferred to the stage.

125. The stage assembly of claim 124 wherein the damping assembly reduces the reaction forces that are transferred to the stage base during movement of the stage relative to the stage base.

126. The stage assembly of claim 116 wherein the mover assembly is secured to the Z reaction mass.

127. The stage assembly of claim 117 wherein the Z reaction mass moves relative to the stage base with three degrees of freedom.

128. The stage assembly of claim 118 wherein the damping assembly includes a mass guide that allows for motion of the Z reaction mass relative to the stage base.

129. The stage assembly of claim 128 wherein the mass guide includes a flexible connector that flexibly secures the Z reaction mass to a stage.

130. The stage assembly of claim 128 wherein the mass guide allows for motion of the Z reaction mass along the Z axis and inhibits motion of the Z reaction mass along the X axis relative to the stage base.

131. The stage assembly of claim 116 wherein the damping assembly includes a mass trim that adjusts the position of the Z reaction mass relative to the stage base.

132. The stage assembly of claim 131 wherein the mass trim includes at least one trim motor that is connected to the Z reaction mass and moves the Z reaction mass relative to the stage base.

133. The stage assembly of claim 131 wherein the mass trim includes a fluid bellow that is coupled to the Z reaction mass.

134. The stage assembly of claim 116 wherein the mover assembly includes a vertical mover assembly that moves the device table along the Z axis, about the X axis and about the Y axis relative to the stage base, the vertical mover assembly including a first component secured to the device table and a second component secured to the damping assembly.

135. The stage assembly of claim 134 wherein the mover assembly includes a horizontal mover assembly that moves the device table along the X axis, along the Y axis and about the Z axis relative to the stage base, the horizontal mover assembly being secured to the X reaction mass.

136. An exposure apparatus including the stage assembly of claim 116.

137. A process for manufacturing a device including the step of utilizing the exposure apparatus according to claim 136.

138. A process for making a wafer on which an image has been formed including the step of utilizing the exposure apparatus according to claim 136.

139. A stage assembly that moves a device along a Z axis, about an X axis and about a Y axis relative to a stage base, the X axis and the Y axis being substantially orthogonal to the Z axis, the stage assembly comprising:

a device table that retains the device;

a mover assembly connected to the device table, the mover assembly moving the device table along the Z axis, about the X axis and about the Y axis and generating reaction forces; and

a damping assembly coupled to the mover assembly, the damping assembly being adapted to reduce the reaction forces along the Z axis, about the X axis and about the Y axis that are transferred to the stage base, the damping assembly including a Z reaction mass that moves along the Z axis and an X reaction mass that moves along the X axis.

140. The stage assembly of claim 139 wherein the damping assembly further includes a Y reaction mass that moves along the Y axis.

141. The stage assembly of claim 140 wherein the Z reaction mass also moves at least one of about the X axis and about the Y axis.

142. The stage assembly of claim 140 wherein the mover assembly includes (i) a stage mover assembly that moves a stage relative to the stage base, the stage mover assembly being coupled to the X reaction mass and the Y reaction mass so that movement of the stage by the stage mover assembly results in movement of the X reaction mass and the Y reaction mass, and (ii) a table mover assembly that moves the device table relative to the stage, the table mover assembly being coupled to the Z reaction mass so that movement of the device table by the table mover assembly results in movement of the Z reaction mass.

143. The stage assembly of claim 140 further comprising a reaction mover assembly that adjusts the position of the X reaction mass relative to the stage base along the X axis.

144. The stage assembly of claim 143 wherein the reaction mover assembly adjusts the position of the Y reaction mass relative to the stage base along the Y axis.

145. The stage assembly of claim 139 wherein the mover assembly moves the device table with at least four degrees of freedom relative to the stage base and generates reaction forces in at least four degrees of freedom, and the damping assembly reduces the reaction forces from the mover assembly in at least four degrees of freedom that are transferred to the stage base.

146. The stage assembly of claim 139 wherein the mover assembly moves the device table with six degrees of freedom and the damping assembly is adapted to reduce the reaction forces in the six degrees of freedom that are transferred to the stage base.

147. The stage assembly of claim 139 further comprising a stage, wherein the mover assembly moves the stage relative to the stage base and the mover assembly moves the device table relative to the stage and wherein the damping assembly is coupled to the stage and reduces the reaction forces that are transferred to the stage.

148. The stage assembly of claim 147 wherein the damping assembly reduces the reaction forces that are transferred to the stage base during movement of the stage relative to the stage base.

149. The stage assembly of claim 139 wherein the mover assembly is secured to the Z reaction mass.

150. The stage assembly of claim 139 wherein the Z reaction mass moves relative to the stage base with three degrees of freedom.

151. The stage assembly of claim 139 wherein the damping assembly includes a mass guide that allows for motion of the Z reaction mass relative to the stage base.

