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Methods for fabricating inductor for integrated circuit or integrated circuit package

  • US 6,727,154 B2
  • Filed: 09/10/2002
  • Issued: 04/27/2004
  • Est. Priority Date: 11/23/1999
  • Status: Expired due to Term
First Claim
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1. A method comprising:

  • forming a first dielectric layer in a manner that varies in the Z-dimension; and

    forming a first conductive layer over the first dielectric layer, the first conductive layer also varying in the Z-dimension, the first conductive layer having a length and a width, the length being substantially greater than the width, the first conductive layer being arranged in a substantially straight line along the X-dimension, and the first conductive layer comprising upper segments and lower segments, the upper segments being longer than the lower segments.

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