Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces

• US 6,726,823 B1
• Filed: 05/23/2001
• Issued: 04/27/2004
• Est. Priority Date: 11/28/1998
• Status: Expired due to Fees

• Current Assignee: ACM Research (Shanghai), Inc.
• Original Assignee: ACM Research (Shanghai), Inc.
• Inventors: Wang, Hui, Nuch, Voha, Gutman, Felix
• Primary Examiner(s): Valentine, Donald R.
• Application Number:
  US09/856,855
• Time in Patent Office: 1,070 Days
• Field of Search: 204/297.03, 204/297.14, 204/297.01, 204/224.R, 204/224.M, 205/157
• US Class Current: 205/80
• CPC Class Codes: B23H 5/08 Electrolytic grinding
• CPC Class Codes: C25D 17/001 Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
• CPC Class Codes: C25D 17/06 Suspending or supporting devices for articles to be coated
• CPC Class Codes: C25D 7/123 Semiconductors first coated with a seed layer or a conductive layer

Abstract

A wafer chuck assembly for holding a wafer during electroplating and/or electropolishing of the wafer includes a wafer chuck for receiving the wafer. The wafer chuck assembly also includes an actuator assembly for moving the wafer chuck between a first and a second position. When in the first position, the wafer chuck is opened. When in the second position, the wafer chuck is closed.

Claims

1. A wafer chuck assembly for holding a wafer comprising:

a wafer chuck having a bottom section and a spring member disposed between said bottom section and the wafer, wherein said spring member is configured to apply an electric charge to the wafer, and

actuator assembly configured to move said wafer chuck.

2. The wafer chuck assembly of claim 1, wherein said spring member contacts a portion of the outer perimeter of the wafer, such that the applied electric charge is distributed around the portion of the outer perimeter of the wafer.

3. The wafer chuck assembly of claim 1, wherein said spring member is formed from a compliant electrically conducting material.

4. The wafer chuck assembly of claim 3, wherein said spring member is a coil spring formed as a ring.

5. The wafer chuck assembly of claim 1, wherein said spring member comprises a plurality of springs formed as a ring.

6. The wafer chuck assembly of claim 1 further comprising a top section disposed above said bottom section, wherein said top section and said bottom section are configured to open to receive the wafer.

7. The wafer chuck assembly of claim 6 further comprising a conducting member disposed between said top section and said bottom section, wherein said conducting member is configured to apply an electric charge to said spring member.

8. The wafer chuck assembly of claim 7, wherein said conducting member comprises a lip portion, wherein said lip portion contacts the bottom of said spring member.

9. The wafer chuck assembly of claim 7 further comprising a compliant electrode disposed on said top section, wherein said compliant electrode is configured to apply an electric charge to said conducting member.

10. The wafer chuck assembly of claim 7 further comprising a purge line and a plurality of nozzles formed in said conducting member.

11. The wafer chuck assembly of claim 10 further comprising:

a first seal ring disposed between said top section and said conducting member; and

a second seal ring disposed between said bottom section and said conducting member.

12. The wafer chuck assembly of claim 6 further comprising a purge line and a plurality of nozzles formed in said top section.

13. The wafer chuck assembly of claim 6, wherein said actuator assembly is configured to move said wafer chuck between a first and a second position.

14. The wafer chuck assembly of claim 13, further comprising a spring assembly connected to said top section and said bottom section to open and to close said wafer chuck.

15. The wafer chuck assembly of claim 14, wherein said spring assembly opens and closes said top section and said bottom section when said wafer chuck is moved to said first position and to said second position, respectively.

16. The wafer chuck assembly of claim 14, wherein said spring assembly comprises:

a rod having a first and a second end, said first end fixed to said bottom section; and

a spring disposed between said second end of said rod and said top section.

17. The wafer chuck assembly of claim 16, wherein said spring extends to engage said top section with said bottom section when said wafer chuck is moved to said second position.