152. The stage assembly of claim 151 wherein the mass guide includes a flexible connector that flexibly secures the Z reaction mass to a stage.

153. The stage assembly of claim 151 wherein the mass guide allows for motion of the Z reaction mass along the Z axis and inhibits motion of the Z reaction mass along the X axis relative to the stage base.

154. The stage assembly of claim 139 wherein the damping assembly includes a mass trim that adjusts the position of the Z reaction mass relative to the stage base.

155. The stage assembly of claim 154 wherein the mass trim includes at least one trim motor that is connected to the Z reaction mass and moves the Z reaction mass relative to the stage base.

156. The stage assembly of claim 154 wherein the mass trim includes a fluid bellow that is coupled to the Z reaction mass.

157. The stage assembly of claim 139 wherein the mover assembly includes a vertical mover assembly that moves the device table along the Z axis, about the X axis and about the Y axis relative to the stage base, the vertical mover assembly including a first component secured to the device table and a second component secured to the damping assembly.

158. The stage assembly of claim 157 wherein the mover assembly includes a horizontal mover assembly that moves the device table along the X axis, along the Y axis and about the Z axis relative to the stage base, the horizontal mover assembly being secured to the X reaction mass.

159. An exposure apparatus including the stage assembly of claim 139.

160. A process for manufacturing a device including the step of utilizing the exposure apparatus according to claim 159.

161. A process for making a wafer on which an image has been formed including the step of utilizing the exposure apparatus according to claim 159.

162. A method for making a stage assembly that moves a device along a Z axis, about an X axis and about a Y axis relative to a stage base, the X axis and the Y axis being substantially orthogonal to the Z axis, the method comprising the steps of:

providing a device table that retains the device;

connecting a mover assembly to the device table, the mover assembly moving the device table along the Z axis, along the X axis, along the Y axis, about the Z axis, about the X axis and about the Y axis and generating forces along the Z axis, along the X axis, along the Y axis, about the Z axis, about the X axis and about the Y axis; and

connecting a damping assembly to the mover assembly, the damping assembly including a Z reaction mass that moves along the Z axis, an X reaction mass that moves along the X axis and a Y reaction mass that moves along the Y axis, the damping assembly reducing the reaction forces along the Z axis, along the X axis, along the Y axis, about the Z axis, about the X axis and about the Y axis that are transferred to the stage base.

163. A method for making an exposure apparatus that forms an image on a substrate, the method comprising the steps of:

providing an irradiation apparatus that irradiates the substrate with radiation to form an image on the substrate; and

providing the stage assembly made by the method of claim 162.

164. A method of making a wafer utilizing the exposure apparatus made by the method of claim 163.

165. A method for making an object including at least the photolithography process, wherein the photolithography process utilizes the exposure apparatus made by the method of claim 163.

166. A stage assembly that moves a device along a Z axis, about an X axis and about a Y axis relative to a stage base, the X axis and the Y axis being substantially orthogonal to the Z axis, the stage assembly comprising:

a device table that retains the device;

a mover assembly connected to the device table, the mover assembly including a vertical mover assembly that moves the device table along the Z axis, about the X axis and about the Y axis relative to the stage base and generates reaction forces; and

a damping assembly coupled to the mover assembly, the damping assembly being adapted to reduce the reaction forces along the Z axis, about the X axis and about the Y axis that are transferred to the stage base, the vertical mover assembly including a first component coupled to the device table and a second component coupled to the damping assembly.

167. The stage assembly of claim 166 wherein the mover assembly includes a horizontal mover assembly that moves the device table along the X axis, along the Y axis and about the Z axis.

168. The stage assembly of claim 166 wherein the mover assembly moves the device table with at least four degrees of freedom relative to the stage base and generates reaction forces in at least four degrees of freedom, and the damping assembly reduces the reaction forces from the mover assembly in at least four degrees of freedom that are transferred to the stage base.

169. The stage assembly of claim 166 wherein the mover assembly moves the device table with six degrees of freedom and the damping assembly is adapted to reduce the reaction forces in the six degrees of freedom that are transferred to the stage base.

170. The stage assembly of claim 166 further comprising a stage, wherein the mover assembly moves the stage relative to the stage base and the mover assembly moves the device table relative to the stage and wherein the damping assembly is coupled to the stage and reduces the reaction forces that are transferred to the stage.

171. The stage assembly of claim 170 wherein the damping assembly reduces the reaction forces that are transferred to the stage base during movement of the stage relative to the stage base.

172. The stage assembly of claim 166 wherein the damping assembly includes a Z reaction mass that moves relative to the stage base with at least one degree of freedom and wherein the mover assembly is secured to the Z reaction mass.

173. The stage assembly of claim 172 wherein the Z reaction mass moves relative to the stage base with three degrees of freedom.

