Electronic component package, printed circuit board, and method of inspecting the printed circuit board

• US 6,727,718 B2
• Filed: 11/19/2002
• Issued: 04/27/2004
• Est. Priority Date: 03/11/1998
• Status: Expired due to Fees

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Iimura, Hiroshi, Kogure, Seiji, Arase, Fumio, Ichihara, Yasuhiro
• Primary Examiner(s): PERT, EVAN T
• Application Number:
  US10/298,640
• Publication Number:
  US 20030063448A1
• Time in Patent Office: 525 Days
• Field of Search: 324/754, 324/755, 324/757, 324/765, 438/17, 174/260, 174/261, 174/255, 361/767-771, 257/730, 257/737, 257/738
• US Class Current: 361/318
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 2201/10969 Metallic case or integral heatsink of component electrically connected to a pad on PCB
• CPC Class Codes: H05K 2201/2018 Presence of a frame in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A ball grid array (BGA) electronic component package having a configuration which is capable of improving mounting efficiency as well as preventing footprints from breaking away at circuit-connecting portions of the electronic component package. The BGA package has reinforcing bumps formed in an area located outward of a predetermined area in which conventional circuit-connecting bumps are arranged. Therefore, even if a shock is applied to the BGA package at the outer or peripheral portion of the BGA package, which is most sensitive to such a shock, the shock is absorbed by the reinforcing bumps and reinforcing footprints which have no electrical connection with the circuitry of the electronic component package. Thus, the footprints formed on a mounting portion of the BGA package and those formed on the printed circuit board can be prevented from breaking away or being cracked.

Claims

1. An electronic component package of ball grid array type, comprising:

a plurality of circuit-connecting bumps formed in a predetermined area, and at least one reinforcing bump formed in an area located outward of said predetermined area, in a manner such that said at least one reinforcing bump is connectable to at least one reinforcing pattern formed on a printed circuit board, wherein a plurality of said reinforcing bumps are formed on a single pattern.

2. An electronic component package according to claim 1, wherein said at least one reinforcing bump is formed in at least one corner of said electronic component package.

3. An electronic component package according to claim 1, wherein said at least one reinforcing bump is formed along at least one side of said electronic component package.

4. An electronic component package according to claim 1, including a body having a corner, an area for said at least one reinforcing bump is formed in a manner of projecting from an end face of said corner.