18. The wafer chuck assembly of claim 16, wherein said rod separates said top section from said bottom section and said spring is compressed between said second end of said rod and said top section when said wafer chuck is moved to said first position.

19. The wafer chuck assembly of claim 16 further comprising:

a shaft having a first and a second end, said first end fixed to said top section; and

a bracket connected to said second end of said shaft.

20. The wafer chuck assembly of claim 19, wherein said actuator assembly comprises:

a guide rail;

a lead screw connected to said bracket; and

a motor connected to said lead screw, wherein said motor turns said lead screw to move said bracket along said guide rail to move said wafer chuck between said first position and said second position.

21. The wafer chuck assembly of claim 20 further comprising a lid disposed between said top section and said bracket, said lid having a shaft hole to permit said shaft to slide relative to said lid when said wafer chuck is moved between said first position and said second position.

22. The wafer chuck assembly of claim 21, wherein said second end of said rod contacts said lid when said wafer chuck is moved to said first position to stop the movement of said bottom section while said top section continues to move relative to said bottom section by compressing said springs between said top section and said second end of said rod.

23. The wafer chuck assembly of claim 1 further comprising a seal member disposed between said bottom section and the wafer, wherein said seal member forms a seal between said bottom section and the wafer.

24. The wafer chuck assembly of claim 23, wherein said seal member has an L-shaped profile.

25. The wafer chuck assembly of claim 23, wherein said seal member has a trapezoidal profile.

26. The wafer chuck assembly of claim 23 further comprising a purge line formed in said bottom section and through said sealing member.

27. The wafer chuck assembly of claim 23, wherein said seal member is formed from a synthetic rubber.

28. The wafer chuck assembly of claim 23 further comprising a conducting member disposed within a groove formed in said seal member, wherein said spring member is disposed on top of said conducting member.

29. The wafer chuck assembly of claim 28 further comprising a purge line formed through said bottom section and through said seal member and said conducting member.

30. The wafer chuck assembly of claim 28, wherein said groove formed in said seal member has a square profile to receive said spring member.

31. A wafer chuck assembly for holding a wafer comprising:

a wafer chuck configured to open and to close; and

an actuator assembly configured to move said wafer chuck between a first and a second position, wherein said wafer chuck is open when in said first position and closed when in said second position.

32. The wafer chuck assembly of claim 31, wherein said wafer chuck comprises:

a top section; and

a bottom section having an opening to expose the surface of the wafer when held between said top section and said bottom section.

33. The wafer chuck assembly of claim 32, wherein said wafer chuck further comprises a spring member disposed between said bottom section and the wafer, wherein said spring member is configured to apply an electric charge to the wafer.

34. The wafer chuck assembly of claim 33, wherein said spring member contacts a portion of the outer perimeter of the wafer, such that the applied electric charge is distributed around the portion of the outer perimeter of the wafer.

35. The wafer chuck assembly of claim 33, wherein said spring member is a coil spring.

36. The wafer chuck assembly of claim 35, further comprising a spring holder disposed within said coil spring.

37. The wafer chuck assembly of claim 33, wherein said wafer chuck further comprises a conducting member disposed between said top section and said bottom section, wherein said conducting member is configured to apply an electric charge to said spring member.

38. The wafer chuck assembly of claim 33, wherein said wafer chuck further comprises a seal member disposed between said bottom section and the wafer, wherein said seal member forms a seal between said bottom section and the wafer.

39. The wafer chuck assembly of claim 32, further comprising a spring assembly to open and to close said wafer chuck.

40. The wafer chuck assembly of claim 39, wherein said spring assembly comprises:

a rod having a first and a second end, said first end fixed to said bottom section; and

a spring disposed between said second end of said rod and said top section.

41. The wafer chuck assembly of claim 40, wherein said rod separates said top section from said bottom section to open said wafer chuck and said spring is compressed between said second end of said rod and said top section when said wafer chuck is moved to said first position.

