Please download the dossier by clicking on the dossier button x
×

Test system and manufacturing of semiconductor device

  • US 6,727,723 B2
  • Filed: 05/08/2002
  • Issued: 04/27/2004
  • Est. Priority Date: 11/19/1999
  • Status: Expired due to Fees
First Claim
Patent Images

1. A method of manufacturing a semiconductor integrated circuit device, comprising the following steps of:

  • forming a plurality of semiconductor chips each having a desired function on a semiconductor wafer;

    placing a test circuit connected to needles and operated in accordance with a program to test said each semiconductor chip, on a probe substrate having a size corresponding to the semiconductor wafer and having the conductive needles formed thereon in alignment with the placement of electrode pads on the semiconductor chips;

    superimposing the probe substrate on the semiconductor wafer in such a manner that the needles are brought into contact with the corresponding electrode pads of the semiconductor chips;

    testing said each semiconductor chip by the test circuit; and

    selecting a semiconductor chip judged to be non-defective, as a product according to the test.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×