Single wafer megasonic cleaner method, system, and apparatus

• US 6,730,176 B2
• Filed: 02/20/2002
• Issued: 05/04/2004
• Est. Priority Date: 07/09/2001
• Status: Active Grant

• Current Assignee: Birol Kuyel
• Original Assignee: Birol Kuyel
• Inventors: Kuyel, Birol
• Primary Examiner(s): EL-Arini, Zeinab
• Application Number:
  US10/079,208
• Publication Number:
  US 20030010356A1
• Time in Patent Office: 804 Days
• Field of Search: 134/1, 134/1.3, 134/32, 134/33, 134/902
• US Class Current: 134/1
• CPC Class Codes: B08B 2203/0288 Ultra or megasonic jets
• CPC Class Codes: B08B 3/02 Cleaning by the force of jets or sprays
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles
• CPC Class Codes: Y10S 134/902 Semiconductor wafer

Abstract

The present invention is directed to a method, system, and apparatus for applying megasonic energy to the surface of a workpiece for the removal of contaminants. A nozzle dispenses a stream of deionized water or other cleaning fluid at a radial position on the surface. A stepping motor moves the arm over the surface, in a step-wise manner, allowing megasonic energy to be applied in a uniform manner. The workpiece is rotated at low speeds to provide a more uniform application. Chemical solutions may optionally be added to dissolve contaminants or change the Zeta potential of the contaminants to make particles easier to detach and suspend. A high-RPM dry spin cycle further removes cleaning fluid and suspended contaminants, preventing them from reattaching. The present invention is compatible with numerous types of workpieces including 12″ semiconductor wafers.

Claims

1. A method for removing contaminants from the surface of a workpiece comprising the steps of:

rotating the workpiece about an axis, at a low angular velocity;

directing a stream of cleaning fluid, having megasonic energy, at a surface of the workpiece, such that said stream of cleaning fluid delivers substantially uniform megasonic energy to all points on the surface of the workpiece, and

then rotating the workpiece at a high angular velocity until the surface of the workpiece is dry of cleaning fluids.

2. The method of claim 1, wherein said low angular velocity is between 200 and 500 revolutions per minute.

3. The method of claim 1, wherein said high angular velocity is 3500 revolutions per minute or higher.

4. The method of claim 1, wherein said cleaning fluid comprises deionized water.

5. The method of claim 4, wherein said deionized water is ozonated.

6. The method of claim 1, wherein said cleaning fluid comprises acid.

7. The method of claim 1, wherein said cleaning fluid comprises one or more surfactants.

8. The method of claim 1, wherein said cleaning fluid is operable to alter the Zeta potential of one or more of the contaminants and the surface of the workpiece to increase the repulsion between said one or more contaminants and the workpiece.

9. The method of claim 1, further comprising the step of delivering a cleaning fluid to the workpiece while the workpiece is rotating at a low angular velocity.

10. The method of claim 1, further comprising the step of delivering a drying fluid to the workpiece while the workpiece is rotating at a high angular velocity.

11. The method of claim 1, wherein the workpiece is a semiconductor wafer.

12. A method for removing contaminants from the surface of a workpiece comprising the steps of:

rotating the workpiece about an axis, at a low angular velocity;

directing a stream of cleaning fluid, wherein the stream of cleaning fluid comprises megasonic energy, through a nozzle at a surface of the workpiece, while moving the nozzle over the workpiece such that said stream of cleaning fluid delivers substantially uniform megasonic energy to all points on the surface of the workpiece; and

then rotating the workpiece at a high angular velocity until the surface of the workpiece is dry of cleaning fluids.

13. The method of claim 12, wherein the step of moving the nozzle over the workpiece further comprises moving the nozzle over the workpiece in a stepwise manner.

14. The method of claim 13, wherein the step of moving the nozzle over the workpiece in a stepwise manner comprises stopping the nozzle over each of a plurality of radial strips of the workpiece for an amount of time proportional to each strip'"'"'s radial distance.

15. The method of claim 12, wherein the step of directing a stream of cleaning fluid further comprises directing said stream of cleaning fluid at an optimal angle to the surface of the workpiece.

16. The method of claim 15, wherein the optimal angle is between 60 and 70 degrees with respect to the surface of the workpiece.

17. The method of claim 12, wherein the nozzle is maintained at a fixed distance from the surface of the workpiece during the step of moving the nozzle over the workpiece.

18. The method of claim 17, wherein the fixed distance is approximately 12 mm.

19. A method for removing contaminants from a workpiece having a top surface and a bottom surface, comprising the steps of:

rotating the workpiece at a low angular velocity;

directing a first stream of cleaning fluid, wherein the first stream of cleaning fluid comprises megasonic energy, through a first nozzle at the top surface of the workpiece, while moving the first nozzle transversely over said top surface such that said first stream of cleaning fluid delivers substantially uniform megasonic energy to all points on the top surface, wherein at least a portion of the megasonic energy delivered to the top surface propagates to the bottom surface;

directing a second stream of cleaning fluid at the bottom surface of the workpiece; and

then rotating the workpiece at a high angular velocity until the workpiece is dry of cleaning fluids.

20. The method of claim 19, wherein the second steam of cleaning fluid comprises deionized water.

21. A method for cleaning contaminants from the surface of a workpiece, comprising the steps of:

providing a megasonic cleaning stream by applying megasonic energy to at least one stream of cleaning fluid;

directing at an optimal angle said at least one megasonic cleaning stream to the surface of the workpiece;

rotating the workpiece at a low angular velocity sufficient to maintain a uniform laminar flow profile of the megasonic cleaning stream on the surface of the workpiece; and

moving said megasonic cleaning stream over the workpiece such that a substantially uniform amount of megasonic energy is delivered to each point on the workpiece.

22. The method of claim 21, further comprising the step of rotating the workpiece at a high angular velocity until the workpiece is dry of cleaning fluids.

23. A method for cleaning contaminants from the surface of a workpiece, comprising the steps of:

providing a megasonic cleaning stream by applying megasonic energy to at least one stream of cleaning fluid;

directing at an angle between 60 and 70 degrees said at least one megasonic cleaning stream to the surface of the workpiece;

rotating the workpiece at a low angular velocity sufficient to maintain a uniform laminar flow profile of the megasonic cleaning stream on the surface of the workpiece; and

moving said megasonic cleaning stream over the workpiece such that a substantially uniform amount of megasonic energy is delivered to each point on the workpiece.

24. A method for cleaning contaminants from the surface of a workpiece, comprising the steps of:

providing a megasonic cleaning stream by applying megasonic energy to at least one stream of cleaning fluid;

rotating the workpiece at a low angular velocity sufficient to maintain a uniform laminar flow profile of the megasonic cleaning stream on the surface of the workpiece; and

moving said megasonic cleaning stream over the workpiece such that a substantially uniform amount of megasonic energy is delivered to each point on the workpiece, wherein said moving includes directing said stream at each, in turn, of a selected plurality of radii of said workpiece for a selected period of time, each period of time being selected in order to achieve substantially uniform distribution of megasonic energy to each point on the workpiece.