42. The wafer chuck assembly of claim 40, wherein said spring extends to engage said top section with said bottom section when said wafer chuck is moved to said second position.

43. The wafer chuck assembly of claim 32, wherein said wafer chuck further comprises a vacuum chamber formed between said top section and said bottom section when said wafer chuck is closed.

44. The wafer chuck assembly of claim 43, wherein said top section is configured with a vacuum line to apply a vacuum and/or a reduced pressure gas to said vacuum chamber when said wafer chuck is in said second position.

45. The wafer chuck assembly of claim 32, wherein said top section is configured with a pressure gas line.

46. The wafer chuck assembly of claim 32, wherein said top section and said bottom section are formed from a metal inner core with an outer plastic shell.

47. The wafer chuck assembly of claims 31 further comprising:

a shaft having a first and a second end, said first end coupled to said top section; and

a bracket connected to said second end of said shaft.

48. The wafer chuck assembly of claim 47, wherein said actuator assembly comprises:

a guide rail;

a lead screw connected to said bracket; and

a motor connected to said lead screw, wherein said motor turns said lead screw to move said bracket along said guide rail.

49. The wafer chuck assembly of claim 48, wherein said actuator assembly further comprises:

a second bracket connected between said first bracket and said lead screw; and

a plurality of joints disposed between said first bracket and said second bracket.

50. The wafer chuck assembly of claim 49, wherein said plurality of joints are universal joints.

51. The wafer chuck assembly of claim 47 further comprising a rotating assembly configured to rotate said wafer chuck.

52. The wafer chuck assembly of claim 51 wherein said rotating assembly rotates said wafer chuck at between about 5 revolutions per minute and about 5000 revolutions per minute.

53. The wafer chuck assembly of claim 51 wherein said rotating assembly comprises:

a drive belt connected to said shaft; and

a motor connected to said drive belt.

54. The wafer chuck assembly of claim 51 further comprising a bearing disposed between said shaft and said bracket.

55. The wafer chuck assembly of claim 51 further comprising a slip-ring assembly connected to said bracket.

56. The wafer chuck assembly of claim 55 wherein said slip-ring assembly is configured to deliver an electric charge to said shaft.

57. The wafer chuck assembly of claim 56 wherein said slip-ring assembly comprises a brush assembly configured to apply the electric charge to said shaft while said shaft is rotating.

58. The wafer chuck assembly of claim 55 wherein said slip-ring assembly is configured to deliver a vacuum and/or a reduced pressure gas and/or a pressurized gas into at least one inlet formed in said shaft.

59. The wafer chuck assembly of claim 58 wherein said slip-ring assembly comprises:

at least one inlet formed in said slip-ring assembly; and

a plurality of seals disposed between said slip-ring assembly and said shaft to form at least one sealed cavity between said inlet formed in said slip-ring and said inlet formed in said shaft.

60. A wafer chuck assembly for holding a wafer comprising:

a wafer chuck having a top section and a bottom section; and

an actuator assembly configured to move said wafer chuck between a loading position and a processing position, wherein said top section and bottom section are separated to open said wafer chuck when in said loading position, and are engaged to close said wafer chuck when in said processing position.

61. The wafer chuck assembly of claim 60 further comprising a spring assembly configured to separate and to engage said top section and bottom section.

62. The wafer chuck assembly of claim 61, wherein each of said spring assembly comprises:

a rod having a first and a second end, said first end engaged to said bottom section;

a spring disposed between said second end of said rod and said top section.

63. The wafer chuck assembly of claim 62, wherein said spring extends to engage said top section with said bottom section when said wafer chuck is moved to said processing position, and wherein said rod separates said top section from said bottom section to compress said spring between said second end of said rod and said top section when said wafer chuck is moved to said loading position.

64. The wafer chuck assembly of claim 63, wherein said wafer chuck further comprises a vacuum chamber formed between said top section and bottom section.

