Integrated inductive circuits
First Claim
Patent Images
1. An integrated circuit comprising:
- a substrate;
an integrated inductor formed over a first side of said substrate;
an aperture formed in said substrate from a second side of said substrate underneath said inductor; and
a dielectric material formed in said aperture such that the material directly underneath said inductor is entirely a dielectric material.
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Abstract
An integrated inductor may be formed over a substrate. An aperture may be formed by a backside etch through the semiconductor substrate underneath the integrated inductor. The aperture may then be filled with a dielectric material. As a result of the removal of the underlying substrate material, magnetic and capacitive coupling of the inductor to the substrate may be reduced. In addition, in some cases, the presence of the dielectric may facilitate attachment of the resulting die to a leadframe and package without degrading the inductor'"'"'s performance and may provide better structural support.
7 Citations
13 Claims
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1. An integrated circuit comprising:
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a substrate;
an integrated inductor formed over a first side of said substrate;
an aperture formed in said substrate from a second side of said substrate underneath said inductor; and
a dielectric material formed in said aperture such that the material directly underneath said inductor is entirely a dielectric material. - View Dependent Claims (2, 3, 4, 5)
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6. An integrated circuit comprising:
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a substrate;
an inductor formed over a first side of said substrate;
an aperture formed in said substrate from a second side of said substrate underneath said inductor and extending completely through said substrate from said second side of said substrate to said first side of said substrate;
a dielectric material filling said aperture;
a dielectric material also coating the back side of said substrate; and
an intervening layer between said inductor and said substrate. - View Dependent Claims (7, 8)
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9. An integrated circuit comprising:
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a semiconductor substrate;
a dielectric layer over said substrate;
an inductor formed over a first side of said substrate over said dielectric layer;
an aperture in said substrate directly underneath said inductor and extending completely through said substrate from said second side of said substrate to said first side of said substrate; and
a dielectric filling said aperture such that the material beneath said inductor is all dielectric material. - View Dependent Claims (10, 11, 12, 13)
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Specification