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Method and apparatus for non-conductively interconnecting integrated circuits

  • US 6,728,113 B1
  • Filed: 06/24/1993
  • Issued: 04/27/2004
  • Est. Priority Date: 06/24/1993
  • Status: Active Grant
First Claim
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1. A modular electronic system comprising:

  • a substrate;

    a ground plane in said substrate;

    a semiconductor chip;

    means for powering said chip;

    means for capacitively signalling between said chip and said substrate; and

    signal leads connected on said substrate and said chip to said means for capacitively signalling.

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