65. The wafer chuck assembly of claim 64, wherein said top section is configured with a vacuum line to apply a vacuum and/or a reduced pressure gas to said vacuum chamber when said wafer chuck is in said processing position.

66. The wafer chuck assembly of claim 60 further comprising:

a shaft having a first and a second end, said first end fixed to said top section; and

a bracket connected to said second end of said shaft.

67. The wafer chuck assembly of claim 66, wherein said actuator assembly comprises:

a guide rail;

a lead screw connected to said bracket;

a motor connected to said lead screw, wherein said motor turns said lead screw to move said bracket along said guide rail.

68. The wafer chuck assembly of claim 67, wherein said actuator assembly, further comprises:

a second bracket connected between said first bracket and said lead screw; and

a plurality of joints disposed between said first bracket and said second bracket.

69. The wafer chuck assembly of claim 68, wherein said plurality of joints are universal joints.

70. The wafer chuck assembly of claim 66 further comprising a rotating assembly configured to rotate said wafer chuck.

71. The wafer chuck assembly of claim 70 wherein said rotating assembly rotates said wafer chuck at between about 5 revolutions per minute and about 5000 revolutions per minute.

72. The wafer chuck assembly of claim 70 wherein said rotating assembly comprises:

a drive belt connected to said shaft; and

a motor connected to said drive belt.

73. The wafer chuck assembly of claim 70 further comprising a bearing disposed between said shaft and said bracket.

74. The wafer chuck assembly of claim 70 further comprising a slip-ring assembly.

75. The wafer chuck assembly of claim 74 wherein said slip-ring assembly is connected to said bracket.

76. The wafer chuck assembly of claim 74 wherein said slip-ring assembly is configured to deliver an electric charge to said shaft.

77. The wafer chuck assembly of claim 76 wherein said slip-ring assembly comprises a brush assembly configured to apply the electric charge to said shaft while said shaft is rotating.

78. The wafer chuck assembly of claim 74 wherein said slip-ring assembly is configured to deliver a vacuum and/or reduced pressure gas and/or a pressurized gas into at least one inlet formed in said shaft.

79. The wafer chuck assembly of claim 78 wherein said slip-ring assembly comprises:

at least one inlet formed in said slip-ring assembly;

a plurality of seals disposed between said slip-ring assembly and said shaft to form at least one sealed cavity between said inlet formed in said slip-ring and said inlet formed in said shaft.

80. A wafer chuck assembly for holding a wafer comprising:

a wafer chuck;

a spring assembly configured to open and to close said wafer chuck; and

an actuator assembly configured to move said wafer chuck between a first and a second position, wherein said spring assembly opens said wafer chuck when said wafer chuck is moved to said first position and closes said wafer chuck when said wafer chuck is moved to said second position.

81. The wafer chuck assembly of claim 80, wherein said wafer chuck comprises:

a top section; and

a bottom section having an opening to expose the surface of the wafer when held between said top section and said bottom section.

82. The wafer chuck assembly of claim 81, wherein said spring assembly comprises:

a rod having a first and a second end, said first end fixed to said bottom section; and

a spring disposed between said second end of said rod and said top section.

83. The wafer chuck assembly of claim 82 further comprising:

a shaft having a first and a second end, said first end coupled to said top section; and

a bracket connected to said second end of said shaft.

84. The wafer chuck assembly of claim 83, wherein said actuator assembly comprises:

a guide rail;

a lead screw connected to said bracket;

a motor connected to said lead screw, wherein said motor turns said lead screw to move said bracket along said guide rail.

85. The wafer chuck assembly of claim 84, wherein said actuator assembly further comprises:

a second bracket connected between said first bracket and said lead screw; and

a plurality of joints disposed between said first bracket and said second bracket.

86. The wafer chuck assembly of claim 85, wherein said plurality of joints are universal joints.

87. The wafer chuck assembly of claim 83 further comprising a lid disposed between said top section and said bracket, said lid having a shaft hole to permit said shaft to slide relative to said lid when said wafer chuck is moved between said first position and said second position.