174. The stage assembly of claim 172 wherein the damping assembly includes a mass guide that allows for motion of the Z reaction mass relative to the stage base.

175. The stage assembly of claim 174 wherein the mass guide includes a flexible connector that flexibly secures the Z reaction mass to a stage.

176. The stage assembly of claim 174 wherein the mass guide allows for motion of the Z reaction mass along the Z axis and inhibits motion of the Z reaction mass along the X axis relative to the stage base.

177. The stage assembly of claim 172 wherein the damping assembly includes a mass trim that adjusts the position of the Z reaction mass relative to the stage base.

178. The stage assembly of claim 177 wherein the mass trim includes at least one trim motor that is connected to the Z reaction mass and moves the Z reaction mass relative to the stage base.

179. The stage assembly of claim 177 wherein the mass trim includes a fluid bellow that is coupled to the Z reaction mass.

180. An exposure apparatus including the stage assembly of claim 166.

181. A process for manufacturing a device including the step of utilizing the exposure apparatus according to claim 180.

182. A process for making a wafer on which an image has been formed including the step of utilizing the exposure apparatus according to claim 180.

183. A stage assembly that moves a device relative to a stage base that includes a guide surface, the stage assembly comprising:

a device table retaining the device;

a mover assembly connected to the device table, the mover assembly moving the device table along a first axis and along a second axis relative to the stage base and generating reaction forces along the first axis and along the second axis, the second axis being orthogonal to the first axis and the guide surface; and

a damping assembly coupled to the mover assembly, the damping assembly reducing the reaction forces transferred to the stage base, the damping assembly including a X reaction mass and a Z reaction mass, the X reaction mass moving along the first axis and being inhibited from moving along second axis relative to the stage base.

184. The stage assembly of claim 183 further comprising a stage and wherein the mover assembly moves the device table along the second axis relative to the stage, wherein the mover assembly moves the stage relative to the stage base, wherein the Z reaction mass reduces the reaction forces along the second axis that are transferred to the stage.

185. The stage assembly of claim 183 further comprising a stage that is moved by the mover assembly, the mover assembly also moving the device table with at least two degrees of freedom relative to the stage and generating reaction forces in at least two degrees of freedom, wherein the Z reaction mass reduces the reaction forces from the mover assembly in at least two degrees of freedom that are transferred to the stage.

186. The stage assembly of claim 183 further comprising a stage that is moved by the mover assembly, the mover assembly also moving the device table with at least three degrees of freedom relative to the stage and generating reaction forces in at least three degrees of freedom, wherein the Z reaction mass reduces the reaction forces from the mover assembly in at least three degrees of freedom that are transferred to the stage.

187. The stage assembly of claim 183 wherein the mover assembly is secured to the Z reaction mass.

188. The stage assembly of claim 183 further comprising a mass trim motor that corrects the position of the Z reaction mass along the second axis.

189. The stage assembly of claim 183 wherein the damping assembly includes a mass guide that allows for the motion of the Z reaction mass along the second axis and inhibits motion of the Z reaction mass along the first axis.

190. An exposure apparatus including the stage assembly of claim 183.

191. A process for manufacturing a device including the step of utilizing the exposure apparatus according to claim 190.

192. A process for making a wafer on which an image has been formed including the step of utilizing the exposure apparatus according to claim 190.

193. A stage assembly that moves a device along a first axis, along a second axis, and along a third axis relative to a stage base, the stage assembly comprising:

a stage;

a device table that retains the device;

a mover assembly that moves the stage relative to the stage base along the first axis and the second axis and the device table relative to the stage along the third axis and generating reaction forces along the third axis; and

a damping assembly coupled to the mover assembly, the damping assembly reducing the reaction forces along the third axis that are transferred to the stage base, the damping assembly including a Z reaction mass and a mass trim motor that adjusts the position of the Z reaction mass relative to the stage base.

194. The stage assembly of claim 193 wherein the mass trim motor corrects the position of the Z reaction mass along the third axis, about the first axis and about the second axis.

195. The stage assembly of claim 193 wherein the damping assembly includes a mass guide that allows for the motion of the Z reaction mass along the third axis and inhibits motion of the Z reaction mass along the first axis and along the second axis.

196. The stage assembly of claim 193 wherein the damping assembly includes a fluid bellow that is connected to the Z reaction mass.

197. The stage assembly of claim 193 wherein the damping assembly further includes a X reaction mass that reduces reaction forces along the first axis that are transferred to the stage base from the mover assembly.

198. The stage assembly of claim 193 wherein the mass trim motor adjusts the position of the Z reaction mass relative to the stage.

199. An exposure apparatus including the stage assembly of claim 198.

200. A process for manufacturing a device including the step of utilizing the exposure apparatus according to claim 199.

201. A process for making a wafer on which an image has been formed including the step of utilizing the exposure apparatus according to claim 199.