Methods and devices for sealing microchip reservoir devices
First Claim
1. A microchip device for the release or exposure of molecules or devices, comprising:
- a substrate having a front side, a back side, and at least two reservoirs which contain said molecules or devices, the reservoirs having reservoir openings on the back side of the substrate;
a reservoir cap positioned on the front side of the substrate on each reservoir over the molecules or devices, wherein release or exposure of the molecules or devices from the reservoir is controlled by diffusion through or disintegration of the reservoir cap;
a gasket material positioned over the reservoir openings; and
one or more backplates secured over the gasket material to compress the gasket material to the back side of the microchip device to seal the reservoir openings.
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Accused Products
Abstract
Methods and devices are provided for mechanically sealing the reservoirs of microchip devices to prevent leakage from or between any of the reservoirs. In one embodiment, the method includes sandwiching a microchip device and a gasket material covering the reservoir openings between a front sealing frame and a backplate, such that the gasket material is compressed against the back side of the microchip device by the back plate. The front sealing frame is secured to the back sealing plate using fasteners or welding. The gasket material is preferably a flexible polymeric sheet, which is biocompatible and compatible with the reservoir contents. In another embodiment, a composite backplate is used in place of the back sealing plate and separate gasket material. The composite backplate can include a substrate having sealing plugs defined thereon. The composite backplate also can be designed to hold the drug, thereby combining the assembly steps of reservoir filling and sealing.
188 Citations
25 Claims
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1. A microchip device for the release or exposure of molecules or devices, comprising:
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a substrate having a front side, a back side, and at least two reservoirs which contain said molecules or devices, the reservoirs having reservoir openings on the back side of the substrate;
a reservoir cap positioned on the front side of the substrate on each reservoir over the molecules or devices, wherein release or exposure of the molecules or devices from the reservoir is controlled by diffusion through or disintegration of the reservoir cap;
a gasket material positioned over the reservoir openings; and
one or more backplates secured over the gasket material to compress the gasket material to the back side of the microchip device to seal the reservoir openings. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 13)
providing at a site where the molecules or devices are to be delivered the microchip device of claim 1, and controlling the release or exposure of the molecules or devices from the reservoir by diffusion through or disintegration of the reservoir cap.
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12. A microchip device for the release or exposure of molecules or devices, comprising:
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a substrate having a front side, a back side, and at least two reservoirs which contain said molecules or devices, the reservoirs having reservoir openings on the back side of the substrate;
a reservoir cap positioned on the front side of the substrate on each reservoir over the molecules or devices, wherein release or exposure of the molecules or devices from the reservoir is controlled by diffusion through or disintegration of the reservoir cap;
one or more backplates secured to the back side of the microchip device; and
a barrier layer positioned between the backplates and the molecules or devices, wherein the backplates and barrier layer cooperate to seal the reservoir openings.
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14. A method for sealing reservoirs containing molecules or devices in a microchip device, the method comprising:
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providing a microchip device having a front side and a back side, wherein the back side has a plurality of reservoir openings in need of sealing;
positioning a gasket material over the reservoir openings; and
securing one or more backplates over the gasket material to compress the gasket material to the back side of the microchip device so as to seal the reservoir openings. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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Specification