89. The wafer chuck assembly of claim 83 further comprising a rotating assembly configured to rotate said wafer chuck.

90. The wafer chuck assembly of claim 89 wherein said rotating assembly rotates said wafer chuck at between about 5 revolutions per minute and about 5000 revolutions per minute.

91. The wafer chuck assembly of claim 89 wherein said rotating assembly comprises:

a drive belt connected to said shaft; and

a motor connected to said drive belt.

92. The wafer chuck assembly of claim 89 further comprising a bearing disposed between said shaft and said bracket.

93. The wafer chuck assembly of claim 89 further comprising a slip-ring assembly.

94. The wafer chuck assembly of claim 93 wherein said slip-ring assembly is connected to said bracket.

95. The wafer chuck assembly of claim 93 wherein said slip-ring assembly is configured to deliver an electric charge to said shaft.

96. The wafer chuck assembly of claim 95 wherein said slip-ring assembly comprises a brush assembly configured to apply the electric charge to said shaft while said shaft is rotating.

97. The wafer chuck assembly of claim 93 wherein said slip-ring assembly is configured to deliver a vacuum, reduced pressure gas, and/or a pressurized gas into at least one inlet formed in said shaft.

98. The wafer chuck assembly of claim 97 wherein said slip-ring assembly comprises:

at least one inlet formed in said slip-ring assembly;

a plurality of seals disposed between said slip-ring assembly and said shaft to form at least one sealed cavity between said inlet formed in said slip-ring and said inlet formed in said shaft.

99. The wafer chuck assembly of claim 97 wherein said shaft is formed with at least one channel to carry vacuum, reduced pressure gas, or pressurized gas from said at least one inlet in said shaft to said top section.

88. The wafer chuck assembly of cl wherein said second end of said rod contacts said lid when said wafer chuck is moved to said first position to stop the movement of said bottom section while said top section continues to move relative to said bottom section by compressing said spring between said top section and said second end of said rod.

100. An electroplating and/or electropolishing cell for electroplating and/or electropolishing a wafer in an electrolyte solution comprising:

a wafer chuck for holding the wafer;

an electrolyte receptacle for receiving the electrolyte solution; and

a wafer chuck assembly configured to move said wafer chuck between a first and a second position, wherein said wafer chuck is open when in said first position and closed when in said second position, wherein said wafer chuck is disposed within said electrolyte receptacle when in said second position.

101. The electroplating and/or electropolishing cell of claim 100, wherein said electrolyte receptacle comprises:

a first section wall; and

a second section wall, wherein said first and said second section walls divide said electrolyte receptacle into at least three sections.

102. The electroplating and/or electropolishing cell of claim 101 wherein said wafer chuck assembly positions said wafer chuck within said electrolyte receptacle such that a gap is formed between the wafer and said first and second section walls.

103. The electroplating and/or electropolishing cell of claim 102, wherein the electrolyte solution flows between said gap formed between the wafer and said first and second section walls.

104. The electroplating and/or electropolishing cell of claim 103, wherein said wafer chuck assembly positions the wafer level relative to the surface of the electrolyte solution.

105. The electroplating and/or electropolishing cell of claim 104, wherein said wafer chuck assembly further comprises a plurality of adjustment screws for adjusting the orientation of said wafer chuck relative to the surface of the electrolyte solution.

106. The electroplating and/or electropolishing cell of claim 100, wherein said wafer chuck comprises:

a top section; and

a bottom section having an opening to expose the surface of the wafer when held between said top section and said bottom section.

107. The electroplating and/or electropolishing cell of claim 106, wherein said wafer chuck further comprises a spring member disposed between said bottom section and the wafer, wherein said spring member is configured to apply an electric charge to the wafer.

108. The electroplating and/or electropolishing cell of claim 107, wherein said spring member contacts a portion of the outer perimeter of the wafer, such that the applied electric charge is distributed around the portion of the outer perimeter of the wafer.

