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Printed wiring board and method of producing the same

  • US 6,724,638 B1
  • Filed: 04/25/2001
  • Issued: 04/20/2004
  • Est. Priority Date: 09/02/1999
  • Status: Expired due to Term
First Claim
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1. A printed circuit board constituted by alternately laminating interlayer resin insulating layers and conductive circuits on a core substrate containing a capacitor, an IC chip being mounted on an outer layer thereof whereinthe core substrate containing said capacitor is constituted by providing a first resin substrate, a second resin substrate having an opening for containing the capacitor and a third resin substrate in a multilayer manner while interposing bonding plates, the capacitor is located immediately below the IC chip, and said first resin substrate and said capacitor are coupled to each other by an insulating bonding agent and the insulating bonding agent is lower in a coefficient of thermal expansion than said first resin substrate.

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