Test system and manufacturing of semiconductor device
First Claim
Patent Images
1. A method of manufacturing a semiconductor integrated circuit device, comprising the following steps of:
- forming a plurality of semiconductor chips each having a desired function on a semiconductor wafer;
placing a test circuit connected to needles and operated in accordance with a program to test said each semiconductor chip, on a probe substrate having a size corresponding to the semiconductor wafer and having the conductive needles formed thereon in alignment with the placement of electrode pads on the semiconductor chips;
superimposing the probe substrate on the semiconductor wafer in such a manner that the needles are brought into contact with the corresponding electrode pads of the semiconductor chips;
testing said each semiconductor chip by the test circuit; and
selecting a semiconductor chip judged to be non-defective, as a product according to the test.
2 Assignments
0 Petitions
Accused Products
Abstract
A test circuit is provided on a probe card or a wafer on which semiconductor chips to be tested are formed. The test circuit and each of the semiconductor chips to be tested are electrically connected to each other to perform testing, whereby the test can be carried out without using a tester. Conducting a test in such a wafer stage within an aging device allows the simplification or omission of a test subsequent to packaging.
-
Citations
15 Claims
-
1. A method of manufacturing a semiconductor integrated circuit device, comprising the following steps of:
-
forming a plurality of semiconductor chips each having a desired function on a semiconductor wafer;
placing a test circuit connected to needles and operated in accordance with a program to test said each semiconductor chip, on a probe substrate having a size corresponding to the semiconductor wafer and having the conductive needles formed thereon in alignment with the placement of electrode pads on the semiconductor chips;
superimposing the probe substrate on the semiconductor wafer in such a manner that the needles are brought into contact with the corresponding electrode pads of the semiconductor chips;
testing said each semiconductor chip by the test circuit; and
selecting a semiconductor chip judged to be non-defective, as a product according to the test. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A method of manufacturing a semiconductor integrated circuit device, comprising the following steps of:
-
forming a test circuit module which is operated in accordance with a program and tests each of a plurality of semiconductor chips, on a semiconductor wafer on which said plurality of semiconductor chips are formed;
supplying a source voltage to at least said test circuit module from the outside to thereby test said each semiconductor chip on the semiconductor wafer by said test circuit module; and
selecting the semiconductor chip judged to be non-defective by said test, as a product. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
describing the function of said each semiconductor chip to be tested in hardware description language, inputting the hardware description and a test program to a hardware emulator, and simulating the same by the hardware emulator, thereby performing verification thereof;
thereafter converting the hardware description to design data of a logic gate level and generating layout design data of a device level for said each tested semiconductor chip, based on the design data;
extracting a test function, based on the data used in the simulation, describing the test function in hardware description language, converting the description to design data of a logic gate level, and generating layout design data of a device level of said test circuit module, based on the design data;
fabricating a wafer mask by using the layout design data of the device level for said each tested semiconductor chip and the layout design data of the device level for the test circuit module; and
forming said tested semiconductor chip and said test circuit module on one wafer by using the mask.
-
-
14. The method according to claim 8, wherein said test circuit module generates test signals supplied to a plurality of the semiconductor chips placed therearound.
-
15. The method according to claim 8, wherein said test circuit module tests the plurality of semiconductor chips on the semiconductor wafer.
Specification