109. The electroplating and/or electropolishing cell of claim 107, wherein said wafer chuck further comprises a conducting member disposed between said top section and said bottom section, wherein said conducting member is configured to apply an electric charge to said spring member.

110. The electroplating and/or electropolishing cell of claim 109, wherein said wafer chuck further comprises a seal member disposed between said bottom section and the wafer, wherein said seal member forms a seal between said bottom section and the wafer to isolate said spring member and said conducting member from the electrolyte solution.

111. The electroplating and/or electropolishing cell of claim 106, wherein said wafer chuck assembly further comprises a spring assembly configured to open and to close said wafer chuck.

112. The electroplating and/or electropolishing cell of claim 111, wherein said spring assembly comprises:

a rod having a first and a second end, said first end engaged to said bottom section; and

a spring disposed between said second end of said rod and said top section.

113. The electroplating and/or electropolishing cell of claim 112, wherein said rod separates said top section from said bottom section and said spring is compressed between said second end of said rod and said top section when said wafer chuck is moved to said first position.

114. The electroplating and/or electropolishing cell of claim 112, wherein said spring extends to engage said top section with said bottom section when said wafer chuck is moved to said second position.

115. The electroplating and/or electropolishing cell of claim 106, wherein said wafer chuck assembly further comprises:

a shaft having a first and a second end, said first end fixed to said top section;

a bracket connected to said second end of said shaft; and

an actuator assembly connected to said bracket for moving said wafer chuck between said first and said second position.

116. The electroplating and/or electropolishing cell of claim 115, wherein said actuator assembly comprises:

a guide rail;

a lead screw connected to said bracket; and

a motor connected to said lead screw, wherein said motor turns said lead screw to move said bracket along said guide rail.

117. The electroplating and/or electropolishing cell of claim 115, wherein said wafer chuck assembly further comprises a rotating assembly configured to rotate said wafer chuck.

118. The electroplating and/or electropolishing cell of claim 117, wherein said rotating assembly comprises:

a drive belt connected to said shaft; and

a motor connected to said drive belt.

119. The electroplating and/or electropolishing cell of claim 117, further comprising a slip-ring assembly connected to said bracket, wherein said shaft rotates within said slip-ring assembly.

120. The electroplating and/or electropolishing cell of claim 119, wherein said slip-ring assembly is configured to deliver an electric charge to said shaft.

121. The electroplating and/or electropolishing cell of claim 120, wherein said slip-ring assembly comprises a brush assembly configured to apply the electric charge to said shaft while said shaft is rotating.

122. The electroplating and/or electropolishing cell of claim 119, wherein said slip-ring assembly is configured to deliver a vacuum, reduced pressure gas, and/or pressurized gas into at least one inlet formed in said shaft.

123. The electroplating and/or electropolishing cell of claim 122, wherein said slip ring assembly comprises:

at least one inlet formed in said slip-ring assembly;

a plurality of seals disposed between said slip-ring assembly and said shaft to form at least one scaled cavity between said inlet formed in said slip-ring assembly and said inlet formed in said shaft.

124. The electroplating and/or electropolishing cell of claim 119, further comprising a first adjustment assembly configured to adjust the orientation of said bracket to slip-ring assembly.

125. The electroplating and/or electropolishing cell of claim 124, wherein the orientation of said bracket to said slip-ring is perpendicular.

126. The electroplating and/or electropolishing cell of claim 124, wherein said first adjustment assembly comprises:

a plurality of set screws; and

a plurality of adjustment screws.

127. The electroplating and/or electropolishing cell of claim 124, further comprising a second adjustment assembly configured to adjust the orientation of said shaft to said top section.

128. The electroplating and/or electropolishing cell of claim 127, wherein the orientation aid shaft to said top section perpendicular.

129. The electroplating and/or electropolishing cell of claim 128, wherein the centers lines of said top section, said shaft, and said slip-ring assembly are centered and co-axial.

130. The electroplating and/or electropolishing cell of claim 127, wherein said

second adjustment assembly comprises:

a set screw connecting said top section to said shaft, said set screw disposed at die center of said top section and said shaft; and

a plurality of adjustment screws connecting said top section to said shaft said plurality of adjustment screws disposed around said set screw.

131. The electroplating and/or electropolishing station of claim 106, wherein said wafer chuck further comprises a textured pad attached to said top section.

132. An electroplating and/or electropolishing station for electroplating and/or electropolishing a wafer comprising:

a frame;

at least one electroplating and/or electropolishing cell attached to said frame, said electroplating and/or electropolishing cell having an electrolyte solution receptacle and a lid suitably formed to cover said electrolyte solution receptacle; and

a lid retraction assembly configured to move said lid between a first position and a second position, wherein said lid covers said electrolyte receptacle when in said first position and said lid is retracted from said electrolyte solution receptacle when in said second position.

133. The electroplating and/or electropolishing station of claim 132, wherein said electroplating and/or electropolishing cell further comprises:

a wafer chuck for holding the wafer; and

a wafer chuck assembly for moving said wafer chuck between a first and a second position when said lid is in said first position.

134. The electroplating and/or electropolishing station of claim 133, wherein said wafer chuck assembly opens said wafer chuck when said wafer chuck is in said first position and closes said wafer chuck when said wafer chuck is in said second position.

135. The electroplating and/or electropolishing station of claim 132 further comprising at least two electroplating and/or electropolishing cells.

136. The electroplating and/or electropolishing station of claim 135, wherein said at least two electroplating and/or electropolishing cells are stacked vertically on said frame.

137. The electroplating and/or electropolishing station of claim 132, wherein said lid retraction assembly comprises:

a guide rail attached to said lid and said frame; and

an actuator attached to said guide rail configured to move said lid between said first and said second position.

138. The electroplating and/or electropolishing station of claim 135, wherein said actuator is an air cylinder.

139. A method of holding a wafer during electroplating and/or electropolishing of the wafer, said method comprising:

providing the wafer within a wafer chuck;

moving the wafer chuck using said wafer chuck assembly between a first position and a second position, wherein said wafer chuck is open when in said first position and closed when in said second position, wherein said wafer chuck is disposed within an electrolyte solution receptacle when in said second position.

140. The method of claim 139 further comprising:

applying an electrolyte solution to the wafer when said wafer chuck is in said second position; and

applying an electric charge to the wafer when said wafer chuck is in said second position, wherein the charge is distributed around a portion of the outer perimeter of the wafer.

141. The method of claim 140, wherein said applying step further comprises the step of applying an electric charge to a compliant electrically conducting material, wherein said compliant electrically conducting material distributes the electric charge around the outer perimeter of the wafer.

142. The method of claim 141, wherein said spring member comprises a coil spring.

143. The method of claim 141, wherein said spring member comprises a plurality of coil springs.

144. The method of claim 141 further comprising the stop of sealing said complaint electrically conducting material from the electrolyte solution using a seal member prior to moving said wafer chuck to said second position.

145. The method of claim 144 further comprising the step of checking for leaks in the seal formed by said seal member prior to moving said wafer chuck to said second position.

146. The method of claim 144 further comprising the step of moving the wafer chuck to said-first position after applying said charge to electroplate and/or electropolish the wafer.

147. The method of claim 146 further comprising the step of injecting a dry gas to remove residual electrolyte solution from the wafer chuck after moving said wafer chuck to said first position.

148. The method of claim 146 further comprising the steps of:

opening the wafer chuck to remove the wafer using said wafer chuck assembly; and

removing the wafer from the wafer chuck.

149. The method of claim 148 further comprising the step of injecting a dry gas to remove residual electrolyte solution from the wafer chuck after removing the wafer from the wafer chuck.

150. The method of claim 141 further comprising the step of rotating the wafer chuck using said wafer chuck assembly.