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Stereolithographic patterning with interlayer surface modifications

  • US 6,730,256 B1
  • Filed: 08/06/2001
  • Issued: 05/04/2004
  • Est. Priority Date: 08/04/2000
  • Status: Expired due to Fees
First Claim
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1. A method for patterning a multilayer resist comprising:

  • depositing a first layer of photoresist material from a first solution onto a substrate;

    exposing a portion of the first layer to radiant energy;

    treating the first layer to create a treated surface;

    depositing a second layer of photoresist material from a second solution, the second layer located atop the treated surface, the treated surface capable of inhibiting penetration of a solvent component of the second solution into the first layer; and

    exposing a portion of the second layer to radiant energy.

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