Probe card

• US 6,727,714 B2
• Filed: 08/22/2002
• Issued: 04/27/2004
• Est. Priority Date: 09/27/2001
• Status: Expired due to Term

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: Renesas Technology Corporation (Renesas Electronics Corporation)
• Inventors: Deguchi, Yoshinori
• Primary Examiner(s): Zarneke, David A.
• Assistant Examiner(s): Nguyen, Tung X.
• Application Number:
  US10/225,193
• Publication Number:
  US 20030057976A1
• Time in Patent Office: 614 Days
• Field of Search: 324/754, 324/761, 324/758, 324/757, 324/756, 324/158.1, 324/762
• US Class Current: 324/750.25
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Abstract

A probe card has an offset substrate electrically connected between a probe card substrate and an interposer substrate with solders. It is possible to secure the thickness of the interposer substrate plus the thickness of the offset substrate for the depth of the positioning holes of the probe needles, which results in the improved positioning accuracy of the probe needle.

Claims

1. A probe card comprising:

a probe card substrate;

an offset substrate electrically connected to the probe card substrate;

an interposer substrate electrically connected to the offset substrate;

a probe needle formed so that it is electrical contact with the interposer substrate; and

a probe needle positioning member for positioning and fixing the probe needle so that the probe needle is in electric contact with the interposer substrate, said probe needle positioning member comprising;

a stiffener for supporting the probe card substrate, said stiffener having a recess to receive said offset substrate and interposer substrate, and positioning holes provided around the recess for positioning the probe needle; and

positioning pins each inserted into the respective positioning holes to secure the probe needle, wherein

the depth of said positioning member is not smaller than the total thickness of the offset substrate and interposer substrate.

2. The probe card according to claim 1, wherein resin is stuffed between the offset substrate and the interposer substrate.

3. The probe card according to claim 1, wherein the total thickness of the offset substrate and interposer substrate is 1.2 mm or more.