Cutting machine

• US 6,726,526 B2
• Filed: 05/16/2002
• Issued: 04/27/2004
• Est. Priority Date: 05/30/2001
• Status: Active Grant

• Current Assignee: Disco Corporation
• Original Assignee: Disco Corporation
• Inventors: Sekiya, Kazuma, Ohmiya, Naoki
• Primary Examiner(s): Rachuba, M.
• Application Number:
  US10/145,893
• Publication Number:
  US 20020179079A1
• Time in Patent Office: 712 Days
• Field of Search: 451/5, 451/67, 451/65, 125/13.01, 125/14, 125/23.01, 834/252
• US Class Current: 451/5
• CPC Class Codes: B28D 5/0082 for supporting, holding, feeding, conveying or discharging work
• CPC Class Codes: B28D 5/029 with a plurality of cutting blades
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D

Abstract

A cutting machine includes two cutting means. In a front half of a housing, a chucking zone is located in a widthwise center. A cassette placing zone is located on one side of the chucking zone, and a cleaning zone is located on the other side of the chucking zone. In a latter half of the housing, a cutting zone is disposed in a widthwise center. Rotating shafts of the two cutting means extend straightly in a width direction in the rear half of the housing.

Claims

1. A cutting machine comprising:

a housing having an operating panel disposed on a front surface of a front half portion of the housing; and

wherein

a chucking zone located in a widthwise center, a cassette placing zone located on one side of the chucking zone, and a cleaning zone located on an opposite side of the chucking zone are arranged in the front half portion of the housing, while a cutting zone located in the widthwise center is arranged in a rear half portion of the housing;

cassette supporting means is disposed in the cassette placing zone, and cleaning means is disposed in the cleaning zone;

chuck means is disposed so as to be movable in a fore-and-aft direction between the chucking zone and the cutting zone; and

first cutting means and second cutting means are disposed in the rear half portion of the housing, the first cutting means has a first rotating shaft and a first cutting blade mounted on the first rotating shaft, the second cutting means has a second rotating shaft and a second cutting blade mounted on the second rotating shaft, the first rotating shaft and the second rotating shaft extend straightly in a width direction in the rear half portion of the housing, and the first cutting blade and the second cutting blade are mounted on a widthwise inner end of the first rotating shaft and a widthwise inner end of the second rotating shaft, respectively, and located opposite each other; and

whereby

when a cassette accommodating a plurality of workpieces is placed on the cassette supporting means, the workpieces accommodated in the cassette are sequentially delivered to the chucking zone, the delivered workpiece is chucked onto the chuck means in the chucking zone, and conveyed to the cutting zone together with the chuck means, and the workpiece on the chuck means is cut by the first cutting blade and the second cutting blade in the cutting zone, then returned to the chucking zone together with the chuck means, transported from the chucking zone to the cleaning zone, cleaned in the cleaning zone, then transported to the chucking zone, and brought into the cassette.

2. The cutting machine of claim 1, wherein temporary support means is disposed in the chucking zone, and the workpiece delivered from the cassette to the chucking zone is first placed on the temporary support means, then transported from a site on the temporary support means to a site on the chuck means, cut, cleaned, and transported from the cleaning zone to the chucking zone, whereafter the workpiece is placed onto the temporary support means, and brought into the cassette.

3. The cutting machine of claim 2, wherein the temporary support means is composed of a pair of support members, and the pair of support members are free to move between an operating position, where the support members are located at a predetermined spacing relative to each other and the workpiece is placed across the support members, and a non-operating position where the support members are moved from the operating position away from each other to allow the workpiece to descend through a gap therebetween, and when the chuck means is located in the chucking zone, the chuck means is positioned below the temporary support means.

4. The cutting machine of claim 1, wherein the workpiece is a semiconductor wafer, and the first cutting blade and the second cutting blade are shaped as disks containing diamond grains and dice the semiconductor wafer.