Printed wiring board and method of producing the same
First Claim
1. A printed circuit board constituted by alternately laminating interlayer resin insulating layers and conductive circuits on a core substrate containing a capacitor, an IC chip being mounted on an outer layer thereof whereinthe core substrate containing said capacitor is constituted by providing a first resin substrate, a second resin substrate having an opening for containing the capacitor and a third resin substrate in a multilayer manner while interposing bonding plates, the capacitor is located immediately below the IC chip, and said first resin substrate and said capacitor are coupled to each other by an insulating bonding agent and the insulating bonding agent is lower in a coefficient of thermal expansion than said first resin substrate.
1 Assignment
0 Petitions
Accused Products
Abstract
A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makesit possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 is constituted by providing a first resin substrate 30a, a second resin substrate 30b and a third resin substrate 30c in a multilayer manner, the core substrate 30 can obtain sufficient strength.
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Citations
10 Claims
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1. A printed circuit board constituted by alternately laminating interlayer resin insulating layers and conductive circuits on a core substrate containing a capacitor, an IC chip being mounted on an outer layer thereof wherein
the core substrate containing said capacitor is constituted by providing a first resin substrate, a second resin substrate having an opening for containing the capacitor and a third resin substrate in a multilayer manner while interposing bonding plates, the capacitor is located immediately below the IC chip, and said first resin substrate and said capacitor are coupled to each other by an insulating bonding agent and the insulating bonding agent is lower in a coefficient of thermal expansion than said first resin substrate.
Specification