Method for ensuring planarity when using a flexible, self conforming, workpiece support system

• US 6,726,195 B1
• Filed: 02/28/2002
• Issued: 04/27/2004
• Est. Priority Date: 10/13/1998
• Status: Expired due to Term

• Current Assignee: Asm Assembly Systems Singapore Pte. Ltd. (ASMPT Ltd.)
• Original Assignee: DEK Int GmbH (ASMPT Ltd.)
• Inventors: Hertz, Allen David, Hertz, Eric Lee
• Primary Examiner(s): WATSON, ROBERT C
• Assistant Examiner(s): Shanley, Daniel
• Application Number:
  US10/090,076
• Time in Patent Office: 789 Days
• Field of Search: 269/266, 269/296, 269/25, 269/309, 269/310, 269/20
• US Class Current: 269/266
• CPC Class Codes: B23Q 1/035 with an array of longitudinally movable rods defining a reconfigurable support surface
• CPC Class Codes: B25B 1/2421 the parts having a linear movement
• CPC Class Codes: H05K 13/0069 Holders for printed circuit boards
• CPC Class Codes: H05K 3/3415 on both sides of the substrate or combined with lead-in-hole components
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate

Abstract

An apparatus and accessories are disclosed for a flexible support apparatus 100, 900 using elongated support members 110 to support a face of a workpiece 10 and respective protrusions 335. The elongated support members 110 are arranged through at least one plane of perforated material 120, where the elongated support members 110 are profiled against the workpiece 10 and respective protrusions 335. The profile of the elongated support members 110 is created by contacting forces 132 generated by bringing the workpiece 330 and the plurality of elongated support members 110 together. A holding force is then applied to the elongated support members 110 to support the workpiece 10 against forces applied by a workstation. Fluid 902 is used to raise expansion members to raise the plurality of elongate support members 110. A perforated plate 920 is used to control the flow of fluid 902 between a fluid cavity 910 and the plurality of expansion members 904. Accessories to improve performance and reliability include a protective collar for protection from foreign materials 870 (solder paste) and a reinforcing member 40, 44 to reinforce thin, flexible workpieces 10.

Claims

1. A method for providing support to a printed circuit board, the method comprising the steps of:

positioning a printed circuit board over a flexible pin support, the flexible pin support comprising a plurality of elongate support members, a component which assists in profiling the plurality of elongate support members, and a mechanism to maintain the plurality of elongate support members in a profiled position while applying a force onto the printed circuit board;

positioning a planarity maintaining support member and the printed circuit board whereby the planarity maintaining support member provides a planar force to the printed circuit board that opposes a profiling force applied to the printed circuit board by the plurality of elongate support members, and

holding the plurality of elongate support members in a profiled position.

2. The method of claim 1, wherein the planarity maintaining support member used to provide a planar force is a solder stencil.

3. The method of claim 2, wherein a backing object is placed onto the solder stencil to assist in applying a planar force.

4. The method of claim 3, wherein the backing object comprises at least one solder application apparatus.

5. The method of claim 4, wherein the at least one solder application apparatus comprises at least one solder squeegee.

6. The method of claim 1, wherein the flexible pin support further comprises at least one of fluid, springs and a resistive member to provide a means for profiling the plurality of elongate support members.

7. The method of claim 1, wherein the method further comprises the step of coupling a planarity maintaining support member to the printed circuit board.

8. A method of reinforcing a printed circuit board during a profiling process of a flexible, self-conforming workpiece support apparatus, the method comprising the steps of:

positioning a printed circuit board and a reinforcing member proximate each other;

profiling a plurality of elongate support members of a flexible self-conforming workpiece support apparatus; and

holding the plurality of elongate support members to a profiled position.

9. The method of claim 8, wherein the method further comprises the step of coupling the reinforcing member to the printed circuit board.

10. The method of claim 8, wherein the method further comprises the step of holding the printed circuit board using a clamping mechanism coupled to a conveyor.

11. A method for providing support to a printed circuit board, the method comprising the steps of:

positioning a printed circuit board over a flexible pin support, the flexible pin support comprising a plurality of elongate support members, a component which assists in profiling the plurality of elongate support members, and a mechanism to maintain the plurality of elongate support members in a profiled position while applying a force onto the printed circuit board;

positioning a planarity maintaining support member and the printed circuit board whereby the planarity maintaining support member provides a planar force to the printed circuit board that opposes a profiling force applied to the printed circuit board by the plurality of elongate support members; and

,

holding the plurality of elongate support members in a profiled position; and

at least one of the following assembly processes;

1) applying solder paste to the printed circuit board,

2) applying adhesive to the printed circuit board, and

3) placing components onto the printed circuit board.

12. The method of claim 11, wherein the assembly process is at least one of applying solder paste to the printed circuit board and applying adhesive to the printed circuit board, and the planarity maintaining support member used to provide a planar force is a solder stencil.

13. The method of claim 12, wherein a backing object is placed onto the solder stencil to assist in applying a planar force.

14. The method of claim 13, wherein the backing object comprises at least one solder application apparatus.

15. The method of claim 14, wherein the at least one solder application apparatus comprises at least one solder squeegee.

16. The method of claim 11, wherein the flexible pin support further comprises at least one of fluid, springs and a resistive member to provide a means for profiling the plurality of elongate support members.

17. The method of claim 11, wherein the method further comprises the step of coupling a planarity maintaining support member to the printed